Ink composition for plasma processing detection, and indicator for plasma processing detection using said ink composition
The present invention provides an ink composition for forming a color-changing layer that changes color by plasma treatment, the ink composition exhibiting excellent heat resistance, with the gasification of the color-changing layer or the scattering of the fine debris of the color-changing layer caused by plasma treatment being suppressed to the extent that electronic device properties are not affected. The invention provides an ink composition for forming a color-changing layer that changes color by plasma treatment, the ink composition comprising metal oxide particles containing at least one element selected from the group consisting of Mo, W, Sn, V, Ce, Te, and Bi, and a binder resin.
1. An ink composition for detecting plasma treatment and for forming a color-changing layer that changes color by plasma treatment,
the ink composition comprising:
metal oxide particles containing at least one element selected from the group consisting of Mo, W, V, Ce, Te, and Bi, and
a binder resin,
wherein the only elements contained in the metal oxide particles are Mo, W, V, Ce, Te, and Bi,
wherein the amount of the metal oxide particles contained in the ink composition is 30 to 60 wt %, and
wherein the valence of the metal oxide fine particles is configured to be changed by the plasma treatment.
2. The ink composition for detecting plasma treatment according to claim 1 , wherein the metal oxide particles contain at least one member selected from the group consisting of molybdenum(IV) oxide particles, molybdenum(VI) oxide particles, tungsten(VI) oxide particles, vanadium(II) oxide particles, vanadium(III) oxide particles, vanadium(IV) oxide particles, vanadium(V) oxide particles, cerium(IV) oxide particles, tellurium (IV) oxide particles, bismuth(III) oxide particles, bismuth(III) carbonate oxide particles, and vanadium(IV) oxide sulfate particles.
3. The ink composition for detecting plasma treatment according to claim 1 wherein the metal oxide particles contain at least one member selected from the group consisting of molybdenum(VI) oxide particles, tungsten(VI) oxide particles, vanadium(III) oxide particles, vanadium(V) oxide particles, and bismuth(III) oxide particles.
4. The ink composition for detecting plasma treatment according to claim 2 , wherein the metal oxide particles contain at least one member selected from the group consisting of molybdenum(VI) oxide particles, tungsten(VI) oxide particles, vanadium(III) oxide particles, vanadium(V) oxide particles, and bismuth(III) oxide particles.
5. The ink composition for detecting plasma treatment according to claim 1 , wherein the metal oxide particles have a mean particle size of 50 μm or less.
6. The ink composition for detecting plasma treatment according to claim 1 , wherein the binder resin contains at least one member selected from the group consisting of petroleum hydrocarbon resins, vinyl resins, butyral resins, alkyd resins, acrylic resins, epoxy resins, urethane resins, acrylonitrile resins, fluororesins, silicon resins, formalin resins, polyester resins, polyethylene resins, ketone resins, polyamide resins, maleic resins, coumarone resins, polyimide resins, polyetheretherketone resins, and alicyclic resins.
7. The ink composition for detecting plasma treatment according to claim 1 , wherein the binder resin has a softening point of 70° C. or higher.
8. A plasma treatment detection indicator comprising, on a base material, a color-changing layer formed of a cured coating film of the ink composition for detecting plasma treatment of claim 1 .
9. The plasma treatment detection indicator according to claim 8 , for use in an electronic device production equipment.
10. The plasma treatment detection indicator according to claim 9 , which has a shape that is identical to the shape of an electronic device substrate for use in the electronic device production equipment.
11. The plasma treatment detection indicator according to claim 9 , wherein the electronic device production equipment performs at least one plasma treatment selected from the group consisting of a film-forming step, an etching step, an ashing step, an impurity-adding step, and a washing step.
12. The plasma treatment detection indicator according to claim 10 , wherein the electronic device production equipment performs at least one plasma treatment selected from the group consisting of a film-forming step, an etching step, an ashing step, an impurity-adding step, and a washing step.
13. The plasma treatment detection indicator according to claim 8 , comprising a non-color-changing layer that does not change color by plasma treatment.
14. The plasma treatment detection indicator according to claim 13 , wherein the non-color-changing layer contains at least one member selected from the group consisting of titanium(IV) oxide, zirconium(IV) oxide, yttrium(III) oxide, barium sulfate, magnesium oxide, silicon dioxide, alumina, aluminum, silver, yttrium, zirconium, titanium, and platinum.
15. The plasma treatment detection indicator according to claim 13 , wherein the non-color-changing layer and the color-changing layer are formed on the base material in sequence,
the non-color-changing layer is formed adjacent to the principal surface of the base material, and
the color-changing layer is formed adjacent to the principal surface of the non-color-changing layer.
16. The plasma treatment detection indicator according to claim 14 , wherein the non-color-changing layer and the color-changing layer are formed on the base material in sequence,
the non-color-changing layer is formed adjacent to the principal surface of the base material, and
the color-changing layer is formed adjacent to the principal surface of the non-color-changing layer.