Semiconductor device including a plurality of electrodes and supporters

1. A semiconductor device comprising:

a plurality of electrode structures on a substrate, the plurality of electrode structures having side surfaces; and

an upper supporter group and a lower supporter between upper ends and lower ends of the plurality of electrode structures, respectively, the upper supporter group including a plurality of upper supporters, at least some of the plurality of upper supporters each having an upper surface and a lower surface, the at least some of the plurality of upper supporters having a thickness between the upper surface and the lower surface, respectively,

wherein a first one of the upper surface and the lower surface has a curved profile, and a second one of the upper surface and lower surface has a flat profile, and

at least some of the plurality of upper supporters have the thickness that decreases towards the plurality of electrode structures.

2. The semiconductor device of claim 1 , wherein the plurality of upper supporters are separated from the lower supporter.

3. The semiconductor device of claim 1 , wherein the lower supporter is under the upper supporter group, and a distance between the plurality of upper supporters is less than a distance between the upper supporter group and the lower supporter.

4. The semiconductor device of claim 1 , wherein a thickness of the lower supporter is less than a thickness of each of the plurality of upper supporters.

5. The semiconductor device of claim 1 , wherein at least some of the plurality of upper supporters have facing surfaces having flat profiles.

6. The semiconductor device of claim 1 , wherein each of the plurality of upper supporters has an opening.

7. The semiconductor device of claim 1 , wherein the lower supporter includes an opening.

8. The semiconductor device of claim 1 , wherein at least some of the side surfaces of the plurality of electrode structures are exposed between the plurality of upper supporters, and the side surfaces have no bowing effect.

9. A semiconductor device comprising:

a plurality of electrode structures on a substrate;

a first supporter, a second supporter, and a third supporter separated from one another between upper ends and lower ends of the plurality of electrode structures;

a dielectric layer on the plurality of electrode structures; and

an upper electrode on the dielectric layer,

wherein an upper surface of the first supporter or a lower surface of the second supporter have curved profiles, and a lower surface of the first supporter and an upper surface of the second supporter have relatively flat profiles as compared with the upper surface of the first supporter or the lower surface of the second supporter,

the first supporter has a first thickness from the upper surface of the first supporter to the lower surface of the first supporter,

the second supporter has a second thickness from the upper surface of the second supporter to the lower surface of the second supporter, and

at least one of the first thickness and the second thickness decreases towards the plurality of electrode structures.

10. The semiconductor device of claim 9 , wherein the upper surface of the first supporter or the lower surface of the second supporter has a convex profile.

11. The semiconductor device of claim 9 , wherein the first supporter, the second supporter, and the third supporter include a substantially similar material.

12. The semiconductor device of claim 9 , wherein

the third supporter is under the first supporter and the second supporter relative to the substrate, and

a distance between the first supporter and the second supporter is less than a distance between the second supporter and the third supporter.

13. The semiconductor device of claim 9 , wherein a thickness of the third supporter is less than a thickness of each of the first supporter and the second supporter.

14. A semiconductor device comprising:

a substrate;

an electrode perpendicular to the substrate;

a first supporter having a top surface and a bottom surface, the bottom surface of the first supporter being substantially parallel to the substrate such that the bottom surface of the first supporter is connected substantially at right angles to the electrode, the top surface having a different profile from the bottom surface; and

a second supporter having a top surface and a bottom surface, the second supporter being closer to the substrate than the first supporter, the top surface of the second supporter being substantially parallel to the substrate such that the top surface of the second supporter is connected substantially at right angles to the electrode, the bottom surface having a different profile from the top surface,

wherein at least one of the first supporter and the second supporter have a thickness that decreases towards the electrode.

15. The semiconductor device of claim 14 , wherein the first supporter and the second supporter include silicon carbon nitride.

16. The semiconductor device of claim 15 , wherein a percentage of carbon in the silicon carbon nitride is between 0.1 atom % to 15 atom %.

17. The semiconductor device of claim 14 , wherein the electrode includes at least one of doped polysilicon, titanium nitride, tungsten, titanium, ruthenium, and tungsten nitride.

18. The semiconductor device of claim 1 , wherein the upper surface has a flat profile, and the lower surface has a curved profile.

19. The semiconductor device of claim 1 , wherein the lower surface contacts the side surfaces at an angle greater than a right angle.

20. The semiconductor device of claim 9 , wherein the lower surface of the second supporter has a curved profile.