Method for fabricating MEMS switch with reduced dielectric charging effect
The present disclosure provides methods of fabricating a micro-electro-mechanical systems (MEMS) switch. The methods include providing a substrate, forming a first dielectric layer disposed above the substrate, forming a bump above the first dielectric layer, providing a movable member including a top actuation electrode, and forming at least one support member that includes the first dielectric layer and is directly below the top actuation electrode. The top actuation electrode is electrically coupled to the bump.
1. A method of fabricating a micro-electro-mechanical systems (MEMS) switch, the method comprising:
providing a substrate;
forming a first dielectric layer disposed above the substrate;
forming a bump above the first dielectric layer;
forming a bottom signal electrode above the first dielectric layer;
enclosing the bottom signal electrode in a second dielectric layer;
forming a first via in the second dielectric layer;
forming a metal contact over the second dielectric layer, wherein the metal contact is electrically coupled to the bottom signal electrode by the first via;
providing a movable member including a top actuation electrode, wherein the top actuation electrode is electrically coupled to the bump; and
forming at least one support member that comprises the first dielectric layer and is directly below the top actuation electrode.
2. The method of claim 1 , further comprising forming a bottom actuation electrode above the first dielectric layer.
3. The method of claim 2 , further comprising disposing the top actuation electrode above the bottom actuation electrode.
4. The method of claim 2 , wherein forming the bump includes forming the bump between the bottom signal electrode and the bottom actuation electrode.
5. The method of claim 1 , wherein the movable member further includes a top signal electrode disposed above the first dielectric layer.
6. The method of claim 5 , wherein the metal contact is below the top signal electrode.
7. The method of claim 1 , wherein the top actuation electrode is electrically coupled to the bump by at least one via and one line through the first dielectric layer.
8. A method of fabricating a micro-electro-mechanical systems (MEMS) switch, the method comprising:
providing a substrate;
forming a first dielectric layer above the substrate;
providing a movable member including two top actuation electrodes above the first dielectric layer;
forming a bottom signal electrode over the first dielectric layer;
enclosing the bottom signal electrode in a second dielectric layer;
forming a metal contact over the second dielectric layer, wherein the metal contact is electrically coupled to the bottom signal electrode by a first via; and
forming at least two support members that comprise the first dielectric layer and are each directly below a respective top actuation electrode,
wherein each of the top actuation electrodes is disposed above a respective bump, and
wherein each of the top actuation electrodes is electrically coupled to the respective bump by at least one via and one line through the first dielectric layer.
9. The method of claim 8 , further comprising disposing each of the bumps between the bottom signal electrode and a bottom actuation electrode.
10. The method of claim 8 , wherein each of the bumps is comprised of a dielectric layer disposed above a metal layer, or each of the bumps is comprised of a metal.
11. The method of claim 8 , wherein the movable member further includes a top signal electrode disposed above the first dielectric layer.
12. The method of claim 11 , wherein the metal contact is disposed below the top signal electrode.
13. The method of claim 8 , further comprising:
forming the first via in the second dielectric layer.
14. A method of fabricating a micro-electro-mechanical systems (MEMS) switch, the method comprising:
providing a substrate;
forming a first dielectric layer above the substrate;
forming a bump above the first dielectric layer;
forming a bottom signal electrode over the first dielectric layer;
enclosing the bottom signal electrode in a second dielectric layer;
forming a metal contact over the second dielectric layer, wherein the metal contact is electrically coupled to the bottom signal electrode by a first via;
providing a movable member including a top actuation electrode disposed above the bump;
forming a bottom actuation electrode above the first dielectric layer, wherein a cavity is provided by at least a top surface of the bottom actuation electrode and a top surface of the metal contact;
forming a conductive component for coupling the top actuation electrode to the bump; and
forming at least one support member that comprises the first dielectric layer that is directly below the top actuation electrode.
15. The method of claim 14 , wherein the at least one support member contacts an end of the top actuation electrode.
16. The method of claim 14 , wherein forming the bump includes forming the bump between the bottom signal electrode and the bottom actuation electrode.
17. The method of claim 16 , wherein forming the bump includes forming the bump as a metal layer having a thickness greater than the bottom actuation electrode or as a dielectric layer over a metal layer having a total thickness greater than the bottom actuation electrode.
18. The method of claim 14 , wherein the conductive component comprises at least one via and one line through the first dielectric layer.
19. The method of claim 14 , wherein the metal contact is below a top signal electrode.
20. The method of claim 14 , further comprising:
forming the first via in the second dielectric layer.