IP Library Granted Patent US 10,096,344
Granted Patent B2
US 10,096,344 · App. 15/849,733 · Granted Oct 9, 2018

Holding frame for electronic device

Inventors: Shinichirou Okamoto (Yokohama, JP); Shinichirou Kouno (Machida, JP); Satoru Yamada (Kawasaki, JP); Atsushi Yamaguchi (Kawasaki, JP)
Assignee: FUJITSU LIMITED
G11B33/08H05K7/14H05K7/18G06F1/187G11B33/124
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Quick Facts
Patent No.
US 10,096,344
App. No.
15/849,733
Granted
Oct 9, 2018
Kind
B2
Abstract

A holding frame for an electronic device that is to be inserted and extracted into and from a pair of grooves formed in a chassis so as to face each other, the holding frame includes a pair of plates that are parallel to each other and that form portions of the holding frame, the portions extending along the grooves, three protrusions that are arranged along the grooves and that protrude from the plates toward the grooves, and two support portions that are arranged at portions of the holding frame each of which corresponds to a center portion between a corresponding two of the three protrusions, the two support portions supporting the electronic device between the plates and the electronic device.

Claims (14)

1. A holding frame for an electronic device that is to be inserted and extracted into and from a pair of grooves formed in a chassis so as to face each other, the holding frame comprising:

a pair of plates that are parallel to each other and that form portions of the holding frame, the portions extending along the grooves;

three protrusions that are arranged along the grooves and that protrude from each of the plates toward the grooves;

and two support portions that are arranged at portions of the holding frame each of which corresponds to a center portion between a corresponding two of the three protrusions, the two support portions supporting the electronic device between the plates and the electronic device,

wherein two first protrusions among the three protrusions that are positioned at opposite ends each have a height obtained by subtracting a dimension of a gap between one of the plates and the electronic device, the gap being defined by the support portions, and a thickness dimension of each of the plates from a dimension of a gap between one of the grooves and the electronic device,

wherein a second protrusion among the three protrusions that is located between the two first protrusions has a height larger than the height of each of the first protrusions, and

wherein the dimension of the gap between the one of the plates and the electronic device, which is defined by the support portions, is larger than a dimension obtained by subtracting the height of one of the first protrusions from the height of the second protrusion.

2. The holding frame for an electronic device according to claim 1 ,

wherein the electronic device includes a connector that is disposed on a side on which the electronic device is to be inserted into the chassis, and

wherein the second protrusion is positioned so as to be closer to the connector than the center portion between the two first protrusions is.

3. The holding frame for an electronic device according to claim 1 ,

wherein the two support portions are protrusions that protrude from the plates toward the electronic device.

4. The holding frame for an electronic device according to claim 1 ,

wherein the electronic device is a hard disk device.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 2, 2018
From: OKAMOTO, SHINICHIROU; KOUNO, SHINICHIROU; YAMADA, SATORU; YAMAGUCHI, ATSUSHI
To: FUJITSU LIMITED
Reel/Frame 044980/0196 →
Priority Claims (1)
JP 2017-002856 · Jan 11, 2017 · national
Continuity (1)
Related Publication 20180197580A1 · Jul 12, 2018
Cited By (1)
US 12,189,440