Apparatus and method for ascertaining orientation errors
A device for determining alignment errors of structures which are present on, or which have been applied to a substrate, comprising a substrate holder for accommodating the substrate with the structures and detection means for detecting X-Y positions of first markings on the substrate and/or second markings on the structures by moving the substrate or the detection means in a first coordinate system, wherein in a second coordinate system which is independent of the first coordinate system X′-Y′ structure positions for the structures are given whose respective distance from the X-Y positions of the first markings and/or second markings can be determined by the device.
1. A device determining alignment errors of structures which are present on, or which have been applied to, a substrate, comprising:
at least one fixable optic that is fixed in a first coordinate system when recognizing first alignment marks and respective X-Y positions of second alignment marks, the optic being configured to recognize the first alignment marks distributed on a surface of the substrate in a field of view of the optic to set an origin of the first coordinate system, the optic being further configured to recognize the respective X-Y positions of the second alignment marks positioned on the structures in the field of view of the optic after the origin of the first coordinate system is set;
a substrate holder configured to fixably hold the substrate and translationally and/or rotationally move in an X and Y direction in the first coordinate system to position the substrate in the field of view of the optic such that the origin of the first coordinate system can be set and the respective X-Y positions of the second alignment marks can be recognized; and
a computer configured to define a second coordinate system in which ideal X′-Y′ structure positions for the structures are given, the second coordinate system being independent of the first coordinate system, the computer being further configured to generate and store the respective ideal X′-Y′ structure positions for the structures defined with reference to the second coordinate system, the computer being further configured to determine respective distances between the ideal X′-Y′ structure positions for the structures and the recognized X-Y positions of the second alignment marks on the structures that respectively correspond with the ideal X′-Y′ structure positions for the structures, the computer being further configured, after treatment of the substrate, to perform a post-treatment determining of post-treatment respective distances between the ideal X′-Y′ structure positions for the structures and post-treatment X-Y positions of the second alignment marks on the structures that respectively correspond with the ideal X′-Y′ structure positions for the structures,
wherein the optic is fixed in the first coordinate system when recognizing the post-treatment X-Y positions of the second alignment marks, and
wherein the optic is further configured to recognize the post-treatment X-Y positions of the second alignment marks on the structures to enable the computer to perform the post-treatment determining.
2. The device as claimed in claim 1 , wherein the second coordinate system is a coordinate system with reference to which a structure position field is defined, the structure position field comprising the respective ideal X′-Y′ structure positions for the structures.
3. The device as claimed in claim 1 , further comprising an alignment means, in the form of a receiving apparatus which accommodates the substrate holder and which can move in the X and Y direction of the first coordinate system, the alignment means being configured to align the substrate relative to the second coordinate system according to the recognized X-Y positions of the second alignment marks.
4. The device as claimed in claim 1 , wherein the recognized X-Y positions of the second alignment marks and/or the ideal X′-Y′ structure positions for the structures are stored jointly in a position map which is assigned to the second coordinate system or which is correlated with it.
5. The device as claimed in claim 1 , wherein the substrate holder is further configured to translationally move in a Z direction in the first coordinate system.
6. A method for determining alignment errors of structures which are present on, or which have been applied to, a substrate accommodated by a substrate holder, the method being comprised of the following steps:
fixing the substrate on the substrate holder, the substrate having first alignment marks distributed on a surface and second alignment marks positioned on the structures;
moving the substrate holder translationally and/or rotationally in an X and Y direction in a first coordinate system to position the substrate in a field of view of at least one fixable optic, the first and second alignment marks being in the field of view of the optic;
first recognizing, via the optic, the first alignment marks to set an origin of the first coordinate system;
second recognizing, via the optic, respective X-Y positions of the second alignment marks after the origin of the first coordinate system is set;
defining, using a computer, a second coordinate system in which ideal X′-Y′ structure positions for the structures are given, the second coordinate system being independent of the first coordinate system;
generating and storing, using the computer, the respective ideal X′-Y′ structure positions for the structures defined with reference to the second coordinate system;
determining respective distances between the ideal X′-Y′ structure positions for the structures and the recognized X-Y positions of the second alignment marks on the structures that respectively correspond with the ideal X′-Y′ structure positions for the structures;
treating the substrate;
post-treatment recognizing, via the optic, post-treatment X-Y positions of the second alignment marks on the structures; and
post-treatment determining of post-treatment respective distances between the ideal X′-Y′ structure positions for the structures and the post-treatment recognized X-Y positions of the second alignment marks on the structures that respectively correspond with the ideal X′-Y′ structure positions for the structures,
wherein the optic is fixed in the first coordinate system during the first recognizing, the second recognizing, and the post-treatment recognizing.
7. The method as claimed in claim 6 , wherein an alignment of the substrate relative to the second coordinate system, according to the recognized X-Y positions of the second alignment marks, takes place by alignment means that is in the form of a receiving apparatus which accommodates the substrate holder and which can move in the X and Y direction of the first coordinate system.
8. The method as claimed in claim 6 , wherein the recognized X-Y positions of the second alignment marks and/or the ideal X′-Y′ structure positions for the structures are stored especially jointly in a position map which is assigned especially to the second coordinate system or which is correlated with it.
9. The method as claimed in claim 6 , wherein the substrate holder is further translationally moved in a Z direction in the first coordinate system.