Monolithic integrated device
Monolithic integrated device having an architecture that allows an acoustic device to transduce either surface acoustic waves or bulk acoustic waves, comprising: a substrate layer being the base of the device; an inter-layer dielectric disposed on top of the substrate layer; an electronic circuitry substantially formed in the inter-layer dielectric and supported by the substrate layer, the electronic circuitry comprises a plurality of metal layers; and a piezoelectric layer being sandwiched between a top electrode and a bottom electrode within the inter-layer dielectric. The top electrode is an upper metal layer belonging to the electronic circuitry and the bottom electrode is a lower metal layer belonging to the electronic circuitry. To transduce the bulk acoustic waves, the inter-layer dielectric is formed with a top cavity above the top electrode and a bottom cavity below the bottom electrode.
1. A monolithic integrated device, comprising:
a substrate layer being the base of the device;
an inter-layer dielectric disposed on top of the substrate layer;
an electronic circuitry substantially formed in the inter-layer dielectric and supported by the substrate layer, the electronic circuitry including a plurality of metal layers;
a passivation layer formed on top of the inter-layer dielectric; and
a piezoelectric layer being sandwiched between a top electrode and a bottom electrode within the inter-layer dielectric;
wherein the top electrode is positioned in proximity to the passivation layer;
wherein the monolithic integrated device is formed with a first bond-pad opening that extends through the passivation layer and partially into the inter-layer dielectric until the first bond-pad opening reaches one of the metal layers from the electronic circuitry that serves as a top electrode and a first bonding pad;
wherein the monolithic integrated device is formed with a second bond-pad opening that extends through the passivation layer and partially into the inter-layer dielectric until the second bond-pad opening reaches one of the metal layers from the electronic circuitry that serves as a bottom electrode and a second bonding pad.
2. The monolithic integrated device according to claim 1 , wherein the inter-layer dielectric is formed with a top cavity above the top electrode and a bottom cavity below the bottom electrode.
3. The monolithic integrated device according to claim 1 , wherein the electronic circuitry includes at least a gate in the inter-layer dielectric.
4. The monolithic integrated device according to claim 3 , wherein the electronic circuitry includes at least a source and drain region that has a source and a drain respectively connected to the gate.
5. The monolithic integrated device according to claim 4 , wherein the electronic circuitry includes at least a contact component for connecting any one or combination of the source and drain region and the gate to one of the metals layers.
6. The monolithic integrated device according to claim 1 , further comprising one or more vias for connecting different metal layers.
7. The monolithic integrated device according to claim 1 , wherein the electronic circuitry is a CMOS device.
8. A monolithic integrated device, comprising:
a substrate layer being the base of the device;
an inter-layer dielectric disposed on top of the substrate layer;
a passivation layer disposed on top of the inter-layer dielectric;
an electronic circuitry substantially formed in the inter-layer dielectric and supported by the substrate layer, the electronic circuitry including a plurality of metal layers; and
a piezoelectric layer being sandwiched between a top electrode and a bottom electrode within the inter-layer dielectric, the top electrode is an upper metal layer belonging to the electronic circuitry and the bottom electrode is a lower metal layer belonging to the electronic circuitry;
wherein the top electrode is positioned in proximity to the passivation layer;
wherein the monolithic integrated device is formed with a first bond-pad opening that extends through the passivation layer and partially into the inter-layer dielectric until the first bond-pad opening reaches one of the metal layers from the electronic circuitry that serves as a top electrode and a first bonding pad;
wherein the monolithic integrated device is formed with a second bond-pad opening that extends through the passivation layer and partially into the inter-layer dielectric until the second bond-pad opening reaches one of the metal layers from the electronic circuitry that serves as a bottom electrode and a second bonding pad.
9. The monolithic integrated device according to claim 8 , wherein the electronic circuitry includes at least a gate in the inter-layer dielectric.
10. The monolithic integrated device according to claim 9 , wherein the electronic circuitry includes at least a source and drain region that has a source and a drain respectively connected to the gate.
11. The monolithic integrated device according to claim 10 , wherein the electronic circuitry includes at least a contact component for connecting any one or combination of the source and drain region and the gate to one of the metals layers.
12. The monolithic integrated device according to claim 8 , further comprising one or more vias for connecting different metal layers.
13. The monolithic integrated device according to claim 8 , wherein the electronic circuitry is a CMOS device.