Method of filling probe indentations in contact pads
An integrated electronic circuit has probe indentations filled by a hard covering substance. The integrated circuit device results from a process of manufacturing including forming a substrate comprising a plurality of functional components of the electronic circuit, creating a plurality of conductive layers on such substrate to form an electric contact region with high hardness equal to or greater than a first hardness value of about 300 HV, contacting the electric contact region with a probe thereby causing an indentation. The process further comprises, after the test run, creating a covering conductive layer on at least one part of the electric contact region contacted by the probe to fill the indentation.
1. A method, comprising:
forming an indentation in a contact pad disposed over a substrate by pressing a probe against the contact pad, the probe contacting a portion of the contact pad; and
forming a layer of conductive material in the indentation, the conductive material contacting the portion of the contact pad.
2. The method of claim 1 wherein the forming the indentation comprises forming the indentation in at least one layer, but not all layers, of the contact pad.
3. The method of claim 1 wherein the forming the layer of conductive material comprises filing the indentation with the conductive material.
4. The method of claim 1 , further comprising:
determining whether a probe is aligned with the contact pad in response to the indentation.
5. The method of claim 1 , further comprising:
determining whether a probe card is aligned with an array of contact pads, the array of contact pads including the contact pad, the array of contact pads being disposed over the substrate.
6. A method, comprising:
forming a plurality of conductive layers over a substrate having a plurality of electric circuit components, where said plurality of conductive layers provide an electric contact region with a hardness equal to or greater than 300 HV;
contacting the electric contact region with a probe, said contacting forming a probe mark in a top surface of the electric contact region;
conducting a test of the electric circuit components through the probe; and
after said test is complete forming a coating conductive layer covering said electric contact region and filling said probe mark.
7. The method of claim 6 , wherein the forming the plurality of conductive layers comprises forming a first layer, said first layer having a hardness equal to or greater than 300 HV.
8. The method of claim 7 , wherein the forming the plurality of conductive layers further comprises forming a second layer on said first layer, said second layer comprised of a material protecting the first layer from contamination and corrosion.
9. The method of claim 8 , wherein said probe mark is defined by a recess that extends from a top surface of the electric contact region through the second layer and at least partially into said first layer.
10. The method of claim 9 , wherein the coating conductive layer fills said recess and further overlies the top surface of the electric contact region.
11. The method of claim 8 , wherein the second layer is formed of gold or palladium.
12. The method of claim 11 , wherein the first layer is formed of rhodium or cobalt.
13. The method of claim 6 , wherein the coating conductive layer comprises palladium or gold or alloys thereof.
14. A method, comprising:
forming a conductive layer over a substrate having a plurality of electric circuit components, where said conductive layer provides an electric contact region with a hardness equal to or greater than 300 HV;
contacting the electric contact region with a probe, said contacting forming a probe mark in a top surface of the electric contact region;
conducting a test of the electric circuit components through the probe; and
after said test is complete forming a coating conductive layer covering said electric contact region and filling said probe mark.
15. The method of claim 14 , wherein said probe mark is defined by a recess that extends from a top surface of the electric contact region, and wherein the conductive layer fills said recess and further overlies the top surface of the electric contact region.
16. The method of claim 14 , wherein the electric contact region is formed of gold or palladium.
17. The method of claim 14 , wherein the electric contact region is formed of rhodium or cobalt.
18. The method of claim 1 , wherein the conductive material comprises palladium or gold or alloys thereof.
19. The method of claim 14 , wherein the coating conductive layer is surrounded by a passivation layer.
20. The method of claim 19 , wherein the coating conductive layer is coplanar with a top surface of the passivation layer.
21. A method, comprising:
forming a conductive pad over a semiconductor substrate having a plurality of electric circuit components, the conductive pad comprising a first conductive layer and a second conductive layer disposed over the first conductive layer;
contacting the conductive pad with a probe and thereby forming a cavity extending through the first conductive layer and an indentation in the second conductive layer that is aligned with the cavity;
conducting a test of the electric circuit components through the probe; and
after said test is complete forming a coating conductive layer covering said conductive pad and filling the cavity in the first conductive layer and the indentation in the second conductive layer, the coating conductive layer forming a planar surface above the second conductive layer.
22. The method of claim 21 wherein the coating conductive layer is configured to receive a wire bond or a solder ball.
23. The method of claim 21 wherein the coating conductive layer is palladium or gold or alloys thereof.
24. The method of claim 21 wherein the planar surface formed by the coating conductive layer is coplanar with a top surface of a passivation layer.
25. The method of claim 21 further comprising bonding a contact to the coating layer, the contact providing an electrical connection to the electric circuit components.
26. The method of claim 25 wherein the bonding the contact comprises welding a wire bond to the coating conductive layer.