IP Library › Granted Patent US 10,170,726
Granted Patent B2
US 10,170,726 · App. 15/219,319 · Granted Jan 1, 2019

Display device and manufacturing method thereof

Inventors: Shunpei Yamazaki (Tokyo, JP); Yoshiharu Hirakata (Kanagawa, JP); Takeshi Nishi (Kanagawa, JP)
Assignee: Semiconductor Energy Laboratory Co., Ltd.
H01L51/5246G02F1/1339G02F1/133308H01L27/1214H01L27/3262H01L51/0097H01L51/524H01L51/5253H01L51/56H01L27/1225H01L29/7869H01L2227/323H01L2251/5338H01L2251/5361
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Quick Facts
Patent No.
US 10,170,726
App. No.
15/219,319
Granted
Jan 1, 2019
Kind
B2
Abstract

A display device in which reliability of a display element is improved is provided. Alternatively, a display device in which reliability of a transistor is improved is provided. Alternatively, a display device in which an increase in an area of a periphery region is suppressed is provided. A display device includes a display region including a display element between a first flexible substrate and a second flexible substrate in which the display region is surrounded by a first continuous sealant, the first sealant is surrounded by a second continuous sealant, and the second sealant is provided between the first substrate and the second substrate and on at least one of a side surface of the first substrate and a side surface of the second substrate.

Claims (31)

1. A method for manufacturing a display device, comprising:

forming an insulating film over and in contact with a first substrate with flexibility;

forming a first sealant continuously surrounding a display region over the insulating film;

irradiating the first sealant with a first laser beam;

bonding a second substrate with flexibility to the first substrate with the first sealant;

irradiating the first sealant with a second laser beam;

forming a second sealant continuously surrounding the first sealant in a gap between the first substrate and the second substrate and on a side surface of the first substrate and a side surface of the second substrate; and

forming a member in contact with a side surface of the second sealant,

wherein the member comprises a bottom surface portion in contact with a top surface of the insulating film.

2. The method according to claim 1 , wherein the first sealant comprises glass.

3. The method according to claim 1 , wherein the second sealant comprises a resin material or glass.

4. The method according to claim 1 , wherein the member comprises a metal material.

5. The method according to claim 1 , wherein the member surrounds the second sealant.

6. The method according to claim 1 , wherein a wavelength of the first laser beam is 810 nm or 940 nm.

7. The method according to claim 1 , wherein the second laser beam is irradiated from a side surface direction of the first substrate.

8. A method for manufacturing a display device, comprising:

forming an insulating film over and in contact with a first substrate with flexibility;

forming a first sealant continuously surrounding a display region over the insulating film;

irradiating the first sealant with a first laser beam;

bonding a second substrate with flexibility to the first substrate with the first sealant;

irradiating the first sealant with a second laser beam;

forming a second sealant continuously surrounding the first sealant in a gap between the first substrate and the second substrate and on a side surface of the first substrate and a side surface of the second substrate;

forming a member in contact with a side surface of the second sealant; and

forming an FPC over the first substrate,

wherein the member comprises a bottom surface portion in contact with a top surface of the insulating film.

9. The method according to claim 8 , wherein the first sealant comprises glass.

10. The method according to claim 8 , wherein the second sealant comprises a resin material or glass.

11. The method according to claim 8 , wherein the member comprises a metal material.

12. The method according to claim 8 , wherein the member surrounds the second sealant.

13. The method according to claim 8 , wherein a wavelength of the first laser beam is 810 nm or 940 nm.

14. The method according to claim 8 , wherein the second laser beam is irradiated from a side surface direction of the first substrate.

Priority Claims (1)
JP 2012-188057 · Aug 28, 2012 · national
Continuity (2)
Division 13974220 · Aug 23, 2013
Related Publication 20160336538A1 · Nov 17, 2016
Cited By (2)
US 12,230,647 US 12,517,471