Sealant composition and method of preparing the same
View Patent ↗Disclosed are a sealant composition and a method of preparing the same wherein the sealant composition comprises: 70-80 wt % of a low-viscosity epoxy acrylate conforming to the structure of Formula I, 0.5-1 wt % of a photoinitiator, 5-15 wt % of silica microspheres, 5-15 wt % of resinous elastic microspheres, and 1-2 wt % of silane coupling agent, based on the total weight of the sealant composition wherein R 1 and R 2 are as defined herein. The sealant has improved coating linearity.
1. A method of preparing a sealant composition, wherein the sealant composition comprises:
(a) from >75 wt % to 80 wt % of a low-viscosity epoxy acrylate conforming to the structure of Formula I;
wherein R 1 and R 2 are each independently selected from the group consisting of methyl, ethyl, propyl, isopropyl, butyl, isobutyl, and tert-butyl;
(b) 0.5-1 wt % of a photoinitiator;
(c) 5-15 wt % of silica microspheres having a diameter of 0.5-0.9 μm;
(d) 5-15 wt % of resinous elastic microspheres; and
(e) 1-2 wt % of silane coupling agent,
based on a total weight of the sealant composition,
the method comprising: mixing and stirring all components, except the low-viscosity epoxy acrylate, at a temperature of 20-30° C. for 30-60 min; compounding the mixture at a temperature of 30° C.-50° C. twice, each time for 20-40 min; degassing the compounded mixture; and then adding the low-viscosity epoxy acrylate to adjust a viscosity of the degassed compounded mixture, to produce the sealant composition.
2. The method of claim 1 , wherein the mixing and stirring all of the components, except the low-viscosity epoxy acrylate, is at a temperature of 20° C. for 40 min; the compounding the mixture is at a temperature of 40° C. twice, each time for 30 min; and the adding the low-viscosity epoxy acrylate is to adjust the viscosity of the degassed compounded mixture to 250±10 Pa·s.