PCB assembly with molded matrix core
Methods and devices related to the design and fabrication of molded cores for printed circuit board assemblies and system-on-package (SIP) devices are discussed. The discussed printed circuit board assemblies may have multiple electrical components embedded in a molded core matrix and forming electrical connections with one or more printed circuit boards attached to the molded core matrix. Methods for sourcing of electrical components and production of the molded cores and printed circuit board assemblies are also discussed. The methods and devices may increase a volumetric density of electrical components in printed circuit board assemblies and provide improved mechanical properties to the electrical circuit device.
1. A printed circuit board assembly comprising:
a first printed circuit board;
a first electrical component mounted and electrically coupled to the first printed circuit board and having a first height measured along a direction perpendicular to the first printed circuit board;
a second electrical component mounted and electrically coupled to the first printed circuit board, and having a second height measured along the direction perpendicular to the first printed circuit board, the second height substantially identical to the first height;
a second printed circuit board separated from the first printed circuit board by a distance substantially identical to the first height, wherein the first electrical component and the second electrical component are mounted to and electrically coupled to the second printed circuit board; and
a mold occupying all portions of a first region of the first printed circuit board that are unoccupied by any electrical component disposed between the first printed circuit board and the second printed circuit board.
2. The printed circuit board assembly of claim 1 , wherein the mold as measured in the direction perpendicular to the first printed circuit board is substantially identical to the first height.
3. The printed circuit board assembly of claim 1 , wherein the first electrical component and the second electrical component each include at least one dimension that complies with a standard for a case size.
4. The printed circuit board assembly of claim 1 , wherein the first height of the first electrical component is substantially 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.8 mm, 1.0 mm, 1.25 mm 1.5 mm, 1.6 mm, 2.0 mm, 2.5 mm, 3.2 mm, 4.5 mm, 5.0 mm, 6.3 mm, 5.1 mm, 7.3 mm, or 7.4 mm.
5. The printed circuit board assembly of claim 1 , comprising a third electrical component disposed between the first printed circuit board and the second printed circuit board and mounted only to the first printed circuit board.
6. The printed circuit board assembly of claim 5 , comprising a fourth electrical component disposed in a surface of the first printed circuit board opposite to the surface of the first printed circuit board to which the first electrical component is mounted.
7. The printed circuit board assembly of claim 1 , wherein the first printed circuit board comprises a second region adjacent to the first region, wherein the second region does not comprise the mold.
8. The printed circuit board assembly of claim 7 , wherein the second region comprises a third printed circuit board and a second mold occupying all portions of the second region of the printed circuit board that are unoccupied by any electrical component disposed between the first printed circuit board and the third printed circuit board.
9. The printed circuit board assembly of claim 7 , wherein the second region of the first printed circuit board comprises a flexible region of the printed circuit board.
10. The printed circuit board assembly of claim 1 , wherein the first printed circuit board is a multilayer printed circuit board.
11. The printed circuit board assembly of claim 1 , wherein the first printed circuit board comprises a first shielding layer and the second printed circuit board comprises a second shielding layer, and wherein the mold comprises at least one via that electrically couples a first shielding pad in the first shielding layer and a second shielding pad in the second shielding layer.
12. The printed circuit board assembly of claim 1 , wherein the first electrical component comprises a resistor, a capacitor, an inductor, or a semiconducting component.
13. A device comprising:
a first electrical component having a first height measured along a direction perpendicular to a plane;
a second electrical component having a first length substantially similar to the first height, and disposed such that the first length is oriented the direction perpendicular to the plane; and
a mold supporting the first electrical component and the second electrical component, wherein the mold has a thickness substantially similar to the first height as measured along the direction perpendicular to the plane, and wherein the first electrical component comprises a first termination disposed on a top of the mold and a second termination at a bottom of the mold, and wherein the second electrical component comprises a third termination disposed on the top of the mold and a fourth termination disposed on the bottom of the mold.
14. The device of claim 13 , wherein the device is attached to a first printed circuit board on a first surface of the mold parallel to the plane, wherein the attachment of the first printed circuit board to the mold electrically couples the first electrical component and the second electrical component to the first printed circuit board, and the device is configured to be attached to a second printed circuit board on a second surface of the mold opposite to the first surface of the mold, wherein the attachment of the second printed circuit board to the mold electrically couples the first electrical component and the second electrical component to the second printed circuit board.
15. The device of claim 13 , wherein the device comprises a solder ball in contact with the second electrical component, wherein the first length includes a dimension of the solder ball and the first length is substantially identical to the first height.
16. The device of claim 13 , comprising a third electrical component supported by the mold and disposed such that a dimension of the third electrical component measured along a direction perpendicular to the plane is substantially smaller than the first height.
17. The device of claim 13 , wherein the first electrical component comprises a resistor, a capacitor, an inductor, or a semiconducting component.