Semiconductor device and operating method thereof

1. A method of operating a semiconductor memory device including a plurality of pages coupled to a plurality of word lines, the method comprising:

performing a program operation on each of the plurality of pages by using an incremental step pulse program (ISPP) method using a determined verify voltage;

providing an additional program pulse at least once to the plurality of pages through the plurality of word lines; and

detecting a defective page from the plurality of pages by performing read operations on the plurality of pages through a reference test voltage greater than the determined verify voltage.

2. The method of claim 1 ,

wherein the plurality of pages are stacked over a substrate, and

wherein each of the plurality of pages is coupled to a corresponding word line located at a predetermined height from the substrate.

3. The method of claim 1 , wherein the detecting of the defective page comprises:

detecting first and second page data by performing read operations on first and second pages, respectively, among the plurality of pages;

generating a first comparative page by performing an OR operation on data bits of the first and second page data; and

generating a first error value according to a number of fail bits of the first comparative page.

4. The method of claim 3 , wherein the detecting of the defective page further comprises:

detecting third page data by performing a read operation on a third page among the plurality of pages;

generating a second comparative page by performing an OR operation on the data bits of the second and third page data;

generating a second error value according to a number of fail bits of the second comparative page; and

detecting the third page as the defective page by comparing the second error value with the first error value.

5. The method of claim 1 , wherein the detecting of the defective page comprises:

detecting first page data by performing a read operation on a first page among the plurality of pages;

generating a first error value according to a number of fail bits in the first page data;

detecting second page data by performing a read operation on a second page among the plurality of pages;

generating a second error value according to a number of fail bits in the second page data; and

detecting the second page as the defective page by comparing the second error value with the first error value.

6. The method of claim 1 , wherein the detecting of the defective page comprises:

detecting page data by performing a read operation on one of the plurality of pages; and

detecting a corresponding page as the defective page when a number of fail bits in the page data is greater than a reference value.

7. The method of claim 1 , wherein a region corresponding to the defective page is defined as a bad region.

8. A semiconductor memory device, comprising:

a memory cell array including a plurality of memory blocks, each of which includes a plurality of pages coupled to each of the plurality of word lines; and

a peripheral circuit suitable for performing a program operation on each of the plurality of pages,

wherein during the program operation, the peripheral circuit performs the program operation on a selected page, verifies whether or not a result of the program operation is a pass by applying a verify voltage to a word line of the selected page, and

repeats programming and verifying until the result of the program operation is the pass, and

wherein the peripheral circuit further increases threshold voltages of memory cells included in the plurality of pages by applying an additional program pulse at least once to the plurality of word lines, and detects a defective page among the plurality of pages by performing read operations on the plurality of pages through a reference test voltage greater than the verify voltage by an amount of a determined voltage.

9. The semiconductor memory device of claim 8 ,

wherein the plurality of pages are stacked over a substrate, and

wherein each of the plurality of pages is coupled to a corresponding word line located at a predetermined height from the substrate.

10. The semiconductor memory device of claim 8 , wherein the peripheral circuit detects the defective page by:

detecting first and second page data by performing read operations on first and second pages, respectively, among the plurality of pages,

generating a first comparative page by performing an OR operation on data bits of the first and second page data,

detecting third page data by performing a read operation on a third page among the plurality of pages, and

generating a second comparative page by performing an OR operation on data bits of the second and third page data.

11. The semiconductor memory device of claim 10 , wherein the peripheral circuit comprises:

a detector suitable for generating a first error value according to a number of fail bits of the first comparative page and a second error value according to a number of fail bits of the second comparative page; and

a control logic suitable for detecting the third page as the defective page by comparing the second error value with the first error value.

12. The semiconductor memory device of claim 8 , wherein a region corresponding to the defective page is defined as a bad region.