Downhole laser systems, apparatus and methods of use
Systems, apparatus and methods for performing laser operations in boreholes and other remote locations, such operations including laser drilling of a borehole in the earth, and laser workover and completion operations. Systems, apparatus and methods for generating and delivering high power laser energy below the surface of the earth and within a borehole. Laser operations using such down hole generated laser beams.
1. A high power laser bottom hole assembly comprising:
a. a high power laser, the high power laser comprising an array of diodes capable of providing a high power laser beam;
b. the high power laser beam having at least about 5 kW of power, having a beam parameter of less than 50 mm millrad, and having a wavelength selected from the range of 455 nm to 810 nm;
c. a cooling system for the high power laser;
d. a channel for directing a working fluid; and,
e. laser optics, whereby the high power laser and the laser optics are in optical communication, thereby providing the ability to direct the high power laser beam within the bottom hole assembly, out of the bottom hole assembly and to a down hole target.
2. The assembly of claim 1 , wherein the target is selected from the group consisting of a down hole plug, a production casing, a casing, a bore hole sidewall, and a bottom of a borehole.
3. The assembly of claim 1 , wherein the beam parameter of less than 15 mm millrad.
4. A method of performing down hole laser operations in a bore hole below the surface of the earth, the method comprising:
a. lowering an assembly comprising a high power laser below the surface of the earth into a borehole;
b. providing a source of power to the high power laser;
c. generating below the surface of the earth in the borehole a high power laser beam having at least 5 kW of power and a wavelength less than 810 nm;
d. directing the high power laser beam through optics, whereby the laser beam is shape into a predetermined pattern; and,
e. directing the laser beam to a target in the borehole to perform a laser operation.
5. The method of claim 4 , wherein the target is selected from the group consisting of a down hole plug, a production casing, a casing, a bore hole sidewall, and a bottom of a borehole.
6. The method of claim 4 , wherein the laser operation is selected from the group consisting of advancing the well bore, finishing the well bore, and work over activities.
7. The method of claim 4 , wherein the laser operation is selected from the group consisting of drilling, perforating, window cutting, pipe cutting, and plug removal.
8. The method of claim 4 , wherein generating below the surface of the earth in the borehole a high power laser beam comprising combining laser beams from a plurality of laser sources.
9. The method of claim 4 , wherein the high power laser comprises a diode laser.
10. The method of claim 9 , wherein the target is selected from the group consisting of the bottom of a borehole, the side wall of a borehole, a casing, a tubular, an interior surface of a tubular, an exterior surface of a tubular, and a subsea structure.
11. The method of claim 4 , wherein the high power laser comprises a plurality of high brightness diode lasers; and wherein the laser beam has an M 2 of less than 2.
12. The method of claim 4 , wherein the high power laser comprises a plurality phase arrayed diode lasers.
13. The method of claim 4 , wherein the high power laser comprises a high brightness diode laser; and wherein the laser beam has a beam parameter of less than 50 mm millrad.
14. The method of claim 4 , wherein the high power laser comprises a high brightness diode laser; and wherein the laser beam has a beam parameter of less than 15 mm millrad.
15. The method of claim 4 , wherein the high power laser comprises a high brightness diode laser; and wherein the laser beam has a beam parameter of less than 12 mm millrad.
16. The method of claim 15 , wherein the target is selected from the group consisting of the bottom of a borehole, the side wall of a borehole, a casing, a tubular, an interior surface of a tubular, an exterior surface of a tubular, and a subsea structure.
17. The method of claim 16 , wherein the source of power is electrical, and the electrical optical efficiency of the high power laser is at least 25%.
18. The method of claim 4 , wherein the power source is selected from the group consisting of an optical power source, a power cable, and a down hole electrical generator.
19. The method of claim 18 , wherein the target is selected from the group consisting of the bottom of a borehole, the side wall of a borehole, a casing, a tubular, an interior surface of a tubular, an exterior surface of a tubular, and a subsea structure.
20. The method of claim 4 comprising sorption cooling of the laser.
21. The method of claim 20 , wherein the target is selected from the group consisting of the bottom of a borehole, the side wall of a borehole, a casing, a tubular, an interior surface of a tubular, an exterior surface of a tubular, and a subsea structure.
22. The method of claim 4 , comprising delivering a working fluid to the target, wherein the working fluid has been selected to minimize the absorption of the laser beam.
23. The method of claim 22 , wherein the absorption of the laser beam by the working fluid is less than 0.001 l/cm.
24. The method of claim 22 , wherein the target is selected from the group consisting of the bottom of a borehole, the side wall of a borehole, a casing, a tubular, an interior surface of a tubular, an exterior surface of a tubular, and a subsea structure.
25. The method of claim 22 , wherein the absorption of the laser beam by the working fluid is less than 0.1% per inch.
26. The method of claim 22 , wherein the absorption of the laser beam by the working fluid is less than 4% per inch.
27. The method of claim 26 , wherein the target is selected from the group consisting of the bottom of a borehole, the side wall of a borehole, a casing, a tubular, an interior surface of a tubular, an exterior surface of a tubular, and a subsea structure.
28. The method of claim 4 comprising lowering the assembly from a field unit, the field unit selected from the group consisting of land based rigs, mobile land based rigs, fixed tower rigs, barge rigs, drill ships, jack-up platforms, and semi-submersible rigs.
29. The method of claim 4 , wherein the target is selected from the group consisting of the bottom of a borehole, the side wall of a borehole, a casing, a tubular, an interior surface of a tubular, an exterior surface of a tubular, and a subsea structure.
30. The method of claim 29 , wherein the source of power is electrical, and the electrical optical efficiency of the high power laser is at least 25%.
31. The method of claim 4 , wherein the laser operation is selected from the group consisting of cutting, heat treating, thermal processing, annealing, advancing a borehole, workover and completion, removing material, cleaning, milling, flow assurance, decommissioning, plugging, abandonment and perforating.
32. The method of claim 4 , wherein the source of power is electrical, and the electrical optical efficiency of the high power laser is at least 10%.
33. The method of claim 4 , wherein the source of power is electrical, and the electrical optical efficiency of the high power laser is at least 25%.
34. A method of performing laser operations below the surface of the earth, the method comprising:
a. lowering an assembly comprising a high power laser beam source below the surface of the earth to a depth within a borehole, the high power laser beam source comprising a plurality of lasers, wherein the lasers are capable of generating laser beams having waive lengths of 810 nm or less;
b. providing a source of power to the high power laser source;
c. generating below the surface of the earth in the borehole a plurality of laser beam having wavelengths of 810 nm or less; combining a plurality of the laser beams to form a single high power laser beam having at least 10 kW of power and a wavelength 810 nm or less;
d. cooling the high power laser source to a temperature at or below 100° C.; and,
e. directing the single high power laser beam to a target in the borehole to perform a laser operation.
35. The method of claim 34 , wherein the target is selected from the group consisting of the bottom of a borehole, the side wall of a borehole, a casing, a tubular, an interior surface of a tubular, an exterior surface of a tubular, and a subsea structure.
36. The method of claim 35 , wherein the single high power laser beam has a power of at least 10 kW.
37. The method of claim 35 , wherein the single high power laser beam has a power of at least 20 kW.
38. The method of claim 34 , wherein the laser operation is selected from the group consisting of cutting, heat treating, thermal processing, annealing, advancing a borehole, workover and completion, removing material, cleaning, milling, flow assurance, decommissioning, plugging, abandonment and perforating.
39. The method of claim 38 , wherein the source of power is electrical, and the electrical optical efficiency of the high power laser source is at least 25%.
40. The method of claim 34 , wherein the cooling comprises sending a liquid downhole, the liquid having a temperature lower than an ambient temperature in the borehole at the depth of the high power laser source.
41. The method of claim 34 , wherein the source of power is electrical, and the electrical optical efficiency of the high power laser source is at least 25%.
42. A method of performing down hole laser operations in a bore hole, the method comprising:
a. providing a source of power to a high power laser beam source located at a depth within a borehole, the high power laser beam source comprising a laser; thereby generating a laser beam having a wavelength of less than 900 nm;
b. cooling the laser, wherein the cooling comprises sending a fluid into the borehole, the fluid having a temperature lower than an ambient temperature within the borehole at the depth of the high power laser source;
c. providing within the borehole at the depth of the high power laser source a high power laser beam having at least 5 kW of power and a wavelength less than 900 nm;
d. shaping the high power laser beam into a predetermined shape; and,
e. directing the high power laser beam to a target within the borehole to perform a laser operation at the depth within the borehole.
43. The method of claim 42 , wherein the source of power is electrical, and the electrical optical efficiency of the lasers are at least 10%.
44. The method of claim 42 , wherein the source of power is electrical, and the electrical optical efficiency of the lasers are at least 25%.
45. The method of claim 42 , wherein the laser operation is selected from the group consisting of cutting, heat treating, thermal processing, annealing, advancing a borehole, workover and completion, removing material, cleaning, milling, flow assurance, decommissioning, plugging, abandonment and perforating.
46. A method of performing a laser operation on a target below the surface of the earth, the method comprising:
a. generating a first laser beam from a first laser; generating a second laser beam from a second laser positioned in a borehole below the surface of the earth;
b. the second laser beam having an M 2 of 2 or less, and a wavelength of 810 nm or less;
c. combining the first and second laser beams to form an operational laser beam, wherein the operational laser beam has a power of at least about 5 kW;
d. directing the operational laser beam to a target in the borehole; thereby performing a laser operation on the target; and,
e. cooling the first and second lasers.
47. The method of claim 46 , comprising an electrical power source for the first laser, wherein the electrical optical efficiency of the first laser is at least 25%.
48. The method of claim 46 , wherein the laser operation is selected from the group consisting of cutting, heat treating, thermal processing, annealing, advancing a borehole, workover and completion, removing material, cleaning, milling, flow assurance, decommissioning, plugging, abandonment and perforating.