IP Library Granted Patent US 10,204,898
Granted Patent B2
US 10,204,898 · App. 14/817,242 · Granted Feb 12, 2019

Semiconductor device and electronic device

Inventors: Junpei Momo (Kanagawa, JP); Kazutaka Kuriki (Kanagawa, JP); Hiromichi Godo (Kanagawa, JP)
Assignee: Semiconductor Energy Laboratory Co., Ltd.
H01L27/0629H01G11/14H01L29/66742H01L29/786H01G11/08H01L21/8258H01L27/0688Y02E60/13
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Quick Facts
Patent No.
US 10,204,898
App. No.
14/817,242
Granted
Feb 12, 2019
Kind
B2
Abstract

A semiconductor device in which a circuit and a power storage element are efficiently placed is provided. The semiconductor device includes a first transistor, a second transistor, and an electric double-layer capacitor. The first transistor, the second transistor, and the electric double-layer capacitor are provided over one substrate. A band gap of a semiconductor constituting a channel region of the second transistor is wider than a band gap of a semiconductor constituting a channel region of the first transistor. The electric double-layer capacitor includes a solid electrolyte.

Claims (43)

1. A semiconductor device comprising:

a first transistor comprising a first gate electrode, a first source electrode, and a first drain electrode;

a first insulating film over each of the first gate electrode, the first source electrode, and the first drain electrode;

an electric double-layer capacitor over the first insulating film;

a second insulating film over the electric double-layer capacitor; and

a second transistor over the second insulating film;

wherein the first transistor, the second transistor, and the electric double-layer capacitor are provided over one substrate,

wherein the first transistor includes a first semiconductor in a channel region,

wherein the second transistor includes a second semiconductor in a channel region,

wherein a band gap of the second semiconductor is wider than a band gap of the first semiconductor,

wherein one of a source and a drain of the second transistor is electrically connected to a current collector of the electric double-layer capacitor, and

wherein the electric double-layer capacitor includes a solid electrolyte.

2. The semiconductor device according to claim 1 ,

wherein the first semiconductor includes silicon, and

wherein the second semiconductor includes an oxide semiconductor.

3. The semiconductor device according to claim 1 , wherein the electric double-layer capacitor is capable of being charged wirelessly.

4. The semiconductor device according to claim 1 , wherein the substrate is a semiconductor substrate.

5. The semiconductor device according to claim 1 , wherein the substrate is a flexible substrate.

6. An electronic device comprising:

the semiconductor device according to claim 1 ; and

at least one of a microphone, a speaker, a display portion, and an operation key.

7. A semiconductor device comprising:

a first transistor comprising a first gate electrode, a first source electrode, and a first drain electrode;

a first insulating film over each of the first gate electrode, the first source electrode, and the first drain electrode;

an electric double-layer capacitor over the first insulating film;

a second insulating film over the electric double-layer capacitor; and

a second transistor over the second insulating film;

wherein the first transistor, the second transistor, and the electric double-layer capacitor are provided over one substrate,

wherein the first transistor includes a first semiconductor in a channel region,

wherein the second transistor includes a second semiconductor in a channel region,

wherein one of a source and a drain of the second transistor is electrically connected to a current collector of the electric double-layer capacitor, and

wherein a band gap of the second semiconductor is wider than a band gap of the first semiconductor.

8. The semiconductor device according to claim 7 ,

wherein the first semiconductor includes silicon, and

wherein the second semiconductor includes an oxide semiconductor.

9. The semiconductor device according to claim 7 , wherein the electric double-layer capacitor is capable of being charged wirelessly.

10. The semiconductor device according to claim 7 , wherein the substrate is a semiconductor substrate.

11. The semiconductor device according to claim 7 , wherein the substrate is a flexible substrate.

12. An electronic device comprising:

the semiconductor device according to claim 7 ; and

at least one of a microphone, a speaker, a display portion, and an operation key.

13. The semiconductor device according to claim 7 ,

wherein one of the first source electrode and the first drain electrode is electrically connected to the current collector of the electric double-layer capacitor.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 31, 2015
From: MOMO, JUNPEI; KURIKI, KAZUTAKA; GODO, HIROMICHI
To: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Reel/Frame 036455/0901 →
Priority Claims (1)
JP 2014-162455 · Aug 8, 2014 · national
Continuity (1)
Related Publication 20160043070A1 · Feb 11, 2016
Cited By (1)
US 12,402,363