Separation method and separation apparatus
A method and an apparatus for manufacturing an object which involve a separation technique are provided. A first substrate provided with an object is attached to a second substrate and is then suction-fixed by using a suction chuck (also referred to as a suction stage or a vacuum chuck) including portions with different suction capabilities or by using its functional equivalent, and the second substrate is separated from the first substrate. Accordingly, the object is separated from the first substrate and transferred to the second substrate. An apparatus for achieving this is also provided. A substrate fixture surface of the suction chuck or its functional equivalent includes a plurality of portions provided with suction micro-holes and a portion provided with no holes. Owing to the plurality of portions provided with suction micro-holes, a plurality of objects can be transferred from the first substrate to the second substrate.
1. A separation method comprising the steps of:
forming a bonded substrate comprising a first substrate, a second substrate, and a separation layer between the first substrate and the second substrate;
forming a first part and a second part of the second substrate by forming a groove surrounding the first part;
placing the first part of the second substrate on a first portion of a first surface;
fixing the bonded substrate to the first surface by a suction force; and
separating the first part of the second substrate from the first substrate along the separation layer,
wherein the first surface further comprises a second portion surrounding the first portion,
wherein a suction force of the first portion is stronger than a suction force of the second portion, and
wherein the second part of the second substrate remains bonded to the first substrate with the separation layer therebetween when the first part of the second substrate is separated.
2. The separation method according to claim 1 , wherein an organic material layer is provided between the second substrate and the separation layer.
3. The separation method according to claim 2 , wherein each of the second substrate and the organic material layer comprises a flexible material.
4. The separation method according to claim 1 ,
wherein the first portion comprises a plurality of holes, and
wherein the second portion comprises no holes.
5. The separation method according to claim 1 , wherein a depressed portion is provided on a second surface opposite to the first surface.
6. The separation method according to claim 1 , wherein the groove surrounds a first part of the separation layer.
7. The separation method according to claim 1 , further comprising a step of forming a film substrate over the first part of the second substrate.
8. The separation method according to claim 1 ,
wherein the first surface further comprises a third portion,
wherein the second portion surrounds the third portion, and
wherein a suction force of the third portion is stronger than the suction force of the second portion.
9. The method according to claim 1 , wherein separating the first part of the second substrate is conducted by lifting the first substrate by a hook with a sharp edge inserted in one end of the first substrate.
10. A separation method comprising the steps of:
forming a bonded substrate comprising a first substrate, a second substrate, and a separation layer between the first substrate and the second substrate;
forming a first part and a second part of the second substrate by forming a groove surrounding the first part;
placing the first part of the second substrate on a first portion of a first surface;
fixing the bonded substrate to the first surface by a suction force; and
separating the first part of the second substrate from the first substrate along the separation layer,
wherein the second part of the second substrate remains bonded to the first substrate with the separation layer therebetween when the first part of the second substrate is separated.
11. The separation method according to claim 10 , wherein an organic material layer is provided between the second substrate and the separation layer.
12. The separation method according to claim 11 , wherein each of the second substrate and the organic material layer comprises a flexible material.
13. The separation method according to claim 10 , wherein the first portion comprises a plurality of holes.
14. The separation method according to claim 10 , wherein a depressed portion is provided on a second surface opposite to the first surface.
15. The separation method according to claim 10 , wherein the groove surrounds a first part of the separation layer.
16. The separation method according to claim 10 , further comprising a step of forming a film substrate over the first part of the second substrate.
17. The method according to claim 10 , wherein separating the first part of the second substrate is conducted by lifting the first substrate by a hook with a sharp edge inserted in one end of the first substrate.
18. A method for manufacturing a light-emitting device, the method comprising the steps of:
framing a bonded substrate comprising a first substrate, a second substrate, a separation layer, and an element layer comprising a transistor;
forming a first part and a second part of the second substrate by forming a groove surrounding the first part;
placing the first part of the second substrate on a first portion of a first surface;
fixing the bonded substrate to the first surface by a suction force; and
separating the first part of the second substrate from the first substrate along the separation layer,
wherein the separation layer and the element layer are provided between the first substrate and the second substrate, and
wherein the second part of the second substrate remains bonded to the first substrate with the separation layer therebetween when the first part of the second substrate is separated.
19. The method according to claim 18 , wherein an organic material layer is provided between the second substrate and the separation layer.
20. The method according to claim 19 , wherein each of the second substrate and the organic material layer comprises a flexible material.
21. The method according to claim 18 , wherein the first portion comprises a plurality of holes.
22. The method according to claim 18 , wherein a depressed portion is provided on a second surface opposite to the first surface.
23. The method according to claim 18 , wherein the groove surrounds a first part of the separation layer.
24. The method according to claim 18 , further comprising a step of forming a film substrate over the first part of the second substrate.
25. The method according to claim 18 , wherein separating the first part of the second substrate is conducted by lifting the first substrate by a hook with a sharp edge inserted in one end of the first substrate.