Face-to-face semiconductor assembly having semiconductor device in dielectric recess
A face-to-face semiconductor assembly is characterized by a semiconductor device positioned in a dielectric recess of a core base and surrounded by an array of metal posts. The recess in the core provides lateral displacement control between the device and the metal posts, and the minimal height of the metal posts needed for the vertical connection between both opposite sides of the core base can be reduced by the amount equal to the depth of the recess. Further, the semiconductor device is face-to-face electrically coupled to another semiconductor device through a buildup circuitry therebetween.
1. A thermally enhanced face-to-face semiconductor assembly, comprising:
a core base that includes a dielectric layer, a resin sealant layer, an array of metal posts, an array of metallized vias and a metal paddle, wherein (i) the dielectric layer has a recess extending from a top surface of the dielectric layer, (ii) the resin sealant layer is disposed over the top surface of the dielectric layer, (iii) the metal posts are disposed in the resin sealant layer, (iv) the metallized vias are disposed in the dielectric layer and electrically coupled to the metal posts, and (v) the metal paddle is disposed on a floor of the recess of the dielectric layer;
a first semiconductor device that extends through the resin sealant layer and is attached to the metal paddle in the recess of the dielectric layer by a thermally conductive adhesive, wherein the first semiconductor device has active pads that are substantially coplanar with the metal posts at top surfaces thereof;
a top buildup circuitry over a top surface of the first semiconductor device, a top surface of the resin sealant layer and a top surface of the metal posts, wherein the top buildup circuitry is electrically coupled to the first semiconductor device and the metal posts; and
a second semiconductor device over a top surface of the top buildup circuitry, wherein the second semiconductor device is electrically coupled to the first semiconductor device through the top buildup circuitry, and the second semiconductor device has active pads facing the active pads of the first semiconductor device.
2. The thermally enhanced face-to-face semiconductor assembly of claim 1 , wherein the dielectric layer contains glass fiber whereas the resin sealant layer is free of glass fiber.
3. The thermally enhanced face-to-face semiconductor assembly of claim 1 , further comprising a bottom buildup circuitry over a bottom surface of the core base, wherein the bottom buildup circuitry is electrically coupled to the top buildup circuitry through the metal posts and the metallized vias and is thermally conductible to the metal paddle through additional metallized vias in the dielectric layer.
4. The thermally enhanced face-to-face semiconductor assembly of claim 1 , wherein the first semiconductor device includes a semiconductor chip, a re-distribution layer and a mold compound, the re-distribution layer having the active pads at a top surface thereof and the semiconductor chip being disposed over a bottom surface of the re-distribution layer and electrically coupled to the active pads of the re-distribution layer and surrounded by the mold compound.
5. The thermally enhanced face-to-face semiconductor assembly of claim 1 , wherein the core base further includes an array of auxiliary metal pads laterally covered by the dielectric layer and electrically coupled to and disposed between the metal posts and the metallized vias.
6. The thermally enhanced face-to-face semiconductor assembly of claim 5 , wherein the auxiliary metal pads have a thickness substantially equal to a depth of the recess of the dielectric layer.