Granted Patent
S1
US 1,012,051 · App. 29/715,863 · Granted Jan 23, 2024
Electrostatic chuck for semiconductor manufacturing device
Assignee:
TOKYO ELECTRON LIMITED
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Claims (1)
The ornamental design for an electrostatic chuck for semiconductor manufacturing device, as shown and described.
Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded Jan 29, 2020
From: TAKAYAMA, MASATO; SASAKI, YASUHARU
To: TOKYO ELECTRON LIMITED
Reel/Frame 051657/0903 →
Priority Claims (1)
JP 2019-013256
· Jun 17, 2019
· national