Sealing cap for electronic component
An electronic component cap for producing a package having a sealed region by being bonded to a base, having a brazing material-fused surface to which a brazing material is fused and a sealing surface corresponding to the sealed region. The brazing material-fused surface has a non-flat work surface formed by plastic working, and a ratio (Sc/Sf) of a surface area (Sc) of the brazing material-fused surface per unit area to a surface area (Sf) of the sealing surface per unit area satisfies 1<Sc/Sf≤1.6. The cross-sectional shape of the work surface may be one of various shapes such as a groove shape, an approximately V shape, and a circular-arc shape. The cap has a good wettability when a brazing material is fused. Also, the brazing material does not wet-spread excessively when the brazing material is melted again for sealing work.
1. An electronic component cap for producing a package having a sealed region by being bonded to a base, wherein
the cap has a brazing material-fused surface to which a brazing material is fused and a sealing surface corresponding to the sealed region,
the brazing material-fused surface has a non-flat work surface formed by plastic working, and
a ratio (Sc/Sf) of a surface area (Sc) of the brazing material-fused surface per unit area to a surface area (Sf) of the sealing surface per unit area satisfies 1<Sc/Sf≤1.6.
2. The electronic component cap according to claim 1 , wherein a cross-sectional shape of the work surface is a shape having a groove that protrudes from a flat surface.
3. The electronic component cap according to claim 1 , wherein a cross-sectional shape of the work surface is an approximately V shape that descends downwards from both ends toward a center.
4. The electronic component cap according to claim 1 , wherein a cross-sectional shape of the work surface is a circular-arc shape that extends downwards from both ends toward a center.
5. The electronic component cap according to claim 1 , wherein at least one of a protrusion that protrudes upwards and a recess that protrudes downwards is formed as the work surface.
6. The electronic component cap according to claim 1 , wherein an Au-based brazing material is fused to the brazing material-fused surface.
7. The electronic component cap according to claim 1 , which has a flat plate shape, wherein the brazing material-fused surface having a frame shape is set along four sides of the flat plate shape.
8. The electronic component cap according to claim 1 , wherein the cap has a box shape with a cavity formed, and the brazing material-fused surface having a frame shape is set along an end surface of the cap.
9. The electronic component cap according to claim 8 , comprising a cap body that forms the cavity and a flange section formed at an end of the cap body, wherein the brazing material-fused surface having a frame shape is set along an end surface of the flange.
10. The electronic component cap according to claim 2 , wherein an Au-based brazing material is fused to the brazing material-fused surface.
11. The electronic component cap according to claim 3 , wherein an Au-based brazing material is fused to the brazing material-fused surface.
12. The electronic component cap according to claim 4 , wherein an Au-based brazing material is fused to the brazing material-fused surface.
13. The electronic component cap according to claim 5 , wherein an Au-based brazing material is fused to the brazing material-fused surface.
14. The electronic component cap according to claim 2 , which has a flat plate shape, wherein the brazing material-fused surface having a frame shape is set along four sides of the flat plate shape.
15. The electronic component cap according to claim 3 , which has a flat plate shape, wherein the brazing material-fused surface having a frame shape is set along four sides of the flat plate shape.
16. The electronic component cap according to claim 4 , which has a flat plate shape, wherein the brazing material-fused surface having a frame shape is set along four sides of the flat plate shape.
17. The electronic component cap according to claim 5 , which has a flat plate shape, wherein the brazing material-fused surface having a frame shape is set along four sides of the flat plate shape.
18. The electronic component cap according to claim 6 , which has a flat plate shape, wherein the brazing material-fused surface having a frame shape is set along four sides of the flat plate shape.
19. The electronic component cap according to claim 2 , wherein the cap has a box shape with a cavity formed, and the brazing material-fused surface having a frame shape is set along an end surface of the cap.
20. The electronic component cap according to claim 3 , wherein the cap has a box shape with a cavity formed, and the brazing material-fused surface having a frame shape is set along an end surface of the cap.