Thermally conductive interface composition and use thereof
View Patent ↗A thermally conductive interface composition is interposed between a heat generating component and a heat dissipating component. To meet escalated heat dissipation for performance demanding devices, a thermally conductive interface composition comprises (A) A linear alkenyl organopolysiloxane containing a silicon-bonded alkenyl-terminated group or groups, (B) A branched alkenyl organopolysiloxane containing at least two silicon-bonded alkenyl groups, (C) thermally conductive fillers in a ternary particle size mixture, (D) An organohydrogenpolysiloxane containing at least two Si—H terminated groups, (E) An addition reaction catalyst, (F) A hydroxy group-containing siloxane, (G) Alkoxy group-containing siloxanes.
1. A thermally conductive interface composition, comprising:
(A) A linear alkenyl organopolysiloxane containing a silicon-bonded alkenyl-terminated group or groups in an average amount of 0.0001 to 5 mol % based on the amount of all silicon-bonded organic groups contained per molecule;
(B) A branched alkenyl organopolysiloxane containing at least two silicon-bonded alkenyl groups in an average amount of about 0.01 to 1 mol % based on the amount of all silicon-bonded organic groups contained per molecule, with component (A) to (B) ratio of 20:1 to 1:20;
(C) Thermally conductive fillers in a ternary particle size mixture with large particle in the average size range of 50-500 um, small particle in the average size range of 0.5-200 um, and nanoparticle in the average size range of 10-2000 nm;
(D) An organohydrogenpolysiloxane containing at least two Si—H terminated groups presented at terminal or intermediate positions of the molecule, with 0.5-0.8 moles of SiH groups per mole of alkenyl groups in component (A) and (B);
(E) An addition reaction catalyst;
(F) A hydroxy group-containing siloxane in an amount corresponding to 0.0001-5% of the weight of component (A) and (B) combined;
(G) A mixture of at least two alkoxy group-containing siloxanes adhering to formula (5) differing in the value of “n” added in an amount corresponding to 0.001-5% of the weight of component (C)
(R 8 O) p SiR 9 3-p [OSiR 8 2] n (OR 8 ) q R 9 3-q (5)
wherein R 8 and R 9 represent a substituted or unsubstituted monovalent hydrocarbon group, p is an integer of 1, 2, 03, q is an integer of 1, 2, or 3, and n is an integer of 1 to 150.
2. The thermally conductive interface composition according to claim 1 , wherein the thermally conductive interface composition has a thermal conductivity in the range of 1.0 to 8.0 W/m·K.
3. The thermally conductive interface composition according to claim 1 , wherein the thermally conductive interface composition is interposed between electronic components and heat dissipating devices.