IP Library › Granted Patent US 10,120,593
Granted Patent B2
US 10,120,593 · App. 15/160,212 · Granted Nov 6, 2018

Method of controlling temperature of non-volatile storage device

Inventors: Jae-beom Byun (Suwon-si, KR); Hu Zhao (Hwaseong-si, KR); Jong-gyu Park (Hwaseong-si, KR); Do-il Kong (Hwaseong-si, KR); Chung-hyun Ryu (Hwaseong-si, KR); Eok-soo Shim (Suwon-si, KR)
Assignee: Samsung Electronics Co., Ltd.
G06F3/0616G06F3/0613G06F3/0634G06F3/0685G11C5/04G11C7/04
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Quick Facts
Patent No.
US 10,120,593
App. No.
15/160,212
Granted
Nov 6, 2018
Kind
B2
Abstract

A method of controlling a temperature of a non-volatile storage device includes determining whether the temperature of the non-volatile storage device is greater than a control engagement temperature, and adjusting a data I/O performance level P when the temperature of the non-volatile storage device is greater than the control engagement temperature. The non-volatile storage device may operate at the maximum performance level in a range in which the non-volatile storage device is protected from heat.

Claims (152)

1. A method of controlling a temperature of a non-volatile storage device, the method comprising:

detecting the temperature of the non-volatile storage device which is represented by a value measured by a temperature measuring sensor;

determining whether the temperature of the non-volatile storage device is higher than a control engagement temperature; and

adjusting a data I/O performance level P according to Formula 1 below if the temperature of the non-volatile storage device is higher than the control engagement temperature,

P

=

P

max

×

β

×

(

1

-

α

⁢

Δ

⁢

⁢

T

Δ

⁢

⁢

T

b

)

(

1

)

wherein, P max denotes a maximum data I/O performance level of the non-volatile storage device,

ΔT denotes a difference between the temperature of the non-volatile storage device and a reference temperature,

ΔT b denotes a difference between a maximum threshold temperature of the non-volatile storage device and the reference temperature, wherein ΔT b is greater than zero, and

α and β are control parameters of the non-volatile storage device,

the non-volatile storage device comprises:

a substrate; and

a memory controller, a volatile memory, and a non-volatile memory that are mounted on the substrate, and

wherein the temperature measuring sensor is disposed on a surface of or adjacent to at least one of the memory controller, the volatile memory, the non-volatile memory, and the substrate,

the memory controller is configured to receive a temperature value from the temperature measuring sensor, and

based on the received temperature value, the memory controller is configured to control the data I/O performance level according to Formula 1.

2. The method of claim 1 , wherein the data I/O performance level is a data I/O speed.

3. The method of claim 2 , wherein the adjusting of the data I/O performance level P comprises controlling at least one of a number of data I/O channels and a number of ways, in order to control the data I/O speed.

4. The method of claim 2 , wherein the adjusting of the data I/O performance level P comprises controlling a speed of a write/read operation with respect to the non-volatile storage device, in order to control the data I/O speed.

5. The method of claim 4 , wherein the controlling of speed of the write/read operation with respect to the non-volatile storage device is performed according to a Tprog function.

6. The method of claim 1 , wherein the reference temperature is lower than the control engagement temperature.

7. The method of claim 1 , wherein the memory controller comprises a firmware capable of performing the determining of whether the temperature of the non-volatile storage device is higher than the control engagement temperature and the adjusting of the data I/O performance level P.

8. The method of claim 1 , further comprising, after the adjusting of the data I/O performance level P:

determining whether the temperature of the non-volatile storage device is lower than the control engagement temperature; and

setting the data I/O performance level P to a maximum data I/O performance level P max if the temperature of the non-volatile storage device is lower than the control engagement temperature.

9. The method of claim 1 , wherein the determining of whether the temperature of the non-volatile storage device is higher than the control engagement temperature is repeated at intervals.

10. The method of claim 9 , wherein a period for the determining of whether the temperature of the non-volatile storage device is higher than the control engagement temperature is in a range of about one second to about one hour.

11. The method of claim 9 , further comprising adjusting the data I/O performance level P according to Formula 1 if the temperature of the non-volatile storage device is higher than the control engagement temperature.

12. A method of controlling a temperature of a non-volatile storage device, the non-volatile storage device comprising a substrate and a memory controller, a volatile memory, and a non-volatile memory that are mounted on the substrate, the method comprising:

detecting a temperature at predetermined time intervals by using a temperature measuring sensor and sending a temperature value to the memory controller; and

controlling, by using the memory controller, a speed of a write/read operation with respect to the non-volatile memory based on the temperature value,

wherein the controlling of the speed of the write/read operation with respect to the non-volatile memory comprises:

setting the write/read speed to a maximum value if the temperature is less than or equal to a control engagement temperature, and

applying at least one of (a), (b), and (c) according to Formula 2 below if the temperature is higher than the control engagement temperature,

P

=

P

max

×

f

⁡

(

Δ

⁢

⁢

T

Δ

⁢

⁢

T

b

)

(

2

)

(a) reducing a number of data I/O channels;

(b) reducing a number of data I/O ways; and

(c) decreasing a speed of a data write/read operation with respect to the non-volatile memory,

wherein P denotes a data I/O performance level,

P max denotes a maximum data I/O performance level of the non-volatile storage device,

ΔT denotes a difference between the temperature of the non-volatile storage device and a reference temperature, and

ΔT b denotes a difference between a maximum threshold temperature of the non-volatile storage device and the reference temperature, wherein ΔT b is greater than zero,

wherein the temperature measuring sensor is disposed on a surface of or adjacent to at least one of the memory controller, the volatile memory, the non-volatile memory, and the substrate.

13. The method of claim 12 , wherein Formula 2 below is identical to Formula 1,

P

=

P

max

×

β

×

(

1

-

α

⁢

Δ

⁢

⁢

T

Δ

⁢

⁢

T

b

)

(

2

)

wherein, α and β are control parameters of the non-volatile storage device.

14. The method of claim 12 , wherein the controlling of the speed of the write/read operation with respect to the non-volatile memory comprises applying (c) decreasing the speed of the data write/read operation with respect to the non-volatile memory.

15. The method of claim 14 , wherein the decreasing the speed of the data write/read operation with respect to the non-volatile memory is performed according to a Tprog function.

16. A method of controlling a temperature of a non-volatile storage device, the non-volatile storage device comprising a substrate; and a memory controller, a volatile memory, and a non-volatile memory that are mounted on the substrate, the method comprising:

setting a data I/O performance level to a maximum level;

detecting the temperature of the non-volatile storage device using a temperature measuring sensor disposed on a surface of or adjacent to at least one of the memory controller, the volatile memory, the non-volatile memory, and the substrate;

determining whether the temperature of the non-volatile storage device is higher than a control engagement temperature; and

adjusting the data I/O performance level to a value lower than the maximum level if the temperature of the non-volatile storage device is higher than the control engagement temperature, or keeping the data I/O performance level at the maximum level if the temperature of the non-volatile storage device is equal to or lower than the control engagement temperature,

wherein the non-volatile storage device includes a NAND memory, and

the adjusting of the data I/O performance level comprises controlling a speed of a write/read operation with respect to the non-volatile storage device by using a Tprog function, in order to control data I/O speed.

17. The method of claim 16 , wherein adjusting the data I/O performance level P includes adjusting the data I/O performance level according to Formula 1 below

P

=

P

max

×

β

×

(

1

-

α

⁢

Δ

⁢

⁢

T

Δ

⁢

⁢

T

b

)

(

1

)

wherein P max denotes the maximum level of the data I/O performance level of the non-volatile storage device,

ΔT denotes a difference between the temperature of the non-volatile storage device and a reference temperature,

ΔT b denotes a difference between a maximum threshold temperature of the non-volatile storage device and the reference temperature, wherein ΔT b is greater than zero, and

α and β are control parameters of the non-volatile storage device.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 20, 2016
From: BYUN, JAE-BEOM; ZHAO, HU; PARK, JONG-GYU; KONG, DO-IL; RYU, CHUNG-HYUN; SHIM, EOK-SOO
To: SAMSUNG ELECTRONICS CO.,LTD.
Reel/Frame 038657/0411 →
Priority Claims (1)
KR 10-2015-0071935 · May 22, 2015 · national
Continuity (1)
Related Publication 20160342346A1 · Nov 24, 2016
Cited By (3)
US 12,223,181 US 12,347,514 US 12,431,170