Integrated LED device
The present invention relates to an integrated-LED device having a housing, whereby the housing comprises a multi-LED device comprising a transparent substrate and a plurality of light emitting diodes, LEDs, arranged for emitting light and disposed on said transparent substrate, an integrated circuit in connection with said LEDs and arranged for controlling said LEDs, a base comprising one or more base extensions, on which at least said multi-LED device is mounted, with said one or more base extensions so arranged or so shaped that a first opening is created to let pass LED light emitted through said transparent substrate by said plurality of LEDs.
1. An integrated-LED device having a housing, said housing comprising:
a multi-LED device comprising a transparent substrate and a plurality of light emitting diodes (LEDs) arranged for emitting light and disposed on said transparent substrate,
an integrated circuit in connection with said LEDs and arranged for controlling said LEDs,
a base comprising one or more base extensions, on which at least said multi-LED device is mounted, with said one or more base extensions so arranged or so shaped that a first opening is created to let pass LED light emitted through said transparent substrate by said plurality of LEDs.
2. The integrated-LED device as in claim 1 , wherein said integrated circuit is mounted side by side to said multi-LED device.
3. The integrated-LED device as in claim 1 , wherein said integrated circuit is stacked on said multi-LED device.
4. The integrated-LED device as in claim 3 , wherein a protection layer is provided between said multi-LED device and said integrated circuit.
5. The integrated-LED device as in claim 1 , wherein said one or more base extensions are part of said base, said base being in one piece.
6. The integrated-LED device as in claim 1 , wherein said one or more base extensions are so formed that, when mounted on a printed circuit board, an optical window of the integrated LED device faces away from the printed circuit board.
7. The integrated-LED device as in claim 1 , implemented as a quad flat no-leads, QFN, package.
8. The integrated-LED device as in claim 7 , mounted on a printed circuit board provided with a pre-defined hole to let LED light pass.
9. The integrated-LED device as in claim 1 , wherein said one or more base extensions are exposed on one side of said housing.
10. The integrated-LED device as in claim 1 , wherein said housing is made of a thermoset or thermoplastic material.
11. The integrated-LED device as in claim 10 , wherein said base extensions are embedded in said mold compound.
12. The integrated-LED device as in claim 1 , comprising an optical transparent protection layer to fill said first opening.
13. The integrated-LED device as in claim 1 , wherein said base is a metal lead frame or FR4 or a ceramic based base.
14. The integrated-LED device as in claim 1 , wherein said housing has a second opening in said housing corresponding to said first opening to let LED light pass out of said housing.
15. A method for manufacturing an integrated-LED device having a housing, the housing including
a multi-LED device that includes a transparent substrate and a plurality of light emitting diodes (LEDs) arranged for emitting light and disposed on said transparent substrate, and
an integrated circuit in connection with said LEDs and arranged for controlling said LEDs, the method comprising:
providing a base that includes one or more base extensions,
mounting said multi-LED device to said base, and
arranging or shaping said one or more base extensions so that a first opening is created to let pass LED light emitted through said transparent substrate by said plurality of LEDs.