Laminated structure, display device and display unit employing same

1. A manufacturing method of an organic light emitting device, comprising:

providing a substrate;

forming an anode including, stacked in this order:

a first anode layer comprising a metal compound or a conductive oxide,

a second anode layer that is a reflective layer, and

a third anode layer comprising a metal compound or a conductive oxide;

forming an insulating film so as to cover the anode;

patterning the insulating film so as to partially expose the anode;

forming an organic layer over the exposed portion of the anode and the insulating film, the organic layer comprising a light-emitting layer; and

forming a cathode on the organic layer,

wherein the organic light emitting device is configured to generate light in the light-emitting layer, and the light is extracted through the cathode,

wherein a thickness of the third anode layer is between about 3-15 nm, and

wherein the patterning the laminated structure includes making a side surface of the second anode layer a convex shape when viewed as a cross-section in the laminated direction of the anode.

2. The manufacturing method according to claim 1 , wherein forming the anode includes:

forming a first anode layer on the substrate;

forming a second anode layer on the first anode layer, the second anode layer being a reflective layer;

forming a third anode layer on the first anode layer; and

after forming the third anode layer, patterning a laminated structure including the first, the second and the third anode layers.

3. The manufacturing method according to claim 1 ,

wherein a thickness of the first anode layer is between about 5-50 nm and a thickness of the second anode layer is between about 50-150 nm.

4. The manufacturing method according to claim 1 , further comprising forming a protective film on the cathode.

5. The manufacturing method according to claim 4 , wherein the protective film has a thickness ranging from about 500 nm to about 10,000 nm.

6. The manufacturing method according to claim 4 , wherein the protective film comprises at least one selected from the group consisting of SiO 2 and SiN.

7. The manufacturing method according to claim 4 , further comprising forming a sealing panel that includes a sealing substrate formed on a side of the organic light emitting device opposite to the substrate-side,

wherein the protective film is between the sealing substrate and the cathode of the organic light emitting device.

8. The manufacturing method according to claim 7 , further comprising forming an adhesive layer between the sealing substrate and the protective film.

9. The manufacturing method according to claim 8 , wherein the adhesive layer includes a resin.

10. The manufacturing method according to claim 9 , wherein the resin is a thermosetting resin.

11. The manufacturing method according to claim 1 , wherein the second anode layer comprises Ag.

12. The manufacturing method according to claim 1 , wherein the first anode layer comprises a material selected from the group consisting of indium tin oxide, indium zinc oxide, indium oxide, tin oxide and zinc oxide, and

wherein the third anode layer comprises a material selected from the group consisting of indium tin oxide, indium zinc oxide, indium oxide, tin oxide and zinc oxide.