Minimizing printed circuit board warpage

1. A method of fabricating an asymmetric printed circuit board with reduced warpage, the method comprising:

creating a stack of layers, wherein the stack of layers includes a top layer and a bottom layer;

determining a first area and a second area of the stack of layers;

determining a first target coefficient of thermal expansion for the first area and a second target coefficient of thermal expansion for the second area based, at least in part, on an amount of heat that is predicted to be produced by at least one circuit component;

identifying, in the stack of layers, a portion of the first area and a portion of the second area that include resin; and

generating the asymmetric printed circuit board, at least in part, by differentially applying at least one of (i) electromagnetic radiation and (ii) pressure to each of (a) the portion of the first area based on the first target coefficient of thermal expansion and (b) the portion of the second area based on the second target coefficient of thermal expansion, thereby increasing curing of resin included in the portion of the first area and the portion of the second area, wherein (i) a degree of curing in the first area is different than a degree of curing in the second area, and (ii) at least one of an amount of electromagnetic radiation and an amount of pressure applied to areas that include resin are based, at least in part, on at least one of a recommended set point for the resin, dwell time for the resin, ramp rate for the resin, and warpage predicted by computer modeling.

2. The method of claim 1 , wherein an increase in the degree of curing of the resin included in the stack of layers results in a change in a coefficient of thermal expansion for at least the portion of the first area that includes resin.

3. The method of claim 1 , wherein the stack of layers is comprised of alternating circuit layers and insulating layers.

4. The method of claim 3 , wherein the alternating circuit layers and insulating layers are compressed together.

5. The method of claim 3 , wherein at least one of the alternating circuit layers and insulating layers are modified using one or more of laminating, patterning, masking, stripping, washing, electro-less metal plating, electrolytic metal plating, etching, cutting, drilling, filling an opening with a thermally conductive material, filling an opening with a thermally insulating material, filling an opening with an electrically conductive material, and filling an opening with an electrically insulating material.

6. The method of claim 4 , wherein at least one of electromagnetic radiation and pressure is applied to at least one of the alternating circuit layers and insulating layers before the alternating circuit layers and insulating layers are compressed together, and wherein the applied electromagnetic radiation includes one or more frequencies included in the range of 300 GHz (microwave) to 750 THz (ultra-violet).

7. The method of claim 1 , the method further comprising the steps of:

identifying a perimeter of the first area, wherein the perimeter contains resin; and

applying at least one of electromagnetic radiation and pressure to at least a portion of the perimeter, thereby increasing the degree of curing of the resin included in the portion of the perimeter.

8. The method of claim 7 , wherein the increased degree of curing of the resin included in the portion of the perimeter controls, at least in part, the flow of resin within the stack of layers.

9. The method of claim 7 , wherein the amount of electromagnetic radiation and pressure applied to the portion of the perimeter are based, at least in part, on at least one of a recommended set point for the resin, dwell time for the resin, ramp rate for the resin, warpage predicted by computer modeling, and a flow of resin predicted by computer modeling, and wherein the applied electromagnetic radiation includes one or more frequencies included in the range of 300 GHz (microwave) to 750 THz (ultra-violet).

10. The method of claim 1 further comprising the step of:

applying different amounts of electromagnetic radiation to both of the top layer and the bottom layer of the stack of layers, wherein the application of the electromagnetic radiation changes the degree of curing of resin respective to the top layer and the bottom layer of the stack of layers, wherein a respective degree of curing of resin generates a coefficient of thermal expansion of the top layer that is different than a coefficient of thermal expansion of the bottom layer.

11. The method of claim 10 , wherein the amount of electromagnetic radiation applied to at least one of the top layer and the bottom layer of the stack of layers is based, at least in part, on one or more of a recommended set point for the resin, dwell time for the resin, ramp rate for the resin, and warpage predicted by computer modeling, and wherein the applied electromagnetic radiation includes one or more frequencies included in the range of 300 GHz (microwave) to 750 THz (ultra-violet).

12. The method of claim 1 , wherein the first area and the second area are separated, at least in part, by an insulating material.

13. The method of claim 1 , wherein the top layer and the bottom layer of the stack of layers are separated, at least in part, by a layer of insulating material.

14. The method of claim 1 , wherein the applied electromagnetic radiation includes one or more frequencies included in the range of 300 GHz (microwave) to 750 THz (ultra-violet).