IP Library › Granted Patent US 10,160,001
Granted Patent B2
US 10,160,001 · App. 15/332,184 · Granted Dec 25, 2018

Substrate treating apparatus

Inventor: Gilsoo Park (Gyeonggi-do, KR)
Assignee: SEMES CO., LTD.
B05C1/003H01L21/6719H01L21/67178H01L21/67184H01L21/67748H01L21/67769
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Quick Facts
Patent No.
US 10,160,001
App. No.
15/332,184
Granted
Dec 25, 2018
Kind
B2
Abstract

An apparatus for treating a substrate is provided having a treating module, a buffer module, and an index module arranged in sequentially along a first direction. The index module includes a load port where a substrate receiving container places an index module configured to transfer the substrate between the load port and the buffer module. The buffer module includes a first and second buffer unit arranged along a second direction perpendicular to the first direction. The treating module includes a first treating unit, a second treating unit, a first transfer chamber, and a second transfer chamber, wherein the first transfer chamber includes a first transfer robot configured to transfer the substrate between the first buffer unit and the first treating unit, and wherein the second transfer chamber includes a second transfer robot configured to transfer the substrate between the second buffer unit and the second treating unit.

Claims (60)

1. A substrate treating apparatus comprising:

an index module;

a buffer module; and

a treating module,

wherein the index module, the buffer module, and the treating module are sequentially placed along a first direction,

wherein the index module comprises a load port where a substrate receiving container is placed and an index robot configured to transfer the substrate between the load port and the buffer module,

wherein the buffer module comprises a first buffer chamber and a second buffer chamber arranged along a second direction perpendicular to the first direction, when viewed from a top side of the substrate treating apparatus,

wherein the treating module comprises a first treating chamber, a second treating chamber, a first transfer chamber provided with a first transfer robot configured to transfer the substrate between the first buffer chamber and the first treating chamber, and a second transfer chamber provided with a second transfer robot configured to transfer the substrate between the second buffer chamber and the second treating chamber,

wherein the first transfer chamber and the second transfer chamber are arranged along the second direction, and

wherein the first transfer robot and the second transfer robot move along and rotate about a base fixedly installed on a ground vertically along a third direction perpendicular to the first and second directions.

2. The apparatus of claim 1 , wherein the first buffer chamber comprises:

a first cooling chamber configured to cool the substrate and stacked with the first buffer chamber.

3. The apparatus of claim 2 , wherein the first cooling chamber comprises:

one or a plurality of carry in cooling chambers provided when the substrate is carried in to the first transfer chamber from the substrate receiving container; and

one or a plurality of carry out cooling chambers provided when the substrate is carried out of the first transfer chamber to the substrate receiving container.

4. The apparatus of claim 1 , wherein the first treating chamber comprises:

a first heat treatment chamber configured to treat the substrate with heat; and

a first solution treatment chamber configured to treat the substrate with solution.

5. The apparatus of claim 4 , wherein the first heat treatment chamber comprises:

a housing providing a treatment space therein;

a cooler cooling the substrate inside of the housing;

a heater heating the substrate inside of the housing; and

a third transfer robot transferring the substrate in between the cooler and the heater.

6. The apparatus of claim 5 , wherein the first transfer chamber, the cooler, and the heater are placed sequentially along the second direction.

7. The apparatus of claim 4 , wherein the first heat treatment chamber includes a plurality of chambers stacked to each other, and the first solution treatment chamber includes a plurality chambers stacked to each other.

8. The apparatus of claim 4 , wherein the second treating chamber comprises:

a second heat treatment chamber configured to treat the substrate with heat; and

a second solution treatment chamber configured to treat the substrate with solution,

wherein the load port, the index robot, the first transfer chamber and the first solution treatment chamber are placed sequentially along the first direction, and

wherein the first heat treatment chamber, the first transfer chamber, the second transfer chamber, and the second heat treatment chamber are placed sequentially along the second direction.

9. The apparatus of claim 4 , wherein the first solution treatment chamber comprises a chamber forming a film on a rotating substrate by providing a solution.

10. The apparatus of claim 4 , wherein the first heat treatment chamber, the first solution treatment chamber, and the first buffer chamber are placed at different sides of the first transfer chamber from each other.

11. The apparatus of claim 1 , wherein the first transfer robot comprises:

a vertical shaft installed on the base and provided to rotate and move vertically; and

a hand installed on the vertical shaft and provided to move forward and backward,

wherein the base is fixedly installed on a ground.

12. The apparatus of claim 1 , wherein the first transfer chamber and the second transfer chamber are placed adjacently.

13. The apparatus of claim 1 , wherein the first treating chamber comprises:

a first heat treatment chamber treating the substrate with heat; and

a first solution treatment chamber treating the substrate with solution,

wherein the first heat treatment chamber is provided as a plurality of heat treatment chambers stacked to each other,

wherein the first solution treatment chamber is provided as a plurality of solution treatment chambers stacked to each other and comprise a chamber forming a film on a rotating substrate by providing a solution,

wherein the load port, the index robot, the first transfer chamber and the first solution treatment chamber are placed sequentially along the first direction,

wherein the first heat treatment chamber, the first transfer chamber, the second transfer chamber and a second heat treatment chamber are placed sequentially along the second direction, and

wherein the first transfer chamber and the second transfer chamber are placed adjacently to each other.

14. The apparatus of claim 1 , wherein the first treating chamber and the first transfer chamber are provided with symmetry based on a parallel line to the first direction.

15. A substrate treating apparatus comprising:

an index module;

a buffer module; and

a treating module which are placed sequentially along a first direction,

wherein the index module comprises a load port where a substrate receiving container is placed and an index robot configured to transfer the substrate between the load port and the buffer module,

wherein the buffer module comprises a first buffer chamber and a second buffer chamber arranged along a second direction perpendicular to the first direction, when viewed from a top side,

wherein the treating module comprises a first and second heat treatment chambers, a first and second solution treatment chambers, a first transfer chamber, and a second transfer chamber,

wherein the first and second heat treatment chambers treat the substrate with heat, the first and second solution treatment chambers treat the substrate with solution, the first transfer chamber is provided with a first transfer robot transferring the substrate among the first heat treatment chamber, the first solution treatment chamber, and the first buffer chamber, and the second transfer chamber is provided with a second transfer robot transferring the substrate among the second heat treatment chamber, the second solution treatment chamber, and the second buffer chamber,

wherein the first transfer chamber and the second transfer chamber are arranged along the second direction, and placed adjacently, and

wherein the first transfer robot and the second transfer robot move along and rotate about a base fixedly installed on a ground vertically along a third direction perpendicular to the first and second directions.

16. The apparatus of claim 15 , wherein the load port, the index robot, the first transfer chamber and the first solution treatment chamber are placed sequentially along the first direction, and

wherein the first heat treatment chamber, the first transfer chamber, the second transfer chamber, and the second heat treatment chamber are placed sequentially along the second direction.

17. The apparatus of claim 15 , wherein the first heat treatment chamber, the first solution treatment chamber, and the first buffer chamber are placed at different sides of the first transfer chamber from each other.

18. The apparatus of claim 15 , wherein the first transfer chamber and the second transfer chamber are placed adjacently to each other.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 24, 2016
From: PARK, GILSOO
To: SEMES CO., LTD.
Reel/Frame 040102/0358 →
Priority Claims (1)
KR 10-2015-0151105 · Oct 29, 2015 · national
Continuity (1)
Related Publication 20170120287A1 · May 4, 2017
Cited By (1)
US 12,225,808