IP Library › Granted Patent US 10,141,911
Granted Patent B2
US 10,141,911 · App. 15/669,046 · Granted Nov 27, 2018

High-frequency module and communication apparatus

Inventor: Hideki Muto (Nagaokakyo, JP)
Assignee: MURATA MANUFACTURING CO., LTD.
H03H7/46H03F1/56H03F3/195H03F2200/111H03F2200/165H03F2200/222H03F2200/294H03F2200/451
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Quick Facts
Patent No.
US 10,141,911
App. No.
15/669,046
Granted
Nov 27, 2018
Kind
B2
Abstract

A high-frequency module includes a plurality of filters, a switch that commonly connects a plurality of paths, and a low noise amplifier that amplifies a high-frequency signal input from the plurality of filters with the switch interposed therebetween, wherein paths in which first and second filters are respectively provided among the plurality of paths connect the respective filters and the switch without connecting impedance elements, and each of the first and second filters has an output impedance located in a matching region between a NF matching impedance at which an NF of the low noise amplifier is minimum and a gain matching impedance at which a gain of the low noise amplifier is maximum in its respective pass band thereof on a Smith chart.

Claims (41)

1. A high-frequency module comprising:

a plurality of filters including first and second filters and including respective pass bands which are different from one another;

a connection circuit that commonly connects a plurality of paths in which the plurality of filters are respectively provided; and

a low noise amplifier that is connected to the connection circuit; wherein

the connection circuit is connected between the plurality of filters and the low noise amplifier;

in paths in which the first and second filters are respectively provided among the plurality of paths, the respective filters and the connection circuit are connected without connecting impedance elements;

each of the first and second filters has a respective output impedance located in a matching region between a noise figure matching impedance at which a noise figure of the low noise amplifier is minimum and a gain matching impedance at which a gain of the low noise amplifier is maximum in the respective pass band of each of the first and second filters on a Smith chart.

2. The high-frequency module according to claim 1 , further comprising a first impedance adjustment circuit that is connected between the connection circuit and the low noise amplifier, wherein

the first impedance adjustment circuit adjusts a first impedance when a circuit portion in which the first impedance adjustment circuit is connected to the low noise amplifier is seen from output sides of the plurality of filters in a case in which the noise figure is minimum and the gain is maximum at respective frequency bands.

3. The high-frequency module according to claim 2 , wherein the first impedance adjustment circuit adjusts the first impedance to be any one of inductive or capacitive in both of the pass bands of the first filter and the second filter among the plurality of filters in the case in which the noise figure is minimum and the gain is maximum.

4. The high-frequency module according to claim 3 , wherein

each of the first and second filters has the output impedance with a capacitive property in the respective pass band of each of the first and second filters; and

the first impedance adjustment circuit adjusts the first impedance to be inductive in both of the pass bands of the first filter and the second filter among the plurality of filters in the case in which the noise figure is minimum and the gain is maximum.

5. The high-frequency module according to claim 1 , further comprising a functional circuit that is connected between a third filter of the plurality of filters and the connection circuit and is configured or programmed to perform a predetermined function.

6. The high-frequency module according to claim 5 , wherein the functional circuit is a second impedance adjustment circuit that generates a second impedance when a circuit portion in which the functional circuit is connected to the third filter is seen from an input side of the low noise amplifier close to a matching region in a pass band of the third filter on the Smith chart.

7. The high-frequency module according to claim 1 , wherein the plurality of filters include three or more filters; and

each of the filters and the connection circuit are connected without connecting an impedance element in each of the plurality of paths.

8. The high-frequency module according to claim 1 , wherein the connection circuit includes a switch including a plurality of selection terminals, where each of the selection terminals are connected to a corresponding one of the plurality of filters and a common terminal is connected to the low noise amplifier.

9. The high-frequency module according to claim 1 , wherein the connection circuit is a multiplexer including a first terminal connected to the low noise amplifier and a plurality of second terminals connected to the plurality of filters in an individual correspondence manner.

10. The high-frequency module according to claim 1 , wherein the plurality of filters include four or more filters; and

the connection circuit includes:

a first initial stage connection circuit that commonly connects some paths among the plurality of paths;

a second initial stage connection circuit that commonly connects at least two paths which are different from the some paths among the plurality of paths; and

a posterior stage connection circuit that is connected in a multistage arrangement to the first and second initial stage connection circuits.

11. The high-frequency module according to claim 10 , wherein the connection circuit further includes a third impedance adjustment circuit that is connected between the first initial stage connection circuit and the posterior stage connection circuit and generates a third impedance when a circuit portion in which the third impedance adjustment circuit is connected to the first initial stage connection circuit is seen from an input side of the low noise amplifier close to a matching region in respective pass bands of each of some filters provided in the some paths among the plurality of filters on the Smith chart.

12. The high-frequency module according to claim 10 , wherein the posterior stage connection circuit includes two branch paths, a first path connected between an input terminal of the low noise amplifier and a common terminal of the first initial stage connection circuit and a second path connected between the input terminal of the low noise amplifier and a common terminal of the second initial stage connection circuit.

13. The high-frequency module according to claim 1 , wherein each of the plurality of filters includes an elastic wave resonator using surface acoustic waves, bulk waves, or boundary acoustic waves.

14. A communication apparatus comprising:

an RF signal processing circuit that processes a high-frequency signal which is transmitted or received with an antenna element; and

the high-frequency module, according to claim 1 , transmits or receives the high-frequency signal between the antenna element and the RF signal processing circuit.

15. The communication apparatus according to claim 14 , further comprising a first impedance adjustment circuit that is connected between the connection circuit and the low noise amplifier, wherein

the first impedance adjustment circuit adjusts a first impedance when a circuit portion in which the first impedance adjustment circuit is connected to the low noise amplifier is seen from output sides of the plurality of filters in a case in which the noise figure is minimum and the gain is maximum at respective frequency bands.

16. The communication apparatus according to claim 15 , wherein the first impedance adjustment circuit adjusts the first impedance to be any one of inductive or capacitive in both of the pass bands of the first filter and the second filter among the plurality of filters in the case in which the noise figure is minimum and the gain is maximum.

17. The communication apparatus according to claim 16 , wherein

each of the first and second filters has the output impedance with a capacitive property in the respective pass band of each of the first and second filters; and

the first impedance adjustment circuit adjusts the first impedance to be inductive in both of the pass bands of the first filter and the second filter among the plurality of filters in the case in which the noise figure is minimum and the gain is maximum.

18. The communication apparatus according to claim 14 , further comprising a functional circuit that is connected between a third filter of the plurality of filters and the connection circuit and is configured or programmed to perform a predetermined function.

19. The communication apparatus according to claim 18 , wherein the functional circuit is a second impedance adjustment circuit that generates a second impedance when a circuit portion in which the functional circuit is connected to the third filter is seen from an input side of the low noise amplifier close to a matching region in a pass band of the third filter on the Smith chart.

20. The communication apparatus according to claim 14 , wherein

the plurality of filters include three or more filters; and

each of the filters and the connection circuit are connected without connecting an impedance element in each of the plurality of paths.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 4, 2017
From: MUTO, HIDEKI
To: MURATA MANUFACTURING CO., LTD.
Reel/Frame 043202/0411 →
Priority Claims (2)
JP 2016-155022 · Aug 5, 2016 · national
JP 2017-109028 · Jun 1, 2017 · national
Continuity (1)
Related Publication 20180041174A1 · Feb 8, 2018