Peeling method
View Patent ↗To improve the yield in a peeling process and improve the yield in a manufacturing process of a flexible light-emitting device or the like, a peeling method includes a first step of forming a peeling layer over a first substrate, a second step of forming a layer to be peeled including a first layer in contact with the peeling layer over the peeling layer, a third step of curing a bonding layer in an overlapping manner with the peeling layer and the layer to be peeled, a fourth step of removing part of the first layer overlapping with the peeled layer and the bonding layer to form a peeling starting point, and a fifth step of separating the peeling layer and the layer to be peeled. The peeling starting point is preferably formed by laser light irradiation.
1. A manufacturing method comprising:
forming a peeling layer over a first substrate;
forming a first layer over and in contact with the peeling layer;
forming a functional element over the peeling layer;
attaching the first substrate and a second substrate to each other with a bonding layer, a first partition surrounding the bonding layer, and a second partition surrounding the first partition, wherein the second substrate faces the functional element with the bonding layer therebetween;
curing the bonding layer; and
separating the peeling layer and the first layer.
2. The manufacturing method according to claim 1 , further comprising:
forming a peeling starting point by removing part of the first layer by laser light irradiation.
3. The manufacturing method according to claim 2 ,
wherein the first partition is in an uncured or semi-cured state in the step of forming the peeling starting point, and
wherein the part of the first layer overlaps with the peeling layer and the bonding layer.
4. The manufacturing method according to claim 2 ,
wherein the first partition is in a cured state in the step of forming the peeling starting point, and
wherein the part of the first layer overlaps with the peeling layer and the first partition.
5. The manufacturing method according to claim 4 ,
wherein part of the first partition exists between the first layer and the second substrate after separating the peeling layer and the first layer.
6. The manufacturing method according to claim 1 ,
wherein the first partition is in contact with the bonding layer in the step of curing the bonding layer.
7. The manufacturing method according to claim 1 ,
wherein the first partition and the bonding layer are formed over the second substrate before attaching the first substrate and the second substrate to each other.
8. The manufacturing method according to claim 7 ,
wherein the first partition is formed before the bonding layer is formed.
9. The manufacturing method according to claim 1 ,
wherein the first layer is an insulating layer, and
wherein the functional element includes any one of a semiconductor element, a light-emitting element, and a display element.
10. A manufacturing method comprising:
forming a peeling layer over a first substrate;
forming a first layer over and in contact with the peeling layer;
forming a functional element over the peeling layer;
attaching the first substrate and a second substrate to each other with a bonding layer, a first partition surrounding the bonding layer, and a second partition surrounding the first partition, wherein the second substrate faces the functional element with the bonding layer therebetween;
curing the bonding layer, wherein an end portion of the bonding layer is positioned on an inner side than an end portion of the peeling layer; and
separating the peeling layer and the first layer.
11. The manufacturing method according to claim 10 , further comprising:
forming a peeling starting point by removing part of the first layer by laser light irradiation.
12. The manufacturing method according to claim 10 ,
wherein the first layer is an insulating layer, and
wherein the functional element includes any one of a semiconductor element, a light-emitting element, and a display element.