Image-capturing unit and image-capturing apparatus
Provided is an image-capturing unit including an image-capturing chip that includes a first surface having a pixel and a second surface that is on an opposite side of the first surface and has provided thereon an output section that outputs a pixel signal read from the pixel; a transparent substrate that is arranged facing the first surface and includes a wire pattern; a mounting substrate that is arranged facing the second surface and supports the image-capturing chip; and a relay section that is arranged on the mounting substrate and relays, to the wire pattern, the pixel signal output from the output section. Also provided is an image-capturing apparatus including the image-capturing unit described above.
1. An image-capturing unit comprising:
a first substrate to which light is inputted;
a second substrate on which is arranged an image-capturing chip to which light from the first substrate is inputted; and
a connecting section that connects the first substrate and the second substrate, wherein:
the image-capturing chip, the first substrate and the second substrate have different thermal expansion coefficients, and
a difference between the thermal expansion coefficients of the second substrate and the first substrate is smaller than a difference between the thermal expansion coefficients of the image-capturing chip and the first substrate.
2. The image-capturing unit according to claim 1 , wherein:
the first substrate has first wiring,
the second substrate has second wiring connected to the image-capturing chip, and
the connecting section connects the first wiring and the second wiring.
3. The image-capturing unit according to claim 2 , wherein
the image-capturing chip includes:
a pixel that includes a photoelectric converter that converts light from the first substrate into charge; and
an output section that outputs a signal from the pixel to the second wiring.
4. The image-capturing unit according to claim 3 , wherein:
the image-capturing chip includes a first surface facing the first substrate and a second surface facing the second substrate,
a plurality of the pixels are arranged on the first surface, and
the output section is arranged on the second surface.
5. The image-capturing unit according to claim 2 , wherein
the connecting section includes a bump that connects the first wiring and the second wiring.
6. The image-capturing unit according to claim 3 , further comprising a signal processing chip that is connected to the first wiring and processes a signal outputted from the pixel.
7. The image-capturing unit according to claim 6 , wherein
the signal processing chip is arranged in parallel with the image-capturing chip.
8. The image-capturing unit according to claim 6 , wherein
the image-capturing chip is arranged between the first substrate and the second substrate in a first direction, and
the signal processing chip is arranged in parallel with the image-capturing chip in a second direction that is different from the first direction.
9. The image-capturing unit according to claim 1 , further comprising a heat conducting material between the image-capturing chip and the second substrate.
10. The image-capturing unit according to claim 1 , further comprising a heat releasing member that releases heat from the second substrate.
11. The image-capturing unit according to claim 1 , further comprising a sealing member that seals a space between the image-capturing chip and the first substrate.
12. An image-capturing apparatus comprising the image-capturing unit according to claim 1 .