Batch curing chamber with gas distribution and individual pumping
Embodiments of the present disclosure generally relate to a batch processing chamber that is adapted to simultaneously cure multiple substrates at one time. The batch processing chamber includes multiple processing sub-regions that are each independently temperature controlled. The batch processing chamber may include a first and a second sub-processing region that are each serviced by a substrate transport device external to the batch processing chamber. In addition, a slotted cover mounted on the loading opening of the batch curing chamber reduces the effect of ambient air entering the chamber during loading and unloading.
1. A batch substrate processing chamber, comprising:
multiple sub-processing regions that are each configured to receive a substrate from an atmospheric robot and to perform a curing process on the substrate received from the atmospheric robot;
a loading opening formed in a wall of the batch processing chamber;
a first door disposed over the loading opening; and
a cover plate disposed over the loading opening comprising multiple slotted openings, wherein
the first door is disposed over all of the multiple slotted openings,
the first door is configured to seal the loading opening with a sealing surface that encompasses the multiple slotted openings,
each of the slotted openings are configured to allow at least one atmospheric robot to extend an arm from a position outside of the batch processing chamber to one of the multiple sub-processing regions, and
each of the multiple slotted openings are configured to reduce the free area of the loading opening when the loading opening is open.
2. The batch processing chamber of claim 1 , wherein
each of the multiple slotted openings corresponds to one of the multiple sub-processing regions, and
each of the multiple slotted openings has a shape that is asymmetric relative to a shape of the door and a shape of the loading opening.
3. The batch processing chamber of claim 2 , wherein
each of the multiple slotted openings is substantially aligned with the corresponding one of the multiple sub-processing regions, and
each of the multiple slotted openings includes a shape having more edges than a shape of the door and a shape of the loading opening.
4. The batch processing chamber of claim 1 , wherein the loading opening is configured to allow a substrate to be loaded into each of the multiple curing stations without repositioning the loading opening with respect to the multiple curing stations.
5. The batch processing chamber of claim 1 , wherein the multiple sub-processing regions are arranged in a stacked array.
6. The batch processing chamber of claim 5 , wherein the loading opening is configured to span the stacked array in two dimensions.
7. The batch processing chamber of claim 1 , wherein each of the multiple sub-processing regions in the batch processing chamber is disposed between a heated substrate pedestal and a showerhead.
8. The batch processing chamber of claim 7 , wherein the showerhead is configured to independently deliver a process gas to an adjacent sub-processing region.
9. The batch processing chamber of claim 7 , wherein the heated substrate pedestal is configured to independently control a temperature of a substrate disposed thereon.
10. A system for forming a dielectric material on a surface of a substrate, the system comprising:
a mainframe;
a factory interface that includes at least one atmospheric robot and is configured to receive one or more cassettes of substrates;
a load lock chamber that is coupled to the mainframe and is configured to receive one or more substrates from the at least one atmospheric robot in the factory interface;
multiple flowable CVD chambers that are each coupled to the mainframe; and
a batch processing chamber coupled to the factory interface, the batch processing chamber comprising:
multiple sub-processing regions that are each configured to receive a substrate from the at least one atmospheric robot and to perform a curing process on the substrate received from the atmospheric robot;
a loading opening formed in a wall of the batch processing chamber;
a first door disposed over the loading opening; and
a cover plate that includes multiple slotted openings and is disposed over the loading opening, wherein
the first door is disposed over all of the multiple slotted openings,
the first door is configured to seal the loading opening with a sealing surface that encompasses the multiple slotted openings,
each of the multiple slotted openings are configured to allow the at least one atmospheric robot to extend an arm from a position outside of the batch processing chamber to one of the multiple sub-processing regions, and
each of the multiple slotted openings are configured to reduce the free area of the loading opening when the loading opening is open.
11. The system of claim 10 , wherein
each of the multiple slotted openings corresponds to one of the multiple sub-processing regions, and
each of the multiple slotted openings has a shape that is asymmetric relative to a shape of the door and a shape of the loading opening.
12. The system of claim 11 , wherein
each of the multiple slotted openings is substantially aligned with the corresponding one of the multiple sub-processing regions, and
each of the multiple slotted openings includes a shape having more edges than a shape of the door and a shape of the loading opening.
13. The system of claim 10 , wherein the loading opening is configured to allow a substrate to be loaded into each of the multiple curing stations without repositioning the loading opening with respect to the multiple curing stations or the factory interface.
14. The system of claim 10 , wherein the multiple flowable CVD chambers are each configured to deposit a flowable dielectric layer on a substrate via a CVD process.
15. The system of claim 10 , wherein the multiple sub-processing regions are arranged in a stacked array and the loading opening is configured to span the stacked array in two dimensions.
16. The system of claim 10 , wherein the factory interface further includes at least one atmospheric holding station configured to temporarily store substrates outside the batch processing chamber prior to being processed in the batch processing chamber.
17. The system of claim 10 , wherein a total number of the multiple sub-processing regions in the batch processing chamber is equal to a total number of the multiple flowable CVD chambers that are coupled to the mainframe.
18. The system of claim 10 , wherein each of the multiple sub-processing regions in the batch processing chamber is disposed between a heated substrate pedestal and a showerhead.
19. The system of claim 18 , wherein the showerhead is configured to independently deliver a process gas to a substrate disposed in the sub-processing region.
20. The system of claim 18 , wherein the heated substrate pedestal is configured to independently heat a substrate disposed in the sub-processing region during processing.