Apparatus for high compressive stress film deposition to improve kit life

1. A process kit, comprising:

a first ring having an inner wall defining an inner diameter, an outer wall defining an outer diameter, an upper surface disposed between the inner wall and the outer wall, and an opposing lower surface disposed between the inner wall and the outer wall, wherein a first portion of the upper surface proximate the inner wall is concave, and wherein a second portion of the upper surface has a length that extends horizontally away from the first portion and terminates at the outer wall; and

a second ring having an upper surface and an opposing lower surface, wherein a first portion of the lower surface of the second ring is configured to rest upon the length of the upper surface of the second portion of the first ring, wherein a second portion of the lower surface of the second ring is convex and extends into but does not touch the concave first portion of the upper surface of the first ring.

2. The process kit of claim 1 , wherein the second portion of the lower surface and the concave first portion of the upper surface of the first ring form a gap that decreases in a direction toward the outer wall.

3. The process kit of claim 1 , wherein the first ring is titanium.

4. The process kit of claim 1 , wherein the second ring is titanium.

5. The process kit of claim 1 , wherein the concave first portion of the upper surface of the first ring is defined by a radius.

6. The process kit of claim 5 , wherein the radius is about 2.86 inches or more.

7. The process kit of claim 1 , wherein the inner diameter of the first ring is less than a diameter of a substrate to be processed in a processing chamber comprising the process kit.

8. The process kit of claim 1 , the first ring further comprising a flat inner edge surface proximate the inner wall.

9. The process kit of claim 8 , further comprising a notch between the flat inner edge surface and the concave first portion of the upper surface of the first ring.

10. The process kit of claim 1 , wherein the lower surface of the second ring is linear from the second portion to a tapered portion proximate the outer wall of the first ring.

11. The process kit of claim 10 , wherein a second protruding surface comprises a tapered portion proximate the outer wall of the first ring, and wherein the tapered portion is configured to align the second ring and the first ring.

12. The process kit of claim 1 , wherein the lower surface of the first ring comprises a first recessed portion and a second recessed portion formed between the inner wall and the outer wall.

13. The process kit of claim 1 , wherein the upper surface of the second ring is an inclined surface sloped radially inwards.

14. The process kit of claim 1 , wherein the second portion of the lower surface of the second ring covers portions of the concave first portion of the upper surface of the first ring having a radius of less than about 2.86 inches.

15. A physical vapor deposition chamber, comprising:

a chamber body having a first volume;

a chamber lid comprising a target assembly disposed atop the chamber body;

a substrate support disposed within the first volume, opposite the target assembly, and having a substrate processing surface;

a shield disposed within the chamber body comprising one or more sidewalls configured to surround the first volume, wherein the shield extends downwardly to below a top surface of the substrate support and returns upwardly until reaching a top surface of the substrate support to form a u-shaped portion at a bottom of the shield; and

a process kit, comprising:

a first ring having an inner wall defining an inner diameter, an outer wall defining an outer diameter, an upper surface disposed between the inner wall and the outer wall, and an opposing lower surface disposed between the inner wall and the outer wall, wherein a first portion of the upper surface proximate the inner wall is concave, and wherein a second portion of the upper surface has a length that extends horizontally away from the first portion and terminates at the outer wall; and

a second ring having an upper surface and an opposing lower surface, wherein a first portion of the lower surface of the second ring is configured to rest upon the length of the upper surface of the second portion of the first ring, wherein a second portion of the lower surface of the second ring is convex and extends into but does not touch the concave first portion of the upper surface of the first ring, wherein the lower surface of the second ring further comprises a third portion having a first protruding surface and a second protruding surface extending downward away from the lower surface of the second ring, wherein the first protruding surface and the second protruding surface are spaced apart to define an opening, wherein a terminal portion of the shield is disposed in the opening to support the second ring, and wherein the second protruding surface comprises a tapered portion proximate the outer wall of the first ring, wherein the tapered portion is configured to align the second ring and the first ring.

16. The physical vapor deposition chamber of claim 15 , wherein the second portion of the lower surface and the concave first portion of the upper surface of the first ring form a gap of about 0.053 inches or less which decreases in a direction toward the outer wall.

17. The physical vapor deposition chamber of claim 15 , wherein the first ring and the second ring are composed of titanium.

18. The physical vapor deposition chamber of claim 15 , wherein the concave first portion of the upper surface of the first ring is defined by a radius of about 2.86 inches or more.

19. The physical vapor deposition chamber of claim 15 , wherein the lower surface of the first ring comprises a first recessed portion and second recessed portion formed between the inner wall and the outer wall, wherein the first recessed portion of the lower surface of the first ring supports the first ring atop the substrate support.

20. A process kit, comprising:

a first titanium ring having:

an inner wall defining an inner diameter,

an outer wall defining an outer diameter,

an upper surface disposed between the inner wall and the outer wall,

a flat inner edge surface proximate the inner wall,

an opposing lower surface disposed between the inner wall and the outer wall, wherein a first portion of the upper surface proximate the inner wall is concave, and wherein a second portion of the upper surface extends horizontally away from the first portion,

a notch between the flat inner edge surface and the concave first portion of the upper surface, and

a channel in the second portion between the outer wall and the concave first portion of the upper surface; and

a second titanium ring having an upper surface and an opposing lower surface,

wherein a first portion of the lower surface of the second titanium ring is configured to rest upon the length of the second portion of the first titanium ring,

wherein a second portion of the lower surface of the second titanium ring is convex and extends into but does not touch the concave first portion of the upper surface of the first titanium ring,

wherein the lower surface of the second titanium ring further comprises a third portion having a first protruding surface and a second protruding surface extending downward away from the lower surface of the second titanium ring,

wherein the first protruding surface and the second protruding surface are spaced apart to define an opening,

wherein the second protruding surface comprises a tapered portion proximate the outer wall of the first titanium ring, wherein the tapered portion is configured to align the second titanium ring and the first titanium ring, and

wherein the second portion of the lower surface of the second titanium ring and the concave first portion of the upper surface of the first titanium ring form a gap of about 0.053 inches or less.