Modular system connection assignment
A modular device system includes a base portable electronic communication device and an add-on module. A multi-pin connector array on the base portable electronic communication device includes multiple connectors supporting one or more data speeds and other functionality. The array is configured and located to electrically connect to a mating array on the add-on module when the add-on module is mated to the base portable electronic communication device.
1. A modular device system including a base portable electronic communication device having a multi-pin connector array, the connector array having multiple pins supporting multiple data speeds between and including low speed data and high speed data, wherein the multi-pin connector array is configured and located to electrically connect to a mating array on a module device when the module device is mated to the base portable electronic communication device, the base portable electronic communication device further including out-of-band hardware for Serial Peripheral Interface (SPI), the out-of-band hardware including a plurality of hardware connection linking a processor of the base portable electronic communication device to a processor of the module device.
2. The modular device system in accordance with claim 1 , wherein the multi-pin connection array includes multiple pin contacts.
3. The modular device system in accordance with claim 1 , wherein the multi-pin connection array includes multiple spring-loaded pins.
4. The modular device system in accordance with claim 1 , wherein the base portable electronic communication device further comprises a camera protrusion and at least one alignment feature configured and located such that the multi-pin connection array mates with the mating array on the module device when the module device is docked to the base portable electronic communication device.
5. A modular device system including a base portable electronic communication device having a multi-pin connector array, the connector array having multiple pins supporting multiple data speeds between and including low speed data and high speed data, wherein the multi-pin connector array is configured and located to electrically connect to a mating array on a module device when the module device is mated to the base portable electronic communication device, the base portable electronic communication device including out-of-band hardware having a plurality of hardware connection linking a processor of the base portable electronic communication device to a processor of the module device for Serial Peripheral Interface (SPI) signals other than ACK/NACK and including support for in-band ACK/NACK.
6. The modular device system in accordance with claim 5 , wherein the multi-pin connection array includes multiple pin contacts.
7. The modular device system in accordance with claim 5 , wherein the multi-pin connection array includes multiple spring-loaded pins.
8. The modular device system in accordance with claim 5 , wherein the base portable electronic communication device further comprises a camera protrusion and at least one alignment feature configured and located such that the multi-pin connection array mates with the mating array on the module device when the module device is docked to the base portable electronic communication device.