Multi-layer package with integrated antenna

1. An integrated circuit (IC) package assembly comprising:

a first layer having a first side and a second side disposed opposite to the first side;

a second layer coupled with the first side of the first layer;

one or more antenna elements coupled with the second layer;

a third layer coupled with the second side of the first layer, wherein the first layer is a reinforcement layer having a tensile modulus that is greater than a tensile modulus of the second layer and the third layer;

wherein the first layer defines a plane extending in a horizontal direction; and

wherein no plated metal features for routing electrical signals in the horizontal direction are directly disposed on the first layer.

2. The IC package assembly of claim 1 , wherein:

the second layer and the third layer have a same material composition; and a surface roughness of the second layer and the third layer is less than a surface roughness of the first layer.

3. The IC package assembly of claim 1 , wherein:

the first layer comprises liquid crystal polymer (LCP) or prepreg material; and

the second layer and the third layer comprise LCP or an epoxy-based material.

4. The IC package assembly of claim 3 , wherein:

the first layer comprises LCP with glass; and

the second layer and the third layer comprise LCP without glass.

5. The IC package assembly of claim 1 , wherein:

the one or more antenna elements comprise one or more plated metal features formed on the second layer.

6. The IC package assembly of claim 1 , wherein a first side of the third layer is coupled with the second side of the first layer, the IC package assembly further comprising:

an electrical routing feature disposed on a second side of the third layer, the second side of the third layer being disposed opposite to the first side of the third layer; and

a via structure or plated-through hole structure coupled with the electrical routing feature and the one or more antenna elements, the via structure or plated-through hole structure extending through the first layer, the second layer and the third layer.

7. The IC package assembly of claim 1 , wherein the one or more antenna elements include a first capacitive element, the IC package assembly further comprising:

a second capacitive element directly coupled with the third layer, wherein the first capacitive element and the second capacitive element are components of a multi-layer capacitively coupled antenna.

8. The IC package assembly of claim 1 , further comprising:

a fourth layer having a first side and a second side disposed opposite to the first side;

a fifth layer coupled with the first side of the fourth layer; and

a sixth layer coupled with the second side of the fourth layer, wherein the fourth layer is a reinforcement layer having a tensile modulus that is greater than a tensile modulus of the fifth layer and the sixth layer, wherein the fifth layer is coupled with the third layer.

9. The IC package assembly of claim 1 , further comprising:

an antenna ground layer coupled with the third layer; and

a radio frequency (RF) die coupled with the antenna ground layer.

10. A method of fabricating a multi-layer package assembly, the method comprising:

providing a first layer having a first side and a second side disposed opposite to the first side;

coupling a second layer with the first side of the first layer;

coupling a third layer with the second side of the first layer;

forming one or more antenna elements on the second layer, wherein the first layer is a reinforcement layer having a tensile modulus that is greater than a tensile modulus of the second layer and the third layer;

wherein coupling the second layer with the first side of the first layer or coupling the third layer with the second side of the first layer is performed by lamination;

wherein forming the one or more antenna elements comprises plating the second layer with a metal; and

forming an opening for a via or plated-through hole (PTH) through the first layer, the second layer and the third layer.

11. The method of claim 10 , further comprising:

depositing a metal to fill the opening during a same metal deposition process that is used to form the one or more antenna elements.

12. The method of claim 10 , further comprising:

forming a solder mask layer on the second layer.

13. A computing device comprising:

a circuit board; and

an integrated circuit (IC) package assembly coupled with the circuit board, the IC package assembly including:

a first layer having a first side and a second side disposed opposite to the first side;

a second layer coupled with the first side of the first layer;

one or more antenna elements coupled with the second layer;

a third layer coupled with the second side of the first layer, wherein the first layer is a reinforcement layer having a tensile modulus that is greater than a tensile modulus of the second layer and the third layer;

an antenna ground layer coupled with the third layer; and

a radio frequency (RF) die coupled with the antenna ground layer.

14. The computing device of claim 13 , wherein a first side of the third layer is coupled with the second side of the first layer, the IC package assembly further comprising:

an electrical routing feature disposed on a second side of the third layer, the second side of the third layer being disposed opposite to the first side of the third layer; and

a via structure or plated-through hole structure coupled with the electrical routing feature and the one or more antenna elements, the via structure or plated-through hole structure extending through the first layer, the second layer and the third layer.

15. The computing device of claim 13 , wherein:

the computing device is a mobile computing device including one or more of a display, a touchscreen display, a touchscreen controller, a battery, an audio codec, a video codec, a power amplifier, a global positioning system (GPS) device, a compass, a Geiger counter, an accelerometer, a gyroscope, a speaker, or a camera coupled with the circuit board.