IP Library › Granted Patent US 10,126,957
Granted Patent B2
US 10,126,957 · App. 15/723,295 · Granted Nov 13, 2018

Semiconductor storage device and controller

Inventor: Hiroshi Maejima (Tokyo, JP)
Assignee: Toshiba Memory Corporation
G06F3/0614G06F3/0631G06F3/0652G06F3/0659G06F3/0665G06F3/0679G06F12/0246G11C11/5635G11C16/0483G11C16/10G11C16/16G11C16/3418G06F2212/1032G06F2212/152G06F2212/214G06F2212/7202G11C2213/71
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Quick Facts
Patent No.
US 10,126,957
App. No.
15/723,295
Granted
Nov 13, 2018
Kind
B2
Abstract

A semiconductor storage device includes memory cells, select transistors, memory strings, first and second blocks, word lines, and select gate lines. In the memory string, the current paths of plural memory cells are connected in series. When data are written in a first block, after a select gate line connected to the gate of a select transistor of one of the memory strings in the first block is selected, the data are sequentially written in the memory cells in the memory string connected to the selected select gate line. When data are written in the second block, after a word line connected to the control gates of memory cells of different memory strings in the second block is selected, the data are sequentially written in the memory cells of the different memory strings in the second block which have their control gates connected to the selected word line.

Claims (156)

1. A storage device comprising:

a first memory string including

a first select transistor,

a first memory cell, and

a second memory cell;

a second memory string including

a second select transistor,

a third memory cell, and

a fourth memory cell;

a bit line electrically connected to the first memory string and the second memory string;

a first select gate line electrically connected to a gate of the first select transistor;

a second select gate line electrically connected to a gate of the second select transistor;

a first word line electrically connected to a gate of the first memory cell and a gate of the third memory cell;

a second word line electrically connected to a gate of the second memory cell and a gate of the fourth memory cell; and

a control circuit configured to

perform a first operation, the first operation including

supplying a first program voltage to the first word line, and

supplying a first select voltage to the first select gate line,

perform a second operation after the first operation, the second operation including

supplying a second program voltage to the first word line, and

supplying a second select voltage to the second select gate line,

perform a third operation after the second operation, the third operation including

supplying a third program voltage to the second word line, and

supplying a third select voltage to the first select gate line, and

perform a fourth operation after the third operation, the fourth operation including

supplying a fourth program voltage to the second word line, and

supplying a fourth select voltage to the second select gate line.

2. The storage device according to claim 1 , wherein

the first select transistor, the first memory cell and the second memory cell of the first memory string are electrically connected in series, and

the second select transistor, the third memory cell and the fourth memory cell of the second memory string are electrically connected in series.

3. The storage device according to claim 1 , wherein

the second operation is performed immediately after the first operation, and

the fourth operation is performed immediately after the third operation.

4. The storage device according to claim 1 , wherein

in the first operation, first data is written in the first memory cell,

in the second operation, second data is written in the third memory cell,

in the third operation, third data is written in the second memory cell, and

in the fourth operation, fourth data is written in the fourth memory cell.

5. The storage device according to claim 1 , wherein

the first operation further includes

supplying a first transfer voltage to the second word line,

the second operation further includes

supplying a second transfer voltage to the second word line,

the third operation further includes

supplying a third transfer voltage to the first word line, and

the fourth operation further includes

supplying a fourth transfer voltage to the first word line.

6. The storage device according to claim 5 , wherein

the first to fourth program voltages are substantially the same,

the first to fourth select voltages are substantially the same, and

the first to fourth transfer voltages are substantially the same.

7. A storage system comprising:

a storage device including:

a first memory string including

a first select transistor,

a first memory cell, and

a second memory cell;

a second memory string including

a second select transistor,

a third memory cell, and

a fourth memory cell;

a bit line electrically connected to the first memory string and the second memory string;

a first select gate line electrically connected to a gate of the first select transistor;

a second select gate line electrically connected to a gate of the second select transistor;

a first word line electrically connected to a gate of the first memory cell and a gate of the third memory cell;

a second word line electrically connected to a gate of the second memory cell and a gate of the fourth memory cell; and

a control circuit; and

a controller device configured to send an instruction to the control circuit of the storage device, the instruction causing the control circuit to

perform a first operation, the first operation including

supplying a first program voltage to the first word line, and

supplying a first select voltage to the first select gate line,

perform a second operation after the first operation, the second operation including

supplying a second program voltage to the first word line, and

supplying a second select voltage to the second select gate line,

perform a third operation after the second operation, the third operation including

supplying a third program voltage to the second word line, and

supplying a third select voltage to the first select gate line, and

perform a fourth operation after the third operation, the fourth operation including

supplying a fourth program voltage to the second word line, and

supplying a fourth select voltage to the second select gate line.

8. The storage system according to claim 7 , wherein

the first select transistor, the first memory cell and the second memory cell of the first memory string are electrically connected in series, and

the second select transistor, the third memory cell and the fourth memory cell of the second memory string are electrically connected in series.

9. The storage system according to claim 7 , wherein

the second operation is performed immediately after the first operation, and

the fourth operation is performed immediately after the third operation.

10. The storage system according to claim 7 , wherein

in the first operation, first data is written in the first memory cell,

in the second operation, second data is written in the third memory cell,

in the third operation, third data is written in the second memory cell, and

in the fourth operation, fourth data is written in the fourth memory cell.

11. The storage system according to claim 7 , wherein

the first operation further includes

supplying a first transfer voltage to the second word line,

the second operation further includes

supplying a second transfer voltage to the second word line,

the third operation further includes

supplying a third transfer voltage to the first word line, and

the fourth operation further includes

supplying a fourth transfer voltage to the first word line.

12. The storage system according to claim 11 , wherein

the first to fourth program voltages are substantially the same,

the first to fourth select voltages are substantially the same, and

the first to fourth transfer voltages are substantially the same.

13. A method for operating a storage device,

the storage device including:

a first memory string including

a first select transistor,

a first memory cell, and

a second memory cell;

a second memory string including

a second select transistor,

a third memory cell, and

a fourth memory cell;

a bit line electrically connected to the first memory string and the second memory string;

a first select gate line electrically connected to a gate of the first select transistor;

a second select gate line electrically connected to a gate of the second select transistor;

a first word line electrically connected to a gate of the first memory cell and a gate of the third memory cell; and

a second word line electrically connected to a gate of the second memory cell and a gate of the fourth memory cell,

the method comprising:

performing a first operation, the first operation including

supplying a first program voltage to the first word line, and

supplying a first select voltage to the first select gate line;

performing a second operation after the first operation, the second operation including

supplying a second program voltage to the first word line, and

supplying a second select voltage to the second select gate line;

performing a third operation after the second operation, the third operation including

supplying a third program voltage to the second word line, and

supplying a third select voltage to the first select gate line; and

performing a fourth operation after the third operation, the fourth operation including

supplying a fourth program voltage to the second word line, and

supplying a fourth select voltage to the second select gate line.

14. The method according to claim 13 , wherein

the first select transistor, the first memory cell and the second memory cell of the first memory string are electrically connected in series, and

the second select transistor, the third memory cell and the fourth memory cell of the second memory string are electrically connected in series.

15. The method according to claim 13 , wherein

the second operation is performed immediately after the first operation, and

the fourth operation is performed immediately after the third operation.

16. The method according to claim 13 , wherein

in the first operation, first data is written in the first memory cell,

in the second operation, second data is written in the third memory cell,

in the third operation, third data is written in the second memory cell, and

in the fourth operation, fourth data is written in the fourth memory cell.

17. The method according to claim 13 , wherein

the first operation further includes

supplying a first transfer voltage to the second word line,

the second operation further includes

supplying a second transfer voltage to the second word line,

the third operation further includes

supplying a third transfer voltage to the first word line, and

the fourth operation further includes

supplying a fourth transfer voltage to the first word line.

18. The method according to claim 17 , wherein

the first to fourth program voltages are substantially the same,

the first to fourth select voltages are substantially the same, and

the first to fourth transfer voltages are substantially the same.

Assignments (3)
CHANGE OF NAME AND ADDRESS Recorded Jan 22, 2021
From: K.K. PANGEA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 055669/0401 →
MERGER Recorded Jan 22, 2021
From: TOSHIBA MEMORY CORPORATION
To: K.K. PANGEA
Reel/Frame 055659/0471 →
CHANGE OF NAME AND ADDRESS Recorded Jan 22, 2021
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 055669/0001 →
Priority Claims (1)
JP 2012-128727 · Jun 6, 2012 · national
Continuity (4)
Continuation 15337852 · Oct 28, 2016
Continuation 14833719 · Aug 24, 2015
Continuation 13779427 · Feb 27, 2013
Related Publication 20180039428A1 · Feb 8, 2018
Cited By (1)
US 12,266,404