Multi-chip self adjusting cooling solution
An apparatus including a primary device and at least one secondary device coupled in a planar array to a substrate; a first passive heat exchanger disposed on the primary device and having an opening over an area corresponding to the at least one secondary device; a second passive heat exchanger disposed on the at least one secondary device; at least one first spring operable to apply a force to the first heat exchanger in a direction of the primary device; and at least one second spring operable to apply a force to the second heat exchanger in the direction of the secondary device. A method including placing a passive heat exchanger on a multi-chip package, and deflecting a spring to apply a force in a direction of an at least one secondary device on the package.
1. An apparatus comprising:
a primary device and at least one secondary device coupled in a planar array to a substrate;
a first passive heat exchanger comprising a heatsink base and a fin structure disposed on the primary device and the heatsink base and the fin structure of the first passive heat exchanger both comprise an opening over an area corresponding to the at least one secondary device, wherein the heatsink base of the first passive heat exchanger has a bottommost surface;
at least one second passive heat exchanger comprising a heatsink base and a fin structure both disposed in the opening and on the at least one secondary device;
at least one first spring operable to apply a force to the first passive heat exchanger in a direction of the primary device, the at least one first spring between the substrate and the heatsink base of the first passive heat exchanger; and
at least one second spring operable to apply a force to the at least one second passive heat exchanger in a direction of the at least one secondary device, the at least one second spring between the heatsink base of the first passive heat exchanger and the heatsink base of the at least one second passive heat exchanger, wherein the at least one second spring extends below the bottommost surface of the heatsink base of the first passive heat exchanger.
2. The apparatus of claim 1 , wherein a thickness dimension of the primary device on the substrate is different than a thickness dimension of the at least one secondary device.
3. The apparatus of claim 1 , wherein the heatsink base of the first passive heat exchanger comprises a first thickness in an area corresponding to the primary device and in an area adjacent the opening comprises a second thickness that is less than the first thickness.
4. The apparatus of claim 1 , wherein the at least one second spring is disposed across a dimension of the fin structure of the at least one second passive heat exchanger.
5. The apparatus of claim 4 , wherein a thickness dimension of the primary device on the substrate is different than a thickness dimension of the at least one secondary device and the at least one second spring is operable to displace the heatsink of the at least one second passive heat exchanger toward the at least one secondary device.
6. The apparatus of claim 5 , wherein the thickness dimension of the primary device on the substrate is greater than the thickness dimension of the at least one secondary device.
7. The apparatus of claim 1 , wherein the heatsink base of the first passive heat exchanger has a thickness selected to justify the heatsink base of the first passive heat exchanger with the primary device.
8. The apparatus of claim 1 , wherein the at least one second spring is a coil spring or a wave spring to maintain a mechanical load of the heatsink base of the at least one second passive heat exchanger.