Method and device for manufacturing a barrier layer on a flexible substrate
Method and apparatus for manufacturing a barrier layer on a substrate ( 1; 1 a, 1 b ). An inorganic oxide layer ( 11 ) having a pore volume between 0.3 and 10 vol. % is provided on the substrate ( 1; 1 a, 1 b ). Subsequently the substrate ( 1; 1 a, 1 b ) with the inorganic oxide layer ( 11 ) is treated in an atmospheric glow discharge plasma to form a sealing layer ( 12 ), the plasma being generated by at least two electrodes ( 2, 3 ) in a treatment space ( 5 ) formed between the at least two electrodes ( 2, 3 ). The treatment space ( 5 ) comprises in operation a mixture of a gas comprising oxygen and precursor material in an amount between 2 and 50 ppm. A local deposition rate is controlled at 5 nm/sec or lower, using a power density of 10 W/cm 2 or higher in the treatment space ( 5 ).
1. A method for manufacturing a barrier layer on a substrate, the method comprising:
providing an inorganic oxide layer having a pore volume between 0.3 and 10 vol. % on the substrate; and
subsequently treating the substrate with the inorganic oxide layer in an atmospheric glow discharge plasma to form a silicon dioxide sealing layer with a thickness between 1 and 15nm, the plasma being generated by at least two electrodes in a treatment space formed between the at least two electrodes, the treatment space comprising in operation a mixture of a gas comprising oxygen and precursor material in an amount between 2 and 50 ppm, by controlling a local deposition rate at 5.5 nm/sec or lower, using a power density of 10 W/cm 2 or higher in the treatment space, wherein the precursor material comprises tetraethoxysilane, hexamethyldisiloxane and/or hexamethyldisilazane.
2. The method according to claim 1 , wherein the treatment of the substrate with the inorganic oxide layer in the treatment space is done at a temperature below 150 ° C.
3. The method according to claim 1 , wherein the treatment of the substrate with the inorganic oxide layer in the treatment space is done during a time period of less than 20 minutes.
4. The method according to claim 1 , wherein the substrate is a flexible polymeric substrate.
5. The method according to claim 1 , wherein the inorganic oxide layer is provided on the substrate using an atmospheric glow discharge plasma, said plasma being generated by at least two electrodes in a treatment space formed between the at least two electrodes, the treatment space comprising in operation a gas comprising oxygen and a precursor material.
6. The method according to claim 5 , wherein the inorganic oxide layer has a pore volume between 0.3 and 3 vol. %.
7. The method according to claim 5 , wherein the provision of the inorganic oxide layer on the substrate is done in a time period of less than 20 minutes.
8. The method according to claim 5 , wherein the gas used to provide the inorganic oxide layer comprises oxygen in a concentration above 5% and a precursor material amount between 250 and 5000 ppm.
9. The method according to claim 5 , wherein the provision of the inorganic oxide layer in the treatment space is done at a temperature below 150 ° C.
10. The method according to claim 1 , wherein:
(a) the treatment of the substrate with the inorganic oxide layer in the treatment space is done at a temperature below 150 ° C.;
(b) the treatment of the substrate with the inorganic oxide layer in the treatment space is done during a time period of less than 20 minutes; and
(c) the substrate is a flexible polymeric substrate.
11. The method according to claim 1 , wherein:
(a) the treatment of the substrate with the inorganic oxide layer in the treatment space is done at a temperature below 100 ° C.;
(b) the treatment of the substrate with the inorganic oxide layer in the treatment space is done during a time period of less than 20 minutes; and
(c) the substrate is a flexible polymeric substrate selected from the group consisting of polyethylene terephthalate and polyethylene naphthalate.
12. The method according to claim 5 , wherein:
(a) the inorganic oxide layer has a pore volume between 0.3 and 3 vol. %;
(b) the provision of the inorganic oxide layer on the substrate is done in a time period of less than 20 minutes;
(c) the gas used to provide the inorganic oxide layer comprises oxygen in a concentration above 5% and a precursor material amount between 250 and 5000 ppm; and
(d) the provision of the inorganic oxide layer in the treatment space is done at a temperature below 150 ° C.
13. The method according to claim 1 , wherein:
(a) the treatment of the substrate with the inorganic oxide layer in the treatment space is done at a temperature below 100 ° C.;
(b) the treatment of the substrate with the inorganic oxide layer in the treatment space is done during a time period of less than 20 minutes;
(c) the substrate is a flexible polymeric substrate selected from the group consisting of polyethylene terephthalate and polyethylene naphthalate;
(d) the inorganic oxide layer is provided on the substrate using an atmospheric glow discharge plasma, said plasma being generated by at least two electrodes in a treatment space formed between the at least two electrodes, the treatment space comprising in operation a gas comprising oxygen and a precursor material;
(e) the inorganic oxide layer has a pore volume between 0.3 and 3 vol. %;
(f) the gas used to provide the inorganic oxide layer comprises oxygen in a concentration above 5% and a precursor material amount between 250 and 5000 ppm; and
(g) the provision of the inorganic oxide layer in the treatment space is done at a temperature below 150 ° C.