Mounting device and mounting method
A mounting device includes a thermocompression bonding head, a pressure reduction mechanism, and a resin sheet feed mechanism. The thermocompression bonding head is configured to heat a semiconductor chip while holding the semiconductor chip and to bond the semiconductor chip to a joined piece by compression. The thermocompression bonding head has a suction hole in a face that holds the semiconductor chip. The pressure reduction mechanism communicates with the suction hole and is configured to reduce pressure inside the suction hole. The resin sheet feed mechanism is configured to supply a resin sheet between the thermocompression bonding head and the semiconductor chip. An electrode that protrudes from a top face of the semiconductor chip is bonded by thermocompression after being embedded in the resin sheet.
1. A mounting device with which a semiconductor chip that has electrodes on top and bottom faces is bonded by thermocompression to a joined piece that is disposed on a lower side of the semiconductor chip and has an electrode on a top face, in a state in which a thermosetting adhesive is interposed between the semiconductor chip and the joined piece, the mounting device comprising:
a thermocompression bonding head configured to heat the semiconductor chip while holding the semiconductor chip and to bond the semiconductor chip to the joined piece by compression, the thermocompression bonding head having a suction hole in a face that holds the semiconductor chip;
a pressure reduction mechanism communicating with the suction hole and configured to reduce pressure inside the suction hole; and
a resin sheet feed mechanism configured to supply a resin sheet between the thermocompression bonding head and the semiconductor chip,
the electrode protruding from the top face of the semiconductor chip being bonded by thermocompression after being embedded in the resin sheet.
2. The mounting device according to claim 1 , further comprising
a controller configured to set a heating temperature of the thermocompression bonding head,
the pressure reduction mechanism having a pressure gauge that is configured to measure the pressure inside the suction hole and is configured to output a measured value to the controller, and
the controller being further configured to change a setting of the heating temperature of the thermocompression bonding head according to the measured value measured by the pressure gauge.
3. The mounting device according to claim 2 , wherein
the resin sheet feed mechanism is configured to form a through-hole in the resin sheet at a position corresponding to the suction hole.
4. The mounting device according to claim 3 , wherein
the mounting device is configured to separate the resin sheet from the semiconductor chip in a state in which the resin sheet is in close contact with a surface of the thermocompression bonding head after thermocompression bonding.
5. The mounting device according to claim 4 , further comprising
a movement mechanism configured to separate the thermocompression bonding head and the resin sheet.
6. The mounting device according to claim 2 , wherein
the mounting device is configured to separate the resin sheet from the semiconductor chip in a state in which the resin sheet is in close contact with a surface of the thermocompression bonding head after thermocompression bonding.
7. The mounting device according to claim 6 , further comprising
a movement mechanism configured to separate the thermocompression bonding head and the resin sheet.
8. The mounting device according to claim 1 , wherein
the resin sheet feed mechanism is configured to form a through-hole in the resin sheet at a position corresponding to the suction hole.
9. The mounting device according to claim 8 , wherein
the mounting device is configured to separate the resin sheet from the semiconductor chip in a state in which the resin sheet is in close contact with a surface of the thermocompression bonding head after thermocompression bonding.
10. The mounting device according to claim 9 , further comprising
a movement mechanism configured to separate the thermocompression bonding head and the resin sheet.
11. The mounting device according to claim 1 , wherein
the mounting device is configured to separate the resin sheet from the semiconductor chip in a state in which the resin sheet is in close contact with a surface of the thermocompression bonding head after thermocompression bonding.
12. The mounting device according to claim 11 , further comprising
a movement mechanism configured to separate the thermocompression bonding head and the resin sheet.
13. A mounting method for bonding a semiconductor chip that has electrodes on top and bottom faces to a joined piece that is disposed on a lower side of the semiconductor chip and has an electrode on a top face by thermocompression, in a state in which a thermosetting adhesive is interposed between the semiconductor chip and the joined piece, the method comprising:
holding the semiconductor chip with a thermocompression bonding head by suction via a resin sheet in which a through-hole is formed at a position corresponding to a suction hole in the thermocompression bonding head;
embedding the electrode protruding from the top face of the semiconductor chip in the resin sheet in a state in which the thermocompression bonding head has been brought to a specific temperature or below; and
raising a temperature setting of the thermocompression bonding head to join the electrode on the bottom face of the semiconductor chip to the electrode on the top face of the joined piece, and to harden the thermosetting adhesive with heat.
14. The mounting method according to claim 13 , wherein
the embedding of the electrode protruding from the top face of the semiconductor chip in the resin sheet includes monitoring the pressure within the suction hole, and raising the temperature setting of the thermocompression bonding head to a temperature at which the electrode on the bottom face of the semiconductor chip is joined to the top face of the joined piece, and the thermosetting adhesive is hardened with heat once the pressure falls to a specific level or below.
15. The mounting method according to claim 14 , further comprising
separating the resin sheet from the semiconductor chip in a state in which the resin sheet is in close contact with a surface of the thermocompression bonding head after thermocompression bonding.
16. The mounting method according to claim 15 , further comprising
separating the resin sheet from the thermocompression bonding head after separating the resin sheet from the semiconductor chip.
17. The mounting method according to claim 14 , further comprising
separating the resin sheet from the thermocompression bonding head after separating the resin sheet from the semiconductor chip.
18. The mounting method according to claim 13 , further comprising
separating the resin sheet from the semiconductor chip in a state in which the resin sheet is in close contact with a surface of the thermocompression bonding head after thermocompression bonding.
19. The mounting method according to claim 18 , further comprising
separating the resin sheet from the thermocompression bonding head after separating the resin sheet from the semiconductor chip.
20. The mounting method according to claim 13 , further comprising
separating the resin sheet from the thermocompression bonding head after separating the resin sheet from the semiconductor chip.