Chip substrate provided with joining grooves in lens insert
A chip substrate includes: a plurality of conductive layers horizontally stacked and constituting the chip substrate; a plurality of insulation layers alternately with the conductive layers and electrically separating the conductive layers; a lens insert comprising a groove having a predetermined number of edges on the upper surface of the chip substrate and having a cross-section wherein an arc is formed at the region where the extended edges meet; a cavity comprising a groove reaching down to a predetermined depth towards the area accommodating the insulation layer within the internal region of the lens insert; and a plurality of joining grooves formed on the surface of the lens insert. Thus, the lens to be inserted also can be formed to be a shape comprising straight lines so that the manufacturing process of the lens to be inserted into the chip substrate can be further simplified.
1. A chip substrate comprising:
a plurality of conductive layers arranged horizontally;
a plurality of insulation layers arranged alternately with said plurality of conductive layers and electrically separating said plurality of conductive layers from one another;
a lens insert depressed from an upper surface of the chip substrate, the lens insert having a shape of a polygon whose corners are convex arc-shaped;
a cavity reaching down to a predetermined depth at an area including at least a part of said plurality of insulation layers within said lens insert; and
a plurality of joining grooves formed on a surface of said lens insert.
2. The chip substrate according to claim 1 , further comprising:
a first metal pad formed on a unit area on said plurality of conductive layers being separated by at least one of said plurality of insulation layers inside said cavity.
3. The chip substrate according to claim 2 , further comprising:
a second metal pad being successively formed on the plurality of insulation layers separated from the plurality of insulation layers inside said cavity.
4. The chip substrate according to claim 1 , wherein
said joining grooves include:
a first joining groove being formed surrounding an outer area of said cavity on the surface of said lens insert; and
a second joining groove being formed surrounding said first joining groove.
5. The chip substrate according to claim 1 , wherein
said chip substrate further includes:
a heat radiating portion being attached to a bottom surface of said chip substrate.
6. The chip substrate according to claim 2 , wherein
said chip substrate further includes:
a plurality of marking portions to indicate said unit areas inside said cavity.
7. The chip substrate according to claim 1 , wherein
said chip substrate further includes:
an electrode marking portion to indicate an electrode for at least any one conductive layer of said plurality of conductive layers separated by an insulation layer of said plurality of insulation layers on the upper surface of said chip substrate.
8. The chip substrate according to claim 1 , wherein
said chip substrate further includes:
a plurality of side grooves, at side surfaces of said chip substrate, inwardly concave and accommodating said plurality of insulation layers.