IP Library Granted Patent US 10,149,385
Granted Patent B2
US 10,149,385 · App. 15/031,383 · Granted Dec 4, 2018

Affixing structure for electronic component

Inventors: Shunsuke Yakushiji (Tokyo, JP); Hitoshi Tamaki (Tokyo, JP); Takayuki Takashige (Kiyosu, JP)
Assignee: MITSUBISHI HEAVY INDUSTRIES THERMAL SYSTEMS, LTD.
H05K1/18F04B35/04F04B39/121F04C18/0215H02K11/00H05K3/305F04C23/008F04C2240/803F04C2240/808H05K3/3421H05K2201/1003H05K2201/2009H05K2201/2045Y02P70/613
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Quick Facts
Patent No.
US 10,149,385
App. No.
15/031,383
Granted
Dec 4, 2018
Kind
B2
Abstract

An affixing structure that reduces costs and reduces the risk of vibration causing damage or the like to electrical connection terminals on an electronic component affixed to a circuit board is provided. In the affixing structure, which is affixed to a circuit board ( 21 ) via a plurality of lead frames ( 55 ) that are part of a transformer ( 50 ), at least one second side wall perpendicular to a first side wall where the lead frames ( 55 ) are arranged is adhesively supported on the circuit board ( 21 ) by a support ( 60 ). The height (H 3 ) of the part of the support ( 60 ) in contact with the transformer ( 50 ) is greater than or equal to the height (H 2 ) of the center of gravity of the electronic component, and the length (L) of the support ( 60 ) in the direction of the first side wall is greater than or equal to the height (H 3 ).

Claims (27)

1. An affixing structure affixed to a circuit board via a plurality of electrical connection terminals included in an electronic component, wherein

at least one second side wall of the electronic component that is perpendicular to a first side wall where the electrical connection terminals are arranged is adhesively supported on the circuit board by a support, with use of an adhesive having elasticity;

a height (H 3 ) of a part of the support in contact with the second side wall of the electronic component is greater than or equal to a height (H 2 ) from the circuit board to a position of the center of gravity of the electronic component;

a length (L) of the support in a direction following the first side wall is greater than or equal to the height (H 3 ), and

the electric component is a transformer.

2. The affixing structure according to claim 1 , wherein

each of the electrical connection terminals is constituted by a lead frame.

3. The affixing structure according to claim 1 , wherein

the support is constituted only by an adhesive.

4. The affixing structure according to claim 2 , wherein

the support is constituted only by an adhesive.

5. The affixing structure according to claim 1 , wherein

the support is constituted by an adhesive and a stiffener affixed to the circuit board by the adhesive.

6. The affixing structure according to claim 2 , wherein

the support is constituted by an adhesive and a stiffener affixed to the circuit board by the adhesive.

7. The affixing structure according to claim 5 , wherein

the stiffener is a triangular pillar-shaped member whose cross section is a right-angle triangle.

8. The affixing structure according to claim 1 , wherein

the electrical connection terminals are not arranged on the second side wall.

9. The affixing structure according to claim 1 , wherein

two of the second side walls are provided and supported by the respective supports.

10. The affixing structure according to claim 1 , wherein

the circuit board is incorporated into a vehicle electric compressor.

11. An affixing structure affixed to a circuit board via a plurality of electrical connection terminals included in an electronic component, wherein

at least one second side wall of the electronic component that is perpendicular to a first side wall where the electrical connection terminals are arranged is adhesively supported on the circuit board by a support, with use of an adhesive having elasticity,

a height (H 3 ) of a part of the support in contact with the second side wall of the electronic component is greater than or equal to a height (H 2 ) from the circuit board to a position of the center of gravity of the electronic component, and

a length (L) of the support in a direction following the first side wall is greater than or equal to the height (H 3 ).

Assignments (2)
MERGER Recorded Aug 10, 2018
From: MITSUBISHI HEAVY INDUSTRIES AUTOMOTIVE THERMAL SYSTEMS CO., LTD.
To: MITSUBISHI HEAVY INDUSTRIES THERMAL SYSTEMS, LTD.
Reel/Frame 046773/0151 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 18, 2016
From: YAKUSHIJI, SHUNSUKE; TAMAKI, HITOSHI; TAKASHIGE, TAKAYUKI
To: MITSUBISHI HEAVY INDUSTRIES AUTOMOTIVE THERMAL SYSTEMS CO., LTD.
Reel/Frame 038636/0483 →
Priority Claims (1)
JP 2013-258167 · Dec 13, 2013 · national
Continuity (1)
Related Publication 20160278212A1 · Sep 22, 2016