Laminate and gas barrier film

1. A laminate comprising:

a first substrate;

an atomic layer deposition film consisting of an titanium oxide layer disposed on a first surface of the first substrate;

a second substrate disposed on a first surface of the atomic layer deposition film; and

a first adhesive layer disposed between the atomic layer deposition film and the second substrate to adhere a first surface of the atomic layer deposition film to the second substrate, and

a second adhesive layer disposed on a second surface of the first substrate;

a third substrate disposed below the second surface of the first substrate, the second surface being on an opposite side to the first surface; and

wherein the second adhesive layer is disposed between the atomic layer deposition film and the third substrate to adhere the atomic layer deposition film to the third substrate,

wherein the first substrate is formed of material having a glass transition point of at least 50° C.,

wherein each of the first adhesive layer and the second adhesive layer is formed of a resin compound having a plurality of hydroxyl groups in a molecule and a polyisocyanate compound,

wherein a thickness of each of the first adhesive layer and the second adhesive layer is 10 μm,

wherein the first surface of the atomic layer deposition film is subjected to plasma surface treatment,

wherein each of the first substrate, the second substrate and the third substrate is made of polyethylene terephthalate (PET) and has a thickness of 100 μm, and

wherein the atomic layer deposition film has a thickness of about 20 nm.

2. The laminate of claim 1 , wherein the plasma surface treatment of the first surface of the atomic layer deposition film enhances affinity to the first adhesive layer, and, wherein the first adhesive layer adheres to the treated first surface of the atomic layer deposition film.

3. The laminate of claim 1 , wherein when exposed to conditions of 105° C. and 100% relative humidity for ninety-six hours, a 10 mm wide sample of the laminate subjected to 180-degree peeling at 300 mm/min between the inorganic oxide layer and the second substrate exhibited a lamination strength of 5.4 N/10 mm and a water vapor transmission rate of 6.3×10 −3 g/m 2 /day.

4. A gas barrier film including the laminate of claim 1 .

5. A gas barrier film including the laminate of claim 1 , wherein the polyisocyanate compound is cross-linked to the plurality of hydroxyl groups of the resin compound.

6. A laminate for a gas barrier film prepared by a process comprising the steps of:

providing a first substrate,

forming, on a first surface of the first substrate, a barrier film comprising TiO 2 via atomic layer deposition;

applying a plasma surface treatment to a first surface of the barrier film,

attaching, to the first surface of the barrier film, a second substrate, the second substrate being attached to the first surface via a first adhesive layer, and

providing, at a second surface of the first substrate, a third substrate, the third substrate being attached to the first substrate via a second adhesive layer,

wherein each of the first adhesive layer and the second adhesive layer is formed of a resin compound having a plurality of hydroxyl groups in a molecule and a polyisocyanate compound,

wherein a thickness of each of the first adhesive layer and the second adhesive layer is about 10 μm;

wherein each of the first substrate, the second substrate and the third substrate is made of polyethylene terephthalate (PET) and has a thickness of about 100 μm, and

wherein the atomic layer deposition film has a thickness of about 20 nm.

7. The laminate of claim 6 , wherein when exposed to conditions of 105° C. and 100% relative humidity for ninety-six hours, a 10 mm wide sample of the laminate subjected to 180-degree peeling at 300 mm/min between the barrier film and the second substrate exhibited a lamination strength of 5.4 N/10 mm and a water vapor transmission rate of 6.3×10 −3 g/m 2 /day.