Transmit-and-receive module
A transmit-and-receive module includes a wiring substrate, a low-noise amplifier, a power amplifier, an insulating resin, and a conductive shield. The wiring substrate has a first surface and a second surface which is a back side of the first surface. The low-noise amplifier includes a first signal terminal and a first ground terminal. The first signal terminal is surface-mounted on the first surface. The power amplifier includes a second signal terminal and a second ground terminal. The second signal terminal and the second ground terminal are surface-mounted on the first surface. The insulating resin covers the low-noise amplifier and the power amplifier. The conductive shield covers a surface of the insulating resin. The first ground terminal is connected to the conductive shield.
1. A transmit-and-receive module comprising:
a wiring substrate having first and second surfaces, the second surface being a back side of the first surface;
a low-noise amplifier including a first signal terminal and a first ground terminal, the first signal terminal being surface-mounted on the first surface;
a power amplifier including a second signal terminal and a second ground terminal, the second signal terminal and the second ground terminal being surface-mounted on the first surface;
an insulating resin covering the low-noise amplifier and the power amplifier; and
a conductive shield covering a surface of the insulating resin, wherein the first ground terminal is connected to the conductive shield, and wherein:
the wiring substrate includes a ground layer;
the first ground terminal is connected to the ground layer via the conductive shield;
the second ground terminal is connected to the ground layer by being surface-mounted on the first surface; and
the first ground terminal is a protruding metal terminal.
2. The transmit-and-receive module according to claim 1 , wherein:
the second surface includes third and fourth ground terminals separated from each other;
the first ground terminal is connected to the third ground terminal via the conductive shield; and
the second ground terminal is connected to the fourth ground terminal by being surface-mounted on the first surface.
3. The transmit-and-receive module according to claim 1 , wherein:
the conductive shield is connected to the ground layer on the side surfaces of the wiring substrate.