Electronic device housing and manufacturing method thereof by die-casting an aluminum alloy
An electronic device housing ( 100 ) comprises outer frame ( 10 ) and a die casting inner frame ( 20 ). The die casting inner frame is shaped by means of die casting and is jogged in the outer frame. The present invention also comprises a method for manufacturing the electronic device housing.
1. A housing of an electronic device, comprising:
an outer frame; and
a die-casting metal inner frame, wherein the die-casting inner frame is formed by die casting and is embedded in the outer frame;
wherein the outer frame comprises a base plate, a side plate, and an engaging portion, the side plate surrounds an edge of the base plate, the side plate and the base plate cooperatively forms a cavity, the engaging portion is formed on a side of the side plate facing the cavity, the engaging portion extends along a longitudinal direction of the side plate, the die-casting metal inner frame has an embedding structure embedded to the engaging portion;
wherein the engaging portion is located at a middle portion of the side plate and has a width less than a width of the side plate; the side plate further comprises a plurality of buckling portions formed on the engaging portion, the embedding structure is embedded on the plurality of buckling portions.
2. The housing of the electronic device of claim 1 , wherein the outer frame is made of aluminum alloy containing silicon, a mass fraction of the silicon is less than 0.1%, and the outer frame has an outer surface subjected to an anodic oxidation treatment.
3. The housing of the electronic device of claim 1 , wherein the plurality of buckling portions are spaced arranged on the engaging portion and protrude outwardly, the buckling portion has a width greater than a width of the engaging portion, each buckling portion defines two spaced buckling holes, the buckling hole extends in a direction perpendicular to an extending direction of the engaging portion, and the buckling hole penetrates through the buckling portion.
4. The housing of the electronic device of claim 1 , wherein the plurality of latching portions are corresponding to corner positions of the base plate, and the embedding structure is embedded on the plurality of latching portions.
5. The housing of the electronic device of claim 4 , wherein each latching portion comprises two latching strips protruding towards the cavity, the two latching strips are spaced arranged along a width direction of the side plate, each latching strip is bent at the corner position of the base plate, and two ends of the latching strip are aligned with two adjacent edges of the base plate, respectively.
6. The housing of the electronic device of claim 1 , wherein the outer frame and the die-casting inner frame define micropores of micro nanometer level; the housing of the electronic device further comprises a plastic member injection-molded in the outer frame and on the die-casting metal inner frame, wherein the plastic member is engaged in the micropores of micro nanometer level.
7. A method of manufacturing a housing of an electronic device, comprising the following steps of:
forming an outer frame;
die-casting a metal die-casting metal inner frame in the outer frame, the die-casting inner frame being embedded in the outer frame; and
subjecting an outer surface of the outer frame to anodic oxidation to form the housing of the electronic device comprising:
etching micropores of micro nanometer level on a surface of the housing of the electronic device; and lacing the housing of the electronic device in a plastic mold for insert molding to form a plastic member on the housing of the electronic device; and
placing the housing of the electronic device in a plastic mold for insert molding to form a plastic member on the housing of the electronic device.