DIMM DRAM memory chips quick optical data erasure after power cycling
Quick optical DRAM reset and data erasure can be performed during power down (power cycling) or chip cooling and removal from the socket. In this way cold boot attacks on DRAM secret information are prevented using simple and cheap embodiment. In wafer level packaging (chip scale package) die is usually on top (flip-chip) and metal interconnections does not interfere with penetrating light during chip illumination. IR light penetrates through chip's thin epoxy on top and it is absorbed in the die, near active layer, and generates electron-hole pairs. Electron-hole pairs diffuse to chip active layer and generate discharging photocurrents in PN junctions connected to DRAM capacitors.
1. Dynamic Random Access Memory chip, battery voltage source, current pulse generator and near infrared light source wherein;
Dynamic Random Access Memory chip is optically illuminated by near infrared light source attached to chip package, wherein
aforementioned near infrared light source is activated by said battery voltage source cycling and current pulse generation by
aforementioned current pulse generator wherein
near infrared light penetrates through aforementioned Dynamic Random Access Memory chip's package, said near infrared light being absorbed in said Dynamic Random Access Memory chip's substrate and
generates charge carriers that diffuse to chip active layer and discharge said Dynamic Random Access Memory chip's data charge nodes and erase cryptographic key stored in said Dynamic Random Access Memory chip.
2. Invention from claim 1 wherein near infrared light source is near infrared LED and light guide film (LGF) containing side emitting micro near infrared LEDs and flat fiber (FF), wherein near infrared LED and light guide film and flat fiber emit infrared light perpendicularly to the Dynamic Random Access Memory chip surface.
3. Invention from claim 1 wherein current pulse generator contains voltage source, edge triggered monostable and resistor.
4. Invention from claim 1 wherein infrared light source is attached to chip package by integration to chip package.
5. Static Random Access Memory chip, battery voltage source, current pulse generator and near infrared light source wherein;
Static Random Access Memory chip is optically illuminated by near infrared light source attached to chip package, wherein
aforementioned near infrared light source is activated by said battery voltage source cycling and current pulse generation by
aforementioned current pulse generator wherein
near infrared light penetrates through aforementioned Static Random Access Memory chip's package,
said near infrared light being absorbed in said Static Random Access Memory chip's substrate and generates charge carriers that diffuse to chip active layer and discharge said Static Random Access Memory chip's data charge nodes and erase cryptographic key stored in said Static Random Access Memory chip.
6. Invention from claim 5 wherein near infrared light source is near infrared LED and light guide film (LGF) containing side emitting micro near infrared LEDs and flat fiber (FF), wherein near infrared LED and light guide film and flat fiber emit infrared light perpendicularly to the Static Random Access Memory chip surface.
7. Invention from claim 5 wherein current pulse generator contains voltage source, edge triggered monostable and resistor.
8. Invention from claim 5 wherein infrared light source is attached to chip package by integration to chip package.