Metrology apparatus, method of measuring a structure and lithographic apparatus
Disclosed is a metrology apparatus and method for measuring a structure formed on a substrate by a lithographic process. The metrology apparatus comprises an illumination system operable to provide measurement radiation comprising a plurality of wavelengths; and a hyperspectral imager operable to obtain a hyperspectral representation of a measurement scene comprising the structure, or a part thereof, from scattered measurement radiation subsequent to the measurement radiation being scattered by the structure.
1. A metrology apparatus for measuring a structure formed on a substrate by a lithographic process, said metrology apparatus comprising:
an illumination system configured to provide measurement radiation comprising a plurality of wavelengths; and
a hyperspectral imager configured to obtain a multi-wavelength hyperspectral representation of a measurement scene comprising the structure, or a part thereof, from scattered measurement radiation at an image plane subsequent to said measurement radiation being scattered by said structure, wherein the hyperspectral imager comprises at least one wavelength dispersive element to capture multi-wavelengths simultaneously.
2. The metrology apparatus of claim 1 , wherein said hyperspectral representation comprises a three-dimensional data cube having two spatial dimensions and one spectral dimension.
3. The metrology apparatus of claim 2 , wherein the hyperspectral imager is a compressive sensing hyperspectral imager configured to directly acquire an optically compressed representation of said three-dimensional data cube.
4. The metrology apparatus of claim 2 , wherein the hyperspectral imager is a snapshot hyperspectral imager configured to capture the three-dimensional data cube without scanning.
5. The metrology apparatus of claim 4 , wherein the hyperspectral imager is a coded aperture snapshot spectral imager comprising a coded aperture element and the at least one wavelength dispersive element is configured to capture a two-dimensional coded spatio-spectral projection of the three-dimensional data cube.
6. The metrology apparatus of claim 5 , wherein the coded aperture element is configured to modulate spatial information of the measurement scene over all wavelengths comprised within the three-dimensional data cube with a coded pattern to obtain a coded signal; and said wavelength dispersive element is configured to disperse this coded signal spatially as a function of wavelength to obtain said two-dimensional coded spatio-spectral projection.
7. The metrology apparatus of claim 5 , comprising a processing unit configured to perform a reconstruction method to estimate the three-dimensional data cube from the two-dimensional coded spatio-spectral projection and knowledge of the encoding of the coded aperture element.
8. The metrology apparatus of claim 7 , wherein said reconstruction method aims to find an estimate of the three-dimensional data cube having a sparse representation.
9. The metrology apparatus of claim 5 , wherein the coded aperture snapshot spectral imager is a single disperser coded aperture snapshot spectral imager comprising only a single wavelength dispersive element.
10. The metrology apparatus of claim 5 , wherein the wavelength dispersive element comprises a prism.
11. The metrology apparatus of claim 5 , wherein the coded aperture element comprises a binary glass mask, programmable micromirror array or a liquid crystal on Silicon Spatial light modulator.
12. The metrology apparatus of claim 1 , wherein the hyperspectral imager comprises a sensor for sensing said hyperspectral representation of a measurement scene.
13. The metrology apparatus of claim 1 , wherein said illumination system is configured such that said measurement radiation comprises a continuous spectrum.
14. The metrology apparatus of claim 1 , wherein said illumination system is configured such that said measurement radiation comprises a plurality of discrete wavelengths.
15. The metrology apparatus of claim 1 , configured to measure overlay from the hyperspectral representation of the structure, said structure comprising a metrology target for the measurement of overlay.
16. An alignment sensor comprising a metrology apparatus for measuring an alignment structure formed on a substrate by a lithographic process, said metrology apparatus comprising:
an illumination system configured to provide measurement radiation comprising a plurality of wavelengths; and
a hyperspectral imager configured to obtain a multi-wavelength hyperspectral representation of a measurement scene comprising the structure, or a part thereof, from scattered measurement radiation at an image plane subsequent to said measurement radiation being scattered by said structure, wherein the hyperspectral imager comprises at least one wavelength dispersive element to capture multi-wavelengths simultaneously.
17. A method of measuring a structure formed on a substrate by a lithographic process comprising:
illuminating the structure with measurement radiation comprising a plurality of wavelengths, such that the measurement radiation is scattered by the structure;
spatially modulating the scattered measurement radiation with a coded pattern to obtain coded measurement radiation;
spectrally dispersing the coded measurement radiation to obtain a two-dimensional coded spatio-spectral projection;
sensing, at an image plane, the two-dimensional coded spatio-spectral projection; and
estimating, using a a hyperspectral imager, a multi-wavelength hyperspectral representation of the structure from the two-dimensional coded spatio-spectral projection and knowledge of the coded pattern, wherein the hyperspectral imager comprises at least one wavelength dispersive element to capture multi-wavelengths simultaneously.
18. The method of claim 17 , wherein said two-dimensional coded spatio-spectral projection is sensed during a one or more snapshot(s).
19. The method of claim 17 , wherein said hyperspectral representation comprises a three-dimensional data cube having two spatial dimensions and one spectral dimension.
20. The lithography apparatus, arranged to transfer a pattern from a patterning device onto a substrate, comprising an alignment sensor with a metrology apparatus for measuring an alignment structure formed on the substrate, said metrology apparatus comprising:
an illumination system configured to provide measurement radiation comprising a plurality of wavelengths; and
a hyperspectral imager configured to obtain a multi-wavelength hyperspectral representation of a measurement scene comprising the structure, or a part thereof, from scattered measurement radiation at an image plane subsequent to said measurement radiation being scattered by said structure, wherein the hyperspectral imager comprises at least one wavelength dispersive element to capture multi-wavelengths simultaneously.