Electronic component device and method for manufacturing the same
An electronic component device includes a cored wiring substrate, an electronic component, a reinforcing layer, a connection terminal, and sealing resin. The cored wiring substrate includes a core layer. The electronic component is mounted on the cored wiring substrate. The coreless wiring substrate is disposed on the cored wiring substrate and the electronic component. The reinforcing layer is provided in the coreless wiring substrate and in a region corresponding to the electronic component. The connection terminal connects the cored wiring substrate and the coreless wiring substrate. The sealing resin is filled between the cored wiring substrate and the coreless wiring substrate.
1. An electronic component device comprising:
a cored wiring substrate comprising a core layer;
an electronic component that is mounted on the cored wiring substrate;
a coreless wiring substrate that is disposed above the cored wiring substrate and the electronic component such that the coreless wiring substrate is spaced from the cored wiring substrate and the electronic component;
a connection terminal that connects the cored wiring substrate and the coreless wiring substrate; and
a sealing resin that is filled between the cored wiring substrate and the coreless wiring substrate,
wherein the coreless wiring substrate comprises an insulating layer, a wiring layer, and a reinforcing layer, the reinforcing layer being embedded in the insulating layer and provided in a region overlaying the electronic component, the insulating layer comprising a first surface and a second surface opposite to the first surface, the first surface of the insulating layer being opposed to the electronic component, and a surface of the reinforcing layer being flush with the second surface of the insulating layer.
2. The device of claim 1 , wherein the reinforcing layer comprises one selected from the group consisting of
(i) a structure in which a copper layer, a nickel layer, a palladium layer, and a gold layer are stacked in order from an electronic component side,
(ii) a structure in which a copper layer, a nickel layer, and a gold layer are stacked in order from the electronic component side, and
(iii) a structure in which a copper layer and a nickel layer are stacked in order from the electronic component side.
3. The device of claim 1 , wherein
a distance between the electronic component and the first surface of the coreless wiring substrate is equal to or larger than 30 μm.
4. The device of claim 1 , wherein the core layer comprises a fiber-reinforcing-material containing resin layer.
5. The device of claim 1 , wherein:
the coreless wiring substrate comprises via conductors,
the insulating layer and the wiring layer are laminated,
the via conductors are disposed in the insulating layer, and
each via conductor has a truncated cone shape whose diameter is smaller on an outer side of the electronic component device than on an inner side of the electronic component device.
6. The device of claim 1 , wherein the connection terminal comprises a metal pillar.
7. The device of claim 1 , wherein
the reinforcing layer is at a same height as the wiring layer, and
the wiring layer is embedded in the insulating layer.
8. The device of claim 1 , wherein the core layer is larger in thickness than the insulating layer of the coreless wiring substrate.