Substrate processing apparatus
An embodiment of the present invention provides a buff process module. The buff process module includes: a buff table on which a processing target object is mounted; a buff head that holds a buff pad for applying a predetermined process to the processing target object; a buff arm that supports and swings the buff head; a dresser for dressing the buff pad; and a cleaning mechanism that is disposed between the buff table and the dresser and is for cleaning the buff pad.
1. A conditioner comprising a dresser for dressing a buff pad of a buff process module, the buff process module comprising a buff table configured to hold a wafer, and a buff head configured to hold the buff pad and to buff-processes the wafer,
the dresser further comprising a dresser cleaning mechanism configured to jet a cleaning liquid to the dresser to clean the dresser, wherein a surface of the dresser is at a lower position than a position of a buff table disposed adjacent to the dresser.
2. The conditioner according to claim 1 , wherein the dresser cleaning mechanism jets the cleaning liquid in a direction away from the buff table.
3. The conditioner according to claim 1 , wherein a cover for preventing the cleaning liquid from dispersing is disposed between the dresser and the buff table.
4. The conditioner according to claim 3 , wherein the cover includes a contact avoiding mechanism that avoids contact with the swinging buff pad.
5. The conditioner according to claim 4 , wherein the contact avoiding mechanism includes a cover moving mechanism configured to move the cover in an axial direction of a rotation axis of the dresser or the buff table.
6. The conditioner according to claim 4 ,
wherein the cover includes a substantially cylindrical cover that covers at least a part of a periphery of the dresser, or a periphery of the buff table, and
the contact avoiding mechanism includes a notch formed at at least a part of the substantially cylindrical cover for allowing the buff pad to pass, and a rotational drive mechanism configured to rotate the cover concentrically with a rotation axis of the dresser or the buff table.
7. The conditioner according to claim 6 , wherein the contact avoiding mechanism includes a movable cover member for opening and closing the notch.
8. The conditioner according to claim 7 , wherein the movable cover member is movable along a circumferential direction or a central axial direction with respect to the cover.
9. The conditioner according to claim 1 , further comprising an air curtain forming mechanism configured to form an air curtain in a space between the buff table and this mechanism.
10. The conditioner according to claim 1 , further comprising a locally exhausted state forming mechanism configured to form a locally exhausted state around the dresser.
11. The conditioner according to claim 1 , wherein the cleaning liquid is a liquid including at least any one selected from a group consisting of deionized water, a chemical solution and a slurry, or a mixture of the liquid and compressed air.
12. The conditioner according to claim 11 , wherein supply of each type of the liquid is switchable.
13. The conditioner according to claim 1 , wherein the cleaning liquid is a high pressure cleaning fluid.
14. A buff process module, comprising: the conditioner according to claim 1 ; a buff table configured to hold a wafer; and a buff head configured to hold a buff pad and to buff-processes the wafer,
wherein if a cover for preventing the cleaning liquid from dispersing is fixedly provided between the dresser and the buff table, the buff head is movable in a direction of a rotation axis of the dresser or a rotation axis of the wafer, and the buff head is movable between the conditioner and the buff table in a state of being moved to a higher position than a position of the cover.
15. The buff process module according to claim 14 , wherein a buff table cover is provided at at least a part of a periphery of the buff table.
16. The buff process module according to claim 14 , further comprising a descending air current generating mechanism configured to generate a descending air current from above the buff table.
17. A dresser rinsing method of cleaning a dresser in a conditioner, the conditioner including the dresser, the dresser being for dressing a buff pad of a buff process module, the buff process module comprising a buff table configured to hold a wafer, and a buff head configured to hold the buff pad and to buff-processes the wafer, the method comprising:
providing a dresser cleaning mechanism configured to jet a cleaning liquid to the dresser to clean the dresser; disposing a surface of the dresser at a lower position than a position of a buff table disposed adjacent to the dresser, and jetting the cleaning liquid from the dresser cleaning mechanism to the dresser.
18. The method according to claim 17 , wherein the jetting of the cleaning liquid to the dresser is performed in parallel with a process to a substrate on the buff table.
19. The method according to claim 17 , wherein a predetermined cover is provided at least at a part of a periphery of the dresser or a periphery of the buff table, and when the buff pad is moved between the buff table and the dresser, a contact avoiding mechanism is operated to avoid contact between the buff pad and the cover.
20. The method according to claim 17 , wherein the method performs at least any one of forming an air curtain between the buff table and the dresser, forming a locally exhausted state around the dresser, and forming a descending air current from above the buff table, at a same time of jetting the cleaning liquid to the dresser.