CVD coated cutting insert and method of making the same
A coated cutting insert for a chipforming material removal operation wherein the coated insert has a substrate and a coating scheme on the substrate. The coating scheme includes a CVD transition coating layer. The coating scheme further includes a CVD multi-layered coating scheme having a plurality of coating sets. Each one of the coating sets has an aluminum oxide coating layer and a nitrogen-containing coating layer.
1. A coated cutting insert for chipforming material removal operation, the coated cutting insert comprising:
a substrate and a coating scheme on the substrate;
the coating scheme comprises:
a backing coating scheme deposited by chemical vapor deposition, and the backing coating scheme being on the surface of the substrate and comprising an innermost titanium nitride coating layer and a mediate MT-titanium carbonitride coating layer having a thickness between about 1 μm and about 18 μm and an outermost coating layer comprising either a titanium nitride coating layer or a HT-titanium carbonitride coating layer;
a transition coating layer deposited by chemical vapor deposition, the transition coating layer being on the surface of the backing coating scheme; and
a multi-layered coating scheme deposited by chemical vapor deposition comprising a plurality of coating sets, the multi-layered coating scheme being on the surface of the transition coating layer; and
each of the coating sets comprising an aluminum oxide coating layer having an alpha aluminum oxide crystal structure and a nitrogen-containing coating layer of titanium oxycarbonitride and having a nitrogen-containing coating layer crystal structure, the aluminum oxide crystal structure being distinct from the nitrogen-containing coating layer crystal structure whereby a distinct boundary is between adjacent ones of the aluminum oxide coating layer and the nitrogen-containing coating layer, wherein the titanium oxycarbonitride layer contacts the aluminum oxide coating layer of an adjacent coating set.
2. The coated cutting insert according to claim 1 wherein for each one of the coating sets, the aluminum oxide coating layer having a thickness between about 0.05 μm and about 0.7 μm, and the nitrogen-containing coating layer having a thickness between about 0.01 μm and about 0.5 μm.
3. The coated cutting insert according to claim 1 wherein the multi-layer coating scheme having a thickness between about 1 μm and about 15 μm.
4. The coated cutting insert according to claim 1 wherein the outermost coating layer comprising the HT-titanium carbonitride coating layer.
5. The coated cutting insert according to claim 1 wherein for each of the coating sets, the aluminum oxide coating layer being closer to the substrate than the nitrogen-containing coating layer.
6. The coated cutting insert according to claim 1 wherein the substrate comprising a cemented tungsten carbide comprising: between about 89.8 weight percent and about 92.3 weight percent tungsten carbide, between about 5.7 weight percent and about 11.5 weight percent cobalt, up to about 3.0 weight percent tantalum, up to about 2 weight percent titanium, up to about 2.4 weight percent niobium, and up to about 0.80 weight percent chromium.
7. The coated cutting insert according to claim 1 wherein the coating scheme further comprising an outer coating scheme on the multi-layered coating scheme.
8. The coated cutting insert according to claim 7 wherein the outer coating scheme comprising a titanium oxycarbonitride coating layer.
9. The coated cutting insert according to claim 1 wherein the transition coating layer comprises titanium, oxygen, carbon and nitrogen.
10. The coated cutting insert of claim 1 comprising 2 to 16 coating sets.
11. The coated cutting insert of claim 1 , wherein the coating sets have an individual thickness of 0.95-1.2 μm.
12. A coated cutting insert for chipforming material removal operation, the coated cutting insert comprising:
a substrate and a coating scheme on the substrate;
the coating scheme comprises:
a backing coating scheme deposited by chemical vapor deposition, and the backing coating scheme being on the surface of the substrate and comprising an innermost titanium nitride coating layer and a mediate MT-titanium carbonitride coating layer having a thickness between about 1 μm and about 18 μm and an outermost coating layer comprising either a titanium nitride coating layer or a HT-titanium carbonitride coating layer;
a transition coating layer deposited by chemical vapor deposition, the transition coating layer being on the surface of the backing coating scheme; and
a multi-layered coating scheme deposited by chemical vapor deposition comprising a plurality of coating sets, the multi-layered coating scheme being on the surface of the transition coating layer; and
each of the coating sets comprising an aluminum oxide coating layer having an alpha aluminum oxide hexagonal crystal structure and a nitrogen-containing coating layer of titanium oxycarbonitride having a nitrogen-containing coating layer cubic crystal structure, whereby a distinct boundary is between adjacent ones of the aluminum oxide coating layer and the nitrogen-containing coating layer, wherein the titanium oxycarbonitride layer contacts the aluminum oxide coating layer of an adjacent coating set.
13. The coated cutting insert according to claim 12 wherein for each one of the coating sets, the aluminum oxide coating layer having a thickness between about 0.05 μm and about 0.7 μm, and the nitrogen-containing coating layer having a thickness between about 0.01 μm and about 0.5 μm.
14. The coated cutting insert of claim 12 comprising 2 to 16 coating sets.
15. The coated cutting insert of claim 12 , wherein the coating sets have an individual thickness of 0.95-1.2 μm.
16. A coated cutting insert for chipforming material removal operation, the coated cutting insert comprising:
a substrate and a coating scheme on the substrate;
the coating scheme comprises:
a backing coating scheme deposited by chemical vapor deposition, and the backing coating scheme being on the surface of the substrate and comprising an innermost titanium nitride coating layer and a mediate MT-titanium carbonitride coating layer having a thickness between about 1 μm and about 18 μm and an outermost coating layer comprising either a titanium nitride coating layer or a HT-titanium carbonitride coating layer; and
a multi-layered coating scheme deposited by chemical vapor deposition comprising a plurality of coating sets, the coating sets comprising an aluminum oxide coating layer having an alpha aluminum oxide hexagonal crystal structure and a nitrogen-containing coating layer of titanium oxycarbonitride having cubic crystal structure, whereby a distinct boundary is between adjacent ones of the aluminum oxide coating layer and the nitrogen-containing coating layer, wherein the titanium oxycarbonitride layer contacts the aluminum oxide coating layer of an adjacent coating set and titanium oxycarbonitride layers are innermost and outer layers of the multilayered coating scheme.