IP Library › Granted Patent US 10,199,154
Granted Patent B2
US 10,199,154 · App. 15/200,700 · Granted Feb 5, 2019

Coil component and method of manufacturing the same

Inventors: Seok Il Hong (Suwon-si, KR); Jae Yeol Choi (Suwon-si, KR); Jong Bong Lim (Suwon-si, KR); Ju Hwan Yang (Suwon-si, KR)
Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
H01F27/2804H01F1/26H01F17/0013H01F17/04H01F27/245H01F27/255H01F27/29H01F27/292H01F41/0233H01F41/041H01F41/042H01F41/046H01F41/10H01F2027/2809
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Quick Facts
Patent No.
US 10,199,154
App. No.
15/200,700
Granted
Feb 5, 2019
Kind
B2
Abstract

A coil component and a method of manufacturing the coil component are provided. The coil component includes a coil part, a body, and an electrode. The coil part includes a support member, a first coil layer disposed on one surface of the support member, and a second coil layer disposed on the first coil layer. The body includes a magnetic material covering the coil part. The electrode is disposed on the body and is connected to the coil part. The first and second coil layers may each include an insulating layer having a pattern in a planar coil shape and a conductor layer disposed in the pattern and including a seed layer and a plating layer. Additionally, seed layers of the first and second coil layers may be disposed differently in the conductor layers of the first and second coil layers.

Claims (58)

1. A coil component, comprising:

a coil part including a support member, a first coil layer disposed on one surface of the support member, and a second coil layer disposed on the first coil layer;

a body including a magnetic material covering the coil part; and

an electrode disposed on the body and connected to the coil part,

wherein the first and second coil layers each includes an insulating layer having a pattern in a planar coil shape and a conductor layer disposed in the pattern and including a seed layer and a plating layer, and

seed layers of the first and second coil layers have different cross sectional shapes such that the seed layer of the first coil layer is planar and extends on only a lower surface from among lower and side surfaces of the plating layer of the first coil layer, and the seed layer of the second coil layer extends on a lower surface and side surfaces of the plating layer of the second coil layer disposed on the first coil layer having the planar seed layer.

2. The coil component of claim 1 , wherein the seed layer of the first coil layer has a flat cross sectional shape, and

the seed layer of the second coil layer has a bent cross sectional shape.

3. The coil component of claim 1 , wherein the coil part further includes:

a first insulating film disposed between the first and second coil layers;

a second insulating film disposed on the second coil layer; and

a first via penetrating through the first insulating film and electrically connecting the first and second coil layers.

4. The coil component of claim 1 , wherein the coil part further includes a third coil layer disposed on another surface of the support member opposite to the one surface, and a fourth coil layer disposed on the third coil layer,

wherein the third and fourth coil layers each include an insulating layer having a pattern in a planar coil shape and a conductor layer filling the pattern and including a seed layer and a plating layer, and

seed layers of the third and fourth coil layers are disposed differently in the conductor layers of the third and fourth coil layers.

5. The coil component of claim 4 , wherein the seed layer of the third coil layer is disposed on one first side of the conductor layer of the third coil layer, and

the seed layer of the fourth coil layer is disposed on the one first side of the conductor layer of the fourth coil layer and on a second side of the conductor layer of the fourth coil layer perpendicular to the first side.

6. The coil component of claim 4 , wherein the seed layers of the third and fourth coil layers have different cross sectional shapes.

7. The coil component of claim 6 , wherein the seed layer of the third coil layer has a flat cross sectional shape to extend on only a lower surface from among lower and side surfaces of the plating layer of the third coil layer, and

the seed layer of the fourth coil layer has a bent cross sectional shape to extend on a lower surface and side surfaces of the plating layer of the fourth coil layer disposed on the third coil layer having the flat seed layer.

8. The coil component of claim 4 , wherein the coil part further includes:

a third insulating film disposed between the third and fourth coil layers;

a fourth insulating film disposed on the fourth coil layer; and

a second via penetrating through the third insulating film and electrically connecting the third and fourth coil layers.

9. The coil component of claim 4 , wherein the coil part further includes a through conductor penetrating through the support member and electrically connecting the first and third coil layers.

10. The coil component of claim 4 , wherein the first to fourth coil layers are electrically connected to each other to form one coil, and

the electrode includes:

a first electrode connected to an end portion of the second coil layer, and

a second electrode connected to an end portion of the fourth coil layer.

11. The coil component of claim 4 , wherein the first and second coil layers are connected to each other to form one coil,

the third and fourth coil layers are connected to each other to form another coil, and

the electrode includes:

a first electrode connected to an end portion of the first coil layer,

a second electrode connected to an end portion of the second coil layer,

a third electrode connected to an end portion of the third coil layer, and

a fourth electrode connected to an end portion of the fourth coil layer.

12. The coil component of claim 1 , wherein the support member includes a glass fiber and an insulating resin.

13. A coil component, comprising:

a support member;

a first coil layer disposed on one surface of the support member;

a second coil layer disposed on the first coil layer;

a third coil layer disposed on another surface of the support member opposite to the one surface;

a fourth coil layer disposed on the third coil layer;

external electrodes connected to ends of the second and fourth coil layers,

wherein each of the first, second, third, and fourth coil layers includes a coil conductor comprising a seed layer and a plating layer, and

wherein the seed layers of the first and third coil layers are mutually symmetrical about a center plane of the support member, and each have different shapes from the seed layers of the second and fourth coil layers which are mutually symmetrical about the center plane of the support member.

14. The coil component of claim 13 , further comprising:

a through conductor penetrating through the support member to directly electrically connect the first and third coil layers to each other.

15. The coil component of claim 14 , wherein the seed layers and plating layers of each of the first and third coil layers extend through the through conductor to electrically connect the first and third conductor layers.

16. The coil component of claim 13 , further comprising:

a first insulating film disposed directly on the first coil layer, having the second coil layer disposed directly thereon, and having a first via penetrating therethrough to connect the coil conductors of the first and second coil layers to each other; and

a second insulating film disposed directly on the third coil layer, having the fourth coil layer disposed directly thereon, and having a second via penetrating therethrough to connect the coil conductors of the third and fourth coil layers to each other.

17. The coil component of claim 16 , wherein the seed layer of the second coil layer extends through the first via to directly contact the coil conductor of the first coil layer, and

wherein the seed layer of the fourth coil layer extends through the second via to directly contact the coil conductor of the third coil layer.

18. The coil component of claim 16 , wherein the seed layers of each of the first and third coil layers are disposed in a planar coil pattern directly on a respective one of the one and the other surface of the support member to extend on only one surface from among surfaces of the plating layers of each the first and third coil layers,

wherein the seed layers of the second and fourth coil layers are disposed in a planar coil pattern on the first and second insulating films respectively, and extend along lateral surfaces of the coil conductors of the second and fourth coil layers, and

wherein the plating layer of the second and fourth coil layers each fill a space between the extensions of the seed layers on the lateral surfaces.

19. The coil component of claim 13 , wherein each of the first, second, third, and fourth coil layers includes an insulating layer disposed to form a planar coil pattern, and the insulating layers each include a mixture of an insulating resin and a magnetic filler.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 1, 2016
From: HONG, SEOK IL; CHOI, JAE YEOL; LIM, JONG BONG; YANG, JU HWAN
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 039065/0910 →
Priority Claims (1)
KR 10-2015-0161637 · Nov 18, 2015 · national
Continuity (1)
Related Publication 20170140866A1 · May 18, 2017
Cited By (2)
US 12,562,309 US 12,744,153