IP Library › Granted Patent US 10,192,685
Granted Patent B2
US 10,192,685 · App. 15/645,601 · Granted Jan 29, 2019

Multilayer capacitor and board having the same mounted thereon

Inventors: Heung Kil Park (Suwon-si, KR); Jong Hwan Park (Suwon-si, KR); Se Hun Park (Suwon-si, KR); Young Ghyu Ahn (Suwon-si, KR)
Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
H01G4/30H01G4/005H01G4/228H05K1/181H05K3/3442H05K2201/049H05K2201/10015
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Quick Facts
Patent No.
US 10,192,685
App. No.
15/645,601
Granted
Jan 29, 2019
Kind
B2
Abstract

A multilayer capacitor includes a capacitor body including a plurality of first and second internal electrodes alternately disposed therein and a dielectric layer interposed therebetween, and having first to sixth surfaces, opposing each other, respectively; a plurality of external electrodes connected to the first and second internal electrodes; an insulating layer disposed on the first surface; first and second terminal electrodes spaced apart from each other in a direction in which the third and fourth surfaces are connected, on the insulating layer; and a connecting member electrically connecting the first and second terminal electrodes and the external electrodes.

Claims (35)

1. A multilayer capacitor comprising:

a capacitor body including a plurality of first and second internal electrodes alternately disposed therein and a dielectric layer interposed therebetween, the capacitor body having a first surface and a second surface opposing each other, a third surface and a fourth surface opposing each other and connected to the first and second surfaces, and a fifth surface and a sixth surface opposing each other and connected to the first to fourth surfaces;

a plurality of external electrodes connected to the plurality of first and second internal electrodes;

an insulating layer disposed on the first surface of the capacitor body;

a first terminal electrode and a second terminal electrode disposed on the insulating layer and spaced apart from each other in a direction in which the third and fourth surfaces are connected to each other; and

a connecting member electrically connecting the first and second terminal electrodes and the plurality of external electrodes to each other.

2. The multilayer capacitor of claim 1 , wherein the plurality of first and second internal electrodes are exposed to the third and fourth surfaces of the capacitor body, respectively,

the plurality of external electrodes comprise:

a first external electrode including a first connecting portion disposed on the third surface of the capacitor body to be connected to the plurality of the first internal electrodes, and a first band portion extending from a circumference of the first connecting portion to be connected to portions of the first and second surfaces and portions of the fifth and sixth surfaces of the capacitor body; and

a second external electrode including a second connecting portion disposed on the fourth surface of the capacitor body to be connected to the plurality of the second internal electrodes, and a second band portion extending from a circumference of the second connecting portion to be connected to portions of the first and second surfaces and portions of the fifth and sixth surfaces of the capacitor body, and

the connecting member comprises:

first and second extensions extending from both ends of the first terminal electrode to be connected to portions of the first band portion disposed on the fifth and sixth surfaces, respectively; and

third and fourth extensions extending from both ends of the second terminal electrode to be connected to portions of the second band portion disposed on the fifth and sixth surfaces, respectively.

3. The multilayer capacitor of claim 2 , wherein a plating layer is disposed on the first and second external electrodes, the first and second terminal electrodes, and the first and second extensions.

4. The multilayer capacitor of claim 2 , wherein the insulating layer is disposed to cover the first surface and portions of the third to sixth surfaces of the capacitor body.

5. The multilayer capacitor of claim 1 , wherein each of the plurality of the first internal electrodes comprises a first lead-out portion and a second lead-out portion exposed to the fifth and sixth surfaces of the capacitor body, respectively,

each of the plurality of the second internal electrodes comprises a third lead-out portion and a fourth lead-out portion spaced apart from the first and second lead-out portions and exposed to the fifth and sixth surfaces of the capacitor body, respectively,

the plurality of external electrodes comprise:

first and second external electrodes spaced apart from each other on the fifth surface of the capacitor body, and connected to the first and third lead-out portions, respectively; and

third and fourth external electrodes spaced apart from each other on the sixth surface of the capacitor body, and connected to the second and fourth lead-out portions, respectively, and

the connecting member comprises first and second extensions extending from one ends of the first and second terminal electrodes to be connected to the first and second external electrodes, respectively, and third and fourth extensions extending from opposite ends of the first and second terminal electrodes to be connected to the third and fourth external electrodes, respectively.

6. The multilayer capacitor of claim 5 , wherein the plurality of the first and second internal electrodes are spaced apart from the third and fourth surfaces of the capacitor body, respectively.

7. The multilayer capacitor of claim 5 , wherein the first to fourth external electrodes extend from both ends thereof to be connected to portions of the first and second surfaces of the capacitor body.

8. The multilayer capacitor of claim 5 , wherein a plating layer is disposed on the first to fourth external electrodes, the first and second terminal electrodes, and the first to fourth extensions.

9. The multilayer capacitor of claim 5 , wherein the insulating layer is disposed to cover the first surface and portions of the third to sixth surfaces of the capacitor body.

10. The multilayer capacitor of claim 1 , wherein the plurality of first and second internal electrodes are exposed to the third and fourth surfaces of the capacitor body, respectively,

the plurality of external electrodes comprise:

a first external electrode including a first connecting portion disposed on the third surface of the capacitor body to be connected to the plurality of the first internal electrodes, and a first band portion extending from a circumference of the first connecting portion to be connected to portions of the first and second surfaces and portions of the fifth and sixth surfaces of the capacitor body; and

a second external electrode including a second connecting portion disposed on the fourth surface of the capacitor body to be connected to the plurality of the second internal electrodes, and a second band portion extending from a circumference of the second connecting portion to be connected to portions of the first and second surfaces and portions of the fifth and sixth surfaces of the capacitor body, and

the connecting member comprises first and second via electrodes penetrating through the insulating layer from the first and second terminal electrodes to be connected to portions of the first and second band portions formed on the first surface, respectively.

11. The multilayer capacitor of claim 10 , wherein the insulating layer covers entire portions of the first surface of the capacitor body, except portions of the first surface through which the first and second via electrodes penetrate.

12. The multilayer capacitor of claim 10 , wherein a plating layer is disposed on the first and second external electrodes and the first and second terminal electrodes.

13. A board having a multilayer capacitor mounted thereon, comprising:

a substrate including a plurality of electrode pads spaced apart from each other on the substrate; and

the multilayer capacitor of claim 1 , of which terminal electrodes are connected to the plurality of electrode pads, the multilayer capacitor being mounted on the substrate.

Assignments (2)
CORRECTIVE ASSIGNMENT TO CORRECT THE APPLICATION NO. 15644185 PREVIOUSLY RECORDED AT REEL: 043124 FRAME: 0527. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT . Recorded Aug 11, 2017
From: PARK, HEUNG KIL; PARK, JONG HWAN; PARK, SE HUN; AHN, YOUNG GHYU
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 043530/0451 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 7, 2017
From: PARK, HEUNG KIL; PARK, JONG HWAN; PARK, SE HUN; AHN, YOUNG GHYU
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 043124/0527 →
Priority Claims (1)
KR 10-2016-0156573 · Nov 23, 2016 · national
Continuity (1)
Related Publication 20180144868A1 · May 24, 2018
Cited By (1)
US 12,198,856