Semiconductor apparatus
A semiconductor apparatus includes: a p-type base layer provided on a top surface side of an n-type drift layer; an n-type emitter layer provided on a top surface side of the p-type base layer; a first control electrode having a trench gate electrode embedded so as to reach from a surface layer of the n-type emitter layer to the n-type drift layer; a second control electrode having a trench gate electrode embedded so as to reach from the p-type base layer to the n-type drift layer; a p-type collector layer provided on a bottom surface side of the n-type drift layer; and a diode whose anode side and cathode side are connected to the first control electrode and the second control electrodes, respectively. It is possible to improve the controllability of dV/dt by a gate resistor.
1. A semiconductor apparatus comprising:
an n-type drift layer;
a p-type base layer provided on a top surface side of the drift layer;
an n-type emitter layer selectively provided on a top surface side of the base layer;
a trench gate that allows a trench gate electrode to be in contact with the emitter layer, the base layer, and the drift layer via a gate insulating film, the trench gate electrode being embedded so as to reach from a surface layer of the emitter layer to the drift layer;
a dummy trench gate that allows a dummy trench gate electrode to be in contact with the base layer and the drift layer via a gate insulating film, the dummy trench gate electrode being embedded so as to reach from a surface layer of the base layer to the drift layer;
a p-type collector layer provided on a bottom surface side of the drift layer; and
a diode whose anode side and cathode side are electrically connected to the trench gate electrode and the dummy trench gate electrode, respectively.
2. The semiconductor apparatus according to claim 1 , comprising a plurality of the dummy trench gates, wherein one or some of the plurality of the dummy trench gate electrodes are electrically connected to an emitter electrode provided on the emitter layer and the other of the dummy trench gate electrodes is/are electrically connected to the cathode side of the diode.
3. The semiconductor apparatus according to claim 1 , wherein
the dummy trench gate electrode is formed of an n-type semiconductor and has a wiring portion that is connected to a second gate pad provided on the top surface side of the drift layer, and
the diode is formed of a pn junction of a p-type semiconductor and the n-type semiconductor that are provided in a part of the wiring portion.
4. The semiconductor apparatus according to claim 1 , wherein the diode includes a plurality of diodes connected in series.
5. The semiconductor apparatus according to claim 1 , wherein the trench gate electrode is connected to the anode side of the diode via a resistor.
6. The semiconductor apparatus according to claim 5 , wherein
the trench gate electrode is formed of a semiconductor containing an impurity and has a wiring portion that is connected to a first gate pad provided on the top surface side of the drift layer, and
the resistor is formed of a region that is provided in the wiring portion and has a lower impurity concentration than in the trench gate.
7. A semiconductor apparatus comprising:
an n-type drift layer;
a p-type base layer selectively provided on a top surface side of the drift layer;
an n-type emitter layer provided on a top surface side of the base layer;
a trench gate that allows a trench gate electrode to be in contact with the emitter layer, the base layer, and the drift layer via a gate insulating film, the trench gate electrode being embedded so as to reach from a surface layer of the emitter layer to the drift layer;
a dummy trench gate that allows a dummy trench gate electrode to be in contact with the drift layer via a gate insulating film, the dummy trench gate electrode being embedded from a surface layer of the drift layer to an inside of the drift layer;
a p-type collector layer provided on a bottom surface side of the drift layer; and
a diode whose anode side and cathode side are electrically connected to the trench gate electrode and the dummy trench gate electrode, respectively.
8. The semiconductor apparatus according to claim 7 , comprising a plurality of the dummy trench gates, wherein one or some of the plurality of the dummy trench gate electrodes are electrically connected to an emitter electrode provided on the emitter layer and the other of the dummy trench gate electrodes is/are electrically connected to the cathode side of the diode.
9. The semiconductor apparatus according to claim 7 , wherein
the dummy trench gate electrode is formed of an n-type semiconductor and has a wiring portion that is connected to a second gate pad provided on the top surface side of the drift layer, and
the diode is formed of a pn junction of a p-type semiconductor and the n-type semiconductor that are provided in a part of the wiring portion.
10. The semiconductor apparatus according to claim 7 , wherein the diode includes a plurality of diodes connected in series.
11. The semiconductor apparatus according to claim 7 , wherein the trench gate electrode is connected to the anode side of the diode via a resistor.
12. The semiconductor apparatus according to claim 11 , wherein
the trench gate electrode is formed of a semiconductor containing an impurity and has a wiring portion that is connected to a first gate pad provided on the top surface side of the drift layer, and
the resistor is formed of a region that is provided in the wiring portion and has a lower impurity concentration than in the trench gate.