IP Library › Granted Patent US 10,141,510

Granted Patent B2

US 10,141,510 · App. 15/321,554 · Granted Nov 27, 2018

OLED display panel, manufacturing method thereof and display device

Inventors: Wenjun Hou (Beijing, CN); Ying Cui (Beijing, CN)

Assignee: BOE TECHNOLOGY GROUP CO., LTD.

H01L51/0005 H01L27/3211 H01L27/3216 H01L51/0004 H01L51/0097 H01L51/5056 H01L51/5072 H01L51/5088 H01L51/56 H01L2251/558

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Quick Facts

Patent No.: US 10,141,510
App. No.: 15/321,554
Granted: Nov 27, 2018
Kind: B2

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USPTO Patent Center↗ Full Patent PDF↗

Abstract

An organic light emitting diode display panel, a manufacturing method thereof and a display device are disclosed, for reducing the number of inkjet heads used in inkjet printing or alleviating the swath mura at printing interfaces. The method comprises manufacturing an anode layer, a light emitting layer and a cathode layer on a base substrate, and the method can further comprise manufacturing by an entire-surface coating process a function layer having a first preset thickness between the anode layer and the light emitting layer; and in a first preset region of the function layer that has been manufactured, manufacturing by an inkjet printing process a function layer having a second preset thickness.

Claims (59)

1. A manufacturing method of an organic light emitting diode display panel, comprising manufacturing an anode layer, a light emitting layer and a cathode layer on a base substrate, wherein the method further comprises:

manufacturing by an entire-surface coating process a hole injection layer having a first preset thickness between the anode layer and the light emitting layer; and

manufacturing by an inkjet printing process a hole injection layer having a second preset thickness in a first preset region of the hole injection layer having the first preset thickness,

wherein an area of the first preset region is smaller than that of an upper surface of the hole injection layer having the first preset thickness, such that different pixel regions of the organic light emitting diode display panel have hole injection layers with different thicknesses.

2. The manufacturing method of an organic light emitting diode display panel according to claim 1 ,

wherein the method further comprises:

manufacturing by an entire-surface coating process a hole transport layer having a third preset thickness between the light emitting layer and an integrated hole injection layer comprising both the hole injection layer having the first preset thickness and the hole injection layer having the second thickness; and

in a second preset region of the hole transport layer that has been manufactured, manufacturing by an inkjet printing process a hole transport layer having a fourth preset thickness.

3. The manufacturing method of an organic light emitting diode display panel according to claim 2 , wherein the organic light emitting diode display panel comprises an R pixel region, a G pixel region and a B pixel region, the thickness of the hole injection layer corresponding to the R pixel region being a fifth preset thickness, the thickness of the hole injection layer corresponding to the G pixel region being a sixth preset thickness, and the thickness of the hole injection layer corresponding to the B pixel region being a seventh preset thickness, wherein the fifth preset thickness is smaller than the sixth preset thickness, and the sixth preset thickness is smaller than the seventh preset thickness.

4. The manufacturing method of an organic light emitting diode display panel according to claim 3 , wherein manufacturing the integrated hole injection layer comprises steps as follows:

manufacturing by an entire-surface coating process a hole injection layer having the fifth preset thickness between the anode layer and the light emitting layer, the fifth preset thickness being the first preset thickness;

manufacturing by an inkjet printing process a hole injection layer in a region corresponding to the G pixel region on the hole injection layer having the fifth preset thickness such that the thickness of the hole injection layer in the region corresponding to the G pixel region is the sixth preset thickness; and

manufacturing by an inkjet printing process a hole injection layer in a region corresponding to the B pixel region on the hole injection layer having the fifth preset thickness such that the thickness of the hole injection layer in the region corresponding to the B pixel region is the seventh preset thickness.

5. The manufacturing method of an organic light emitting diode display panel according to claim 3 , wherein manufacturing the integrated hole injection layer comprises steps as follows:

manufacturing by an inkjet printing process a hole injection layer in both a region corresponding to the G pixel region and a region corresponding to the B pixel region on the hole injection layer having the fifth preset thickness such that the thickness of the hole injection layer in both the region corresponding to the G pixel region and the region corresponding to the B pixel region is the sixth preset thickness; and

manufacturing by an inkjet printing process a hole injection layer in a region corresponding to the B pixel region on the hole injection layer having the sixth preset thickness such that the thickness of the hole injection layer in the region corresponding to the B pixel region is the seventh preset thickness.

6. A manufacturing method of an organic light emitting diode display panel, comprising manufacturing an anode layer, a light emitting layer and a cathode layer on a base substrate, wherein the method further comprises:

manufacturing by an entire-surface coating process a hole transport layer having a first preset thickness between the anode layer and the light emitting layer; and

manufacturing by an inkjet printing process a hole transport layer having a second preset thickness in a first preset region of the hole transport layer having the first preset thickness,

wherein the organic light emitting diode display panel comprises an R pixel region, a G pixel region and a B pixel region, the thickness of the hole transport layer corresponding to the R pixel region being an eighth preset thickness, the thickness of the hole transport layer corresponding to the G pixel region being a ninth preset thickness, and the thickness of the hole transport layer corresponding to the B pixel region being a tenth preset thickness, wherein the eighth preset thickness is smaller than the ninth preset thickness, and the ninth preset thickness is smaller than the tenth preset thickness.

7. The manufacturing method of an organic light emitting diode display panel according to claim 6 , wherein manufacturing an integrated hole transport layer comprises steps as follows:

manufacturing by an entire-surface coating process a hole transport layer having the eighth preset thickness between the anode layer and the light emitting layer;

manufacturing by an inkjet printing process a hole transport layer in a region corresponding to the G pixel region on the hole transport layer having the eighth preset thickness such that the thickness of the hole transport layer in the region corresponding to the G pixel region is the ninth preset thickness; and

manufacturing by an inkjet printing process a hole transport layer in a region corresponding to the B pixel region on the hole transport layer having the eighth preset thickness such that the thickness of the hole injection layer in the region corresponding to the B pixel region is the tenth preset thickness.

8. The manufacturing method of an organic light emitting diode display panel according to claim 6 , wherein manufacturing an integrated hole transport layer comprises steps as follows:

manufacturing by an entire-surface coating process a hole transport layer having the eighth preset thickness between the anode layer and the light emitting layer;

manufacturing by an inkjet printing process a hole transport layer in both a region corresponding to the G pixel region and a region corresponding to the B pixel region on the hole transport layer having the eighth preset thickness such that the thickness of the hole transport layer in both the region corresponding to the G pixel region and the region corresponding to the B pixel region is the ninth preset thickness; and

manufacturing by an inkjet printing process a hole transport layer in a region corresponding to the B pixel region on the hole transport layer having the ninth preset thickness such that the thickness of the hole transport layer in the region corresponding to the B pixel region is the tenth preset thickness.

9. The manufacturing method of an organic light emitting diode display panel according to claim 2 , wherein the organic light emitting diode display panel comprises an R pixel region, a G pixel region and a B pixel region, the thickness of the hole transport layer corresponding to the R pixel region being an eleventh preset thickness, and the thickness of the hole transport layer corresponding to the G pixel region being a twelfth preset thickness, and the thickness of the hole transport layer corresponding to the B pixel region being a thirteenth preset thickness, wherein the eleventh preset thickness is greater than the twelfth preset thickness, and the twelfth preset thickness is greater than the thirteenth preset thickness, and wherein manufacturing an integrated hole transport layer comprises steps as follows:

manufacturing by an entire-surface coating process a hole transport layer having the thirteenth preset thickness between the light emitting layer and the integrated hole injection layer comprising both a hole injection layer having the first preset thickness and a hole injection layer having the second preset thickness;

manufacturing by an inkjet printing process a hole transport layer in a region corresponding to the G pixel region on the hole transport layer having the thirteenth preset thickness such that the thickness of the hole transport layer in the region corresponding to the G pixel region is the twelfth preset thickness; and

manufacturing by an inkjet printing process a hole transport layer in a region corresponding to the R pixel region on the hole transport layer having the thirteenth preset thickness such that the thickness of the hole transport layer in the region corresponding to the R pixel region is the eleventh preset thickness.

10. The manufacturing method of an organic light emitting diode display panel according to claim 2 , wherein the organic light emitting diode display panel comprises an R pixel region, a G pixel region and a B pixel region, the thickness of the hole transport layer corresponding to the R pixel region being an eleventh preset thickness, the thickness of the hole transport layer corresponding to the G pixel region being a twelfth preset thickness, and the thickness of the hole transport layer corresponding to the B pixel region being a thirteenth preset thickness, wherein the eleventh preset thickness is greater than the twelfth preset thickness, and the twelfth preset thickness is greater than the thirteenth preset thickness, and wherein manufacturing an integrated hole transport layer comprises steps as follows:

manufacturing by an inkjet printing process a hole transport layer in both a region corresponding to the G pixel region and a region corresponding to the R pixel region on the hole transport layer having the thirteenth preset thickness such that the thickness of the hole transport layer in both the region corresponding to the G pixel region and the region corresponding to the R pixel region is the twelfth preset thickness; and

manufacturing by an inkjet printing process a hole transport layer in a region corresponding to the R pixel region on the hole transport layer having the twelfth preset thickness such that the thickness of the hole transport layer in the region corresponding to the R pixel region is the eleventh preset thickness.

11. The manufacturing method of an organic light emitting diode display panel according to claim 1 , wherein the method further comprises manufacturing an electron transport layer between the light emitting layer and the cathode layer.

12. The manufacturing method of an organic light emitting diode display panel according to claim 11 , wherein the method further comprises manufacturing an electron injection layer between the cathode layer and the electron transport layer.

13. The manufacturing method of an organic light emitting diode display panel according to claim 1 , wherein the entire-surface coating process comprises electrostatic scattering coating or slot die coating.

14. The manufacturing method of an organic light emitting diode display panel according to claim 1 , wherein the base substrate is a glass substrate or a flexible substrate.

15. An organic light emitting diode display panel manufactured by using a manufacturing method, comprising manufacturing an anode layer, a light emitting layer and a cathode layer on a base substrate, wherein the manufacturing method further comprises:

manufacturing by an entire-surface coating process a hole injection layer having a first preset thickness between the anode layer and the light emitting layer; and

manufacturing by an inkjet printing process a hole injection layer having a second preset thickness in a first preset region of the hole injection layer having the first preset thickness,

16. A display device, comprising the organic light emitting diode display panel according to claim 15 .

17. The organic light emitting diode display panel according to claim 15 ,

wherein the method further comprises:

in a second preset region of the hole transport layer that has been manufactured, manufacturing by an inkjet printing process a hole transport layer having a fourth preset thickness.

18. The organic light emitting diode display panel according to claim 17 , wherein the organic light emitting diode display panel comprises an R pixel region, a G pixel region and a B pixel region, the thickness of the hole injection layer corresponding to the R pixel region being a fifth preset thickness, the thickness of the hole injection layer corresponding to the G pixel region being a sixth preset thickness, and the thickness of the hole injection layer corresponding to the B pixel region being a seventh preset thickness, wherein the fifth preset thickness is smaller than the sixth preset thickness, and the sixth preset thickness is smaller than the seventh preset thickness.

19. The organic light emitting diode display panel according to claim 18 , wherein manufacturing the integrated hole injection layer comprises steps as follows:

20. The organic light emitting diode display panel according to claim 18 , wherein manufacturing the integrated hole injection layer comprises steps as follows:

Assignments (1)

ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 23, 2017

From: HOU, WENJUN; CUI, YING

To: BOE TECHNOLOGY GROUP CO., LTD.

Reel/Frame 041051/0155 →

Priority Claims (1)

CN 2015 1 0130566 · Mar 24, 2015 · national

Continuity (1)

Related Publication 20170213965A1 · Jul 27, 2017