Multipoint-measurement strain sensor and method for producing the same
A multipoint-measurement strain sensor which is free of a conduction failure originated from slippage at the time of lamination and which can reduce the material cost, and a method for producing the multipoint-measurement strain sensor are provided. A multipoint-measurement strain sensor 31 of the present invention includes a substrate film 34 , a plurality of strain-sensing parts 33 formed on a first main surface 34 a of the substrate film 34 , routing circuits 37, 38 formed, in correspondence with the respective strain-sensing parts 33 , on a second main surface 34 b of the substrate film 34 , and having outer connection terminals 37 b, 38 b near an outer edge of the substrate film 34 , and a conductive paste 41, 42 to fill via holes 39, 40 such that each of the strain-sensing parts 33 is connected to the corresponding routing circuit 37, 38.
1. A multipoint-measurement strain sensor comprising:
a substrate film;
a plurality of strain-sensing parts formed on a first main surface of the substrate film;
routing circuits formed, in correspondence with the respective strain-sensing parts, on a second main surface of the substrate film, and having outer connection terminals near an outer edge of the substrate film;
a conductive paste to fill via holes such that each of the strain-sensing parts is connected to the corresponding routing circuit; and
leads to be mounted on the outer connection terminals of the routing circuits.
2. The multipoint-measurement strain sensor according to claim 1 , further comprising:
an adhesive layer for fixing the sensor, the adhesive layer being formed to have an opening portion that surrounds each of the via holes so as to avoid lying over the via holes.
3. The multipoint-measurement strain sensor according to claim 1 , further comprising:
an adhesive layer for fixing the sensor, the adhesive layer being formed to have a strip-like non-formed portion where the via holes are aligned so as to avoid lying over the via holes.
4. The multipoint-measurement strain sensor according to claim 1 , further comprising:
an insulative first cover layer formed on the first main surface of the substrate film so as to cover the strain-sensing parts;
an insulative second cover layer formed on the second main surface of the substrate film so as to cover the routing circuits except for the outer connection terminals; and
a conductive terminal protection layer formed so as to cover the outer connection terminals of the routing circuits.
5. The multipoint-measurement strain sensor according to claim 1 , further comprising
an adhesive layer for fixing a sensor, the layer being formed on the first main surface side of the substrate film, wherein
the adhesive layer is formed so as to avoid lying over the via holes.
6. A method for producing a multipoint-measurement strain sensor, the method comprising the steps of:
laminating a first metal layer on a first main surface of a substrate film, and laminating a second metal layer on a second main surface of the substrate film;
forming, by etching, a conductive pattern constituting a plurality of strain-sensing parts from the first metal layer, and forming, by etching, a conductive pattern constituting routing circuits corresponding to the respective strain-sensing parts and having outer connection terminals near an outer edge of the substrate film from the second metal layer;
forming via holes in the substrate film at positions where the strain-sensing parts face the routing circuits;
filling via holes with a conductive paste; and
mounting leads on the outer connection terminals of the routing circuits.
7. The method for producing a multipoint-measurement strain sensor according to claim 6 , further comprising the steps of:
forming an insulative first cover layer on the first main surface of the substrate film having the via holes filled with the conductive paste so as to cover the strain-sensing parts, and forming an insulative second cover layer on the second main surface of the substrate film so as to cover the routing circuits except for the outer connection terminals; and
forming a conductive terminal protection layer so as to cover the outer connection terminals of the routing circuits.