Process for producing heat-expandable microspheres and application thereof
A process for producing heat-expandable microspheres including a thermoplastic resin shell and a blowing agent encapsulated therein. The process includes the steps of dispersing a polymerizable component and the blowing agent in an aqueous dispersion medium having a pH of 7 or less and containing a fine-particle metal compound having a mean particle size ranging from 1.0 to 10 nm, and polymerizing the polymerizable component. The amount of the fine-particle metal compound ranges from 0.15 to 20 parts by weight to 100 parts by weight of the total amount of the polymerizable component and the blowing agent. Also disclosed are heat-expandable microspheres produced by dispersing a polymerizable component and a blowing agent in an aqueous dispersion medium containing colloidal silica and polymerizing the polymerizable component. Also disclosed is a composition containing the heat-expandable microspheres and a base component, a formed product, a slurry composition for use in forming a negative electrode of a lithium-ion secondary battery and a negative electrode.
1. A process for producing heat-expandable microspheres comprising a thermoplastic resin shell and a blowing agent encapsulated therein, said process comprising the steps of:
dispersing a polymerizable component and the blowing agent in an aqueous dispersion medium having a pH of 7 or less and containing a fine-particle metal compound having a mean particle size ranging from 1.0 to 10 nm; and
polymerizing the polymerizable component;
wherein an amount of the fine-particle metal compound ranges from 0.15 to 20 parts by weight to 100 parts by weight of the total amount of the polymerizable component and the blowing agent,
a mean particle size of the heat-expandable microspheres ranges from 0.01 to 9.0 μm,
the heat-expandable microspheres contain 10 wt % or less of ash,
a specific surface area of the fine-particle metal compound ranges from 270 to 2720 m 2 /g, and
an amount of an electrolyte is less than 5 wt % of the aqueous dispersion medium.
2. The process for producing heat-expandable microspheres as claimed in claim 1 , wherein the fine-particle metal compound comprises colloidal silica.
3. The process for producing heat-expandable microspheres as claimed in claim 2 , wherein the heat-expandable microspheres contain 5 wt % or less of silicon.
4. The process for producing heat-expandable microspheres as claimed in claim 1 , wherein the aqueous dispersion medium has a pH ranging from 1.5 to 5.